Tags provided with near field communication (nfc) chips and sensors

Patent metadata

Field	Value
Publication number	US-2025148253-A1
Application number	US-202318728014-A
Country	US
Kind code	A1
Filing date	Feb 9, 2023
Priority date	Feb 23, 2022
Publication date	May 8, 2025
Grant date	—

Abstract

The present invention refers to a method for producing an integrated circuit comprising a Near Field Communication (NFC) chip, a sensor and an antenna, wherein the method comprises the steps of providing an intermediate circuit comprising the NFC chip connected the sensor, for instance a biosensor, and of providing a single side inlay comprising a substrate and the antenna. Afterwards, the intermediate circuit and the single side inlay are mated together so as to connect the NFC chip to the antenna. The present invention also refers to the integrated circuit or tag produced according to this method.

First claim

1 . A method for producing an integrated circuit comprising a Near Field Communication (NFC) chip, a sensor and an antenna, said method comprising the following steps:
a) Providing an intermediate circuit comprising said NFC chip and said sensor, for instance a biosensor, wherein said NFC chip and said sensor are connected together; b) Providing a single side inlay comprising a substrate and said antenna; c) Afterwards, mating said intermediate circuit and said single side inlay so as to connect said NFC chip to said antenna.

2 . The method according to claim 1 , wherein said intermediate circuit comprises a single side construction.

3 . The method according to claim 1 , wherein said antenna is connected to said intermediate circuit by direct soldering.

4 . The method according to claim 1 , wherein said antenna is connected to said intermediate circuit by conductive glue.

5 . The method according to claim 1 , wherein said intermediate circuit comprises a double side construction and said antenna is inductively coupled to said intermediate circuit.

6 . The method according to claim 1 , wherein said antenna comprises an etched antenna.

7 . The method according to claim 1 , wherein said antenna comprises a wire-embedded antenna.

8 . The method according to claim 1 , wherein said intermediate circuit further comprises a sensor substrate and said NFC chip is connected to said sensor substrate by flip-chip technology.

9 . The method according to claim 1 , wherein said intermediate circuit has a width (W) of 19 mm and a length (L) of 35 mm.

10 . The method according to claim 1 , wherein said method is carried out by a reel-to-reel process.

11 . The method according to claim 7 , wherein said step b) is carried out by forming said single side inlay on a panel.

12 . A kit of components comprising:
a first component including an intermediate circuit comprising a Near Field Communication (NFC) chip and a sensor, and a second component including a single side inlay comprising a substrate and an antenna; wherein said first component and said second component are separate components.

13 . The kit of components according to claim 12 , wherein said first component is a reel comprising a plurality of intermediate circuits and/or said second component is a reel comprising a plurality of single side inlays.

14 . The kit of components according to claim 13 , wherein said antenna is a wire-embedded antenna and said second component is a panel comprising a plurality of single side inlays.

15 . The integrated circuit produced by the method comprising the following steps:
a) Providing an intermediate circuit comprising a Near Field Communication (NFC) chip and a sensor, for instance a biosensor, wherein said NFC chip and said sensor are connected together; b) Providing a single side inlay comprising a substrate and an antenna; c) Afterwards, mating said intermediate circuit and said single side inlay so as to connect said NFC chip to said antenna.

16 . The integrated circuit according to claim 15 , wherein said intermediate circuit comprises a single side construction.

17 . The integrated circuit according to claim 15 , wherein said antenna is connected to said intermediate circuit by direct soldering.

18 . The integrated circuit according to claim 15 , wherein said antenna is connected to said intermediate circuit by conductive glue.

19 . The integrated circuit according to claim 15 , wherein said intermediate circuit comprises a double side construction and said antenna is inductively coupled to said intermediate circuit

20 . The integrated circuit according to claim 15 , wherein said antenna comprises an etched antenna.

Assignees

• Linxens Holding

Inventors

• Germain Francois
• Vassal Simon

Classifications

• G06K19/0775

  arrangements for connecting the integrated circuit to the antenna · CPC title

• G06K19/07747

  at least one of the integrated circuit chips being mounted as a module · CPC title

• G06K19/0723

  the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs · CPC title

• G06K19/0716 Primary

  at least one of the integrated circuit chips comprising a sensor or an interface to a sensor · CPC title

• G06K19/07794

  the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit · CPC title