Curable resin material, resin molded body, and method for producing resin molded body
US-2024376250-A1 · Nov 14, 2024 · US
US2025163269A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2025163269-A1 |
| Application number | US-202418426971-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 30, 2024 |
| Priority date | Nov 22, 2023 |
| Publication date | May 22, 2025 |
| Grant date | — |
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A resin composition is provided. The resin composition comprises: (A) an epoxy resin; (B) a maleimide-triazine resin; and (C) a first flame retardant having a structure of formula (I): wherein, Ar is a C 3 to C 18 heteroaryl or a C 6 to C 18 aryl; R 1 is H or a C 1 to C 18 alkyl; and R 2 and R 3 are independently H, a C 1 to C 18 alkyl, a C 3 to C 18 heteroaryl, or a C 6 to C 18 aryl.
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What is claimed is: 1 . A resin composition, which comprises: (A) an epoxy resin; (B) a maleimide-triazine resin; and (C) a first flame retardant having a structure of formula (I): wherein, Ar is a C 3 to C 18 heteroaryl or a C 6 to C 18 aryl; R 1 is H or a C 1 to C 18 alkyl; and R 2 and R 5 are independently H, a C 1 to C 18 alkyl, a C 3 to C 18 heteroaryl, or a C 6 to C 18 aryl. 2 . The resin composition of claim 1 , wherein the weight ratio of the first flame retardant (C) to the maleimide-triazine resin (B) is 1:6 to 5:2. 3 . The resin composition of claim 1 , wherein the epoxy resin (A) is selected from the group consisting of a bisphenol epoxy resin, a phenolic epoxy resin, a diphenylethylene epoxy resin, a triazine skeleton-containing epoxy resin, a fluorene skeleton-containing epoxy resin, a triphenol methane epoxy resin, a xylylene epoxy resin, a biphenyl epoxy resin, a biphenyl aralkyl epoxy resin, a naphthalene epoxy resin, a dicyclopentadiene (DCPD) epoxy resin, an alicyclic epoxy resin, and combinations thereof. 4 . The resin composition of claim 1 , wherein the maleimide-triazine resin (B) is obtained by reacting a maleimide compound with a cyanate ester compound. 5 . The resin composition of claim 4 , wherein the maleimide compound is a bismaleimide compound. 6 . The resin composition of claim 4 , wherein the cyanate ester compound is a compound having two or more cyanate groups. 7 . The resin composition of claim 6 , wherein the cyanate ester compound is an aromatic compound having two or more cyanate groups directly bonded to aromatic ring(s). 8 . The resin composition of claim 1 , wherein the first flame retardant (C) is selected from the group consisting of and combinations thereof. 9 . The resin composition of claim 1 , further comprising a curing agent selected from the group consisting of a cyanate ester resin, a benzoxazine resin, a phenol novolac (PN) resin, a styrene maleic anhydride (SMA) resin, dicyandiamide (Dicy), diaminodiphenyl sulfone (DDS), an amino triazine novolac (ATN) resin, diaminodiphenylmethane, a styrene-vinylphenol copolymer, and combinations thereof. 10 . The resin composition of claim 1 , further comprising a curing accelerator selected from the group consisting of an imidazole compound, a pyridine compound, and a combination thereof. 11 . The resin composition of claim 1 , further comprising an elastomer selected from the group consisting of polybutadiene, a styrene-butadiene copolymer, a styrene-butadiene-divinylbenzene copolymer, polyisoprene, a styrene-isoprene copolymer, an acrylonitrile-butadiene copolymer, an acrylonitrile-butadiene-styrene copolymer, a functional modified derivative of the preceding compounds, and combinations thereof. 12 . The resin composition of claim 1 , further comprising a filler selected from the group consisting of silica, aluminum oxide, magnesium oxide, magnesium hydroxide, calcium carbonate, talc, clay, aluminum nitride, boron nitride, aluminum hydroxide, silicon aluminum carbide, silicon carbide, sodium carbonate, titanium dioxide, zinc oxide, zirconium oxide, quartz, diamond, diamond-like carbon, graphite, calcined kaolin, pryan, mica, hydrotalcite, polytetrafluoroethylene (PTFE) powders, glass beads, ceramic whiskers, carbon nanotubes, nanosized inorganic powders, and combinations thereof. 13 . A prepreg, which is prepared by impregnating a substrate with the resin composition of claim 1 or by coating the resin composition of claim 1 onto a substrate and drying the impregnated or coated substrate. 14 . A metal-clad laminate, which is prepared by laminating the prepreg of claim 13 and a metal foil. 15 . A printed circuit board, which is prepared from the metal-clad laminate of claim 14 . 16 . A metal-clad laminate, which is prepared by coating the resin composition of claim 1 onto a metal foil and drying the coated metal foil. 17 . A printed circuit board, which is prepared from the metal-clad laminate of claim 16 .
Wear resistance · CPC title
Tear resistant · CPC title
Permeability to liquids, absorption · CPC title
Flame resistant or retardant, fire resistant or retardant · CPC title
Dimensional stability · CPC title
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