Waveguide device

Patent metadata

Field	Value
Publication number	US-2025158263-A1
Application number	US-202519023830-A
Country	US
Kind code	A1
Filing date	Jan 16, 2025
Priority date	Jul 22, 2022
Publication date	May 15, 2025
Grant date	—

Abstract

A waveguide device is configured to guide an electromagnetic wave having a frequency of 30 GHz or more and 20 THz or less. The waveguide device includes: a resin material substrate; a conductor layer provided on the resin material substrate; and a support substrate positioned on a side opposite from the conductor layer with respect to the resin material substrate. The resin material substrate and the support substrate are directly joined to each other.

First claim

What is claimed is:

1 . A waveguide device configured to guide an electromagnetic wave having a frequency of 30 GHz or more and 20 THz or less, the waveguide device comprising:
a resin material substrate; a conductor layer disposed on the resin material substrate; and a support substrate disposed on a side opposite from the conductor layer with respect to the resin material substrate, wherein the resin material substrate and the support substrate are directly joined to each other.

2 . The waveguide device according to claim 1 , further comprising a first ground electrode disposed between the resin material substrate and the support substrate.

3 . The waveguide device according to claim 2 , wherein the first ground electrode is in direct contact with the resin material substrate and the support substrate and joins the resin material substrate and the support substrate to each other.

4 . The waveguide device according to claim 2 ,
wherein the first ground electrode is in direct contact with the resin material substrate, and wherein the waveguide device further comprises a joining portion that joins the first ground electrode and the support substrate to each other.

5 . The waveguide device according to claim 2 ,
wherein the first ground electrode is in direct contact with the support substrate, and wherein the waveguide device further comprises a joining portion that joins the resin material substrate and the first ground electrode to each other.

6 . The waveguide device according to claim 2 , wherein the conductor layer includes:
a signal electrode which forms a transmission line configured to propagate the electromagnetic wave; and a second ground electrode disposed at a distance from the signal electrode.

7 . The waveguide device according to claim 6 , further comprising:
a third ground electrode positioned on a side opposite from the first ground electrode with respect to the support substrate; a first via which electrically connects the second ground electrode and the third ground electrode, and which is electrically connected to the first ground electrode; and a second via which electrically connects the first ground electrode and the second ground electrode, wherein the first via includes a plurality of first vias, and wherein the second via is arranged between two first vias adjacent to each other out of the plurality of first vias.

8 . The waveguide device according to claim 6 , further comprising:
a third ground electrode positioned on a side opposite from the first ground electrode with respect to the support substrate; and a plurality of through-substrate vias for electrically connecting the first ground electrode and the third ground electrode, wherein the first ground electrode, the third ground electrode, and the plurality of through-substrate vias form a substrate-integrated waveguide configured to propagate the electromagnetic wave.

9 . The waveguide device according to claim 1 , wherein the resin material substrate has a thickness “t” which satisfies Formula (1):

t
<

λ

a
⁢

ε

(
1
)

where “t” represents the thickness of the resin material substrate, λ represents a wavelength of the electromagnetic wave guided by the waveguide device, c represents a relative dielectric constant of the resin material substrate at 150 GHz, and “a” represents a numerical value of 3 or more.

10 . The waveguide device according to claim 9 , wherein, in Formula (1), “a” represents a numerical value of 6 or more.

11 . The waveguide device according to claim 1 , wherein the resin material substrate has a thickness “t” which is 100 μm or less.

12 . The waveguide device according to claim 1 , wherein the resin material substrate has a thickness “t” which is 1 μm or more.

13 . The waveguide device according to claim 1 , further comprising a joining portion disposed between the resin material substrate and the support substrate,
wherein the joining portion is a SiO 2 layer, an amorphous silicon layer, or a tantalum oxide layer.

Assignees

• Ngk Insulators Ltd

Inventors

• Tani Kentaro
• Kondo Jungo

Classifications

• H01P5/107

  Hollow-waveguide/strip-line transitions · CPC title

• H01P3/121

  integrated in a substrate · CPC title

• H01P3/006

  Conductor backed coplanar waveguides · CPC title

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title