Coil carrier board and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2025142728-A1
Application number	US-202418927787-A
Country	US
Kind code	A1
Filing date	Oct 25, 2024
Priority date	Oct 27, 2023
Publication date	May 1, 2025
Grant date	—

Abstract

Provided is a coil carrier board, including a base coil layer, a conductive layer stacked on and bonded to the base coil layer, at least one build-up coil layer stacked on and bonded to the conductive layer, and an opening connecting the base coil layer, the conductive layer and the build-up coil layer. The coil carrier board has thick copper, fine line spacing and appropriate rigidity by means of the build-up circuit process and the structural design of the insulating layer of a photosensitive dielectric material bonded with a thermosetting dielectric material. Accordingly, the high current-carrying efficiency of the coil carrier board is enhanced, and the overall structure of the coil carrier board has better flatness, rigidity and high interlayer alignment accuracy, thereby facilitating miniaturization and automated assembly production.

First claim

What is claimed is:

1 . A coil carrier board, comprising:
a base coil layer including a base planar spiral coil made of metal material and having a first upper surface and a first lower surface opposing the first upper surface, and a first insulating layer having a second upper surface and a second lower surface opposing the second upper surface and covering the base planar spiral coil, wherein the first upper surface of the base planar spiral coil is exposed from the second upper surface of the first insulating layer, and the first lower surface of the base planar spiral coil is exposed from the second lower surface of the first insulating layer; a conductive layer stacked on and bonded to the base coil layer, including:
a conductor made of metal material having a first upper end surface and a first lower end surface opposing the first upper end surface, and
a second insulating layer having a third upper surface and a third lower surface opposing the third upper surface and covering the conductor, wherein the first upper end surface of the conductor is exposed from the third upper surface of the second insulating layer, the first lower end surface of the conductor is bonded to the first upper surface of the base planar spiral coil, a composition of the second insulating layer is different from that of the first insulating layer, the third lower surface of the second insulating layer is stacked on and bonded to the second upper surface of the first insulating layer, and the second insulating layer covers the first upper surface of the base planar spiral coil;
at least one build-up coil layer stacked on and bonded to the conductive layer, including:
a build-up planar spiral coil made of metal material and having a fourth upper surface and a fourth lower surface opposing the fourth upper surface, and
a third insulating layer having a fifth upper surface and a fifth lower surface opposing the fifth upper surface and covering the build-up planar spiral coil, wherein the fourth lower surface of the build-up planar spiral coil is bonded to the third upper surface of the second insulating layer, the fourth upper surface of the build-up planar spiral coil and a side circumference thereof are covered by at least one electroplated growth layer formed by metal material, and the fifth lower surface of the third insulating layer is stacked on and bonded to the third upper surface of the second insulating layer; and
an opening penetrating the base coil layer, the conductive layer, and the build-up coil layer.

2 . The coil carrier board of claim 1 , wherein the at least one build-up coil layer is a multiple-layer stacked build-up coil layer, and each third insulating layer in a relatively lower layer of the build-up coil layer further includes at least one conductor having the same composition as the build-up planar spiral coil and connecting the build-up planar spiral coil that is below the conductor to the build-up planar spiral coil that is above the conductor.

3 . The coil carrier board of claim 1 , wherein a relatively uppermost layer of the build-up coil layer further includes at least one external electrical connection pad having the same composition as the build-up planar spiral coil and disposed within the third insulating layer, wherein an upper surface of the external electrical connection pad is exposed from the fifth upper surface of the third insulating layer of the relatively uppermost layer of the build-up coil layer.

4 . The coil carrier board of claim 2 , wherein a relatively uppermost layer of the build-up coil layer further includes at least one external electrical connection pad having the same composition as the build-up planar spiral coil and disposed within the third insulating layer in the relatively uppermost layer, wherein an upper surface of the external electrical connection pad is exposed from the fifth upper surface of the third insulating layer of the relatively uppermost layer of the build-up coil layer.

5 . The coil carrier board of claim 1 , wherein the second lower surface of the first insulating layer is further bonded to a lower insulating layer including an insulating material.

6 . The coil carrier board of claim 2 , wherein the second lower surface of the first insulating layer is further bonded to a lower insulating layer including an insulating material.

7 . The coil carrier board of claim 1 , wherein the first insulating layer includes a photosensitive dielectric material, and the second insulating layer and/or the third insulating layer include(s) a thermosetting dielectric material.

8 . The coil carrier board of claim 1 , wherein the base planar spiral coil, the conductor of metal material, the build-up planar spiral coil and/or the electroplated growth layer include(s) copper or a copper alloy.

9 . The coil carrier board of claim 1 , wherein compositions of the electroplated growth layer and the build-up planar spiral coil are the same or different.

10 . The coil carrier board of claim 1 , wherein the first upper surface of the base planar spiral coil protrudes from, is flush with, or is recessed into the second upper surface of the first insulating layer.

11 . A method of manufacturing a coil carrier board, comprising:
step 1, providing a carrier board having a metallic surface; step 2, forming a first insulating layer having patterned plurality of openings on the carrier board; step 3, forming a base planar spiral coil by electroplating in the patterned plurality of openings, wherein an upper surface of the base planar spiral coil is exposed from an upper surface of the first insulating layer; step 4, forming a second insulating layer on the first insulating layer and the base planar spiral coil, wherein the second insulating layer covers an upper surface of the base planar spiral coil, and a composition of an insulating material of the second insulating layer is different from that of an insulating material of the first insulating layer; step 5, forming at least one aperture in an upper surface of the second insulating layer to expose a portion of the upper surface of the base planar spiral coil; step 6, performing a surface metallization process to form a metallized surface on the upper surface of the second insulating layer and within the aperture; step 7, forming a build-up planar spiral coil on the second insulating layer and forming a conductor in the aperture for connecting the build-up planar spiral coil to the base planar spiral coil by electroplating on the metallized surface of the second insulating layer and the aperture by means of a patterned exposure developing process, wherein the build-up planar spiral coil and the conductor are of the same composition; step 8, performing an etching process to remove a material of the metallized surface on the second insulating layer that is not covered by the build-up planar spiral coil; step 9, forming an electroplated growth layer on exposed surfaces of the build-up planar spiral coil by performing an electroplating process to make the build-up planar spiral coil taller, wider and shorter in line pitch, wherein the number of repetitions of step 9 can be increased optionally to form a stack of a plurality of electroplated growth layers; step 10, forming a third insulating layer on the second insulating layer to cover the second insulating layer and the build-up planar spiral coil; step 11, removing the carrier board to expose a lower surface of the base planar spiral coil and a lower surface of the first insulating layer; and step 12, forming a through hole through the first insulating layer, the second insulating layer and the third insulating layer to form an opening.

Assignees

• Phoenix Pioneer Technology Co Ltd

Inventors

• Hsu Che-Wei
• Hu Wen-Hung
• Hsu Shih-Ping

Classifications

• H05K3/4644

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title

• H05K1/165 Primary

  incorporating printed inductors · CPC title

• H05K3/10

  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title