Sensor device package and image display device including the same

US2025138683A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025138683-A1
Application numberUS-202418925196-A
CountryUS
Kind codeA1
Filing dateOct 24, 2024
Priority dateOct 25, 2023
Publication dateMay 1, 2025
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A sensor device package includes a sensor device including touch sensing electrodes and an antenna unit, and a circuit board bonded to the sensor device. The circuit board includes a core layer including a first surface and a second surface which face each other, a first conductive layer including first touch sensor signal lines and a first antenna signal line distributed at the same level on the first surface, a second conductive layer including second touch sensor signal lines and a second antenna signal line distributed at the same level on the second surface, an antenna via structure which penetrates the core layer to connect the first antenna signal line and the second antenna signal line with each other, and a touch sensor via structure which penetrates the core layer to connect the first touch sensor signal lines and the second touch sensor signal lines to each other, respectively.

First claim

Opening claim text (preview).

What is claimed is: 1 . A sensor device package comprising: a sensor device including touch sensing electrodes and an antenna unit; and a circuit board bonded to the sensor device, the circuit board comprising: a core layer comprising a first surface and a second surface which face each other; a first conductive layer comprising first touch sensor signal lines and a first antenna signal line which are distributed at the same level on the first surface of the core layer; a second conductive layer comprising second touch sensor signal lines and a second antenna signal line which are distributed at the same level on the second surface of the core layer; an antenna via structure which penetrates the core layer to connect the first antenna signal line and the second antenna signal line with each other; and a touch sensor via structure penetrating the core layer to connect each of the first touch sensor signal lines and the second touch sensor signal lines with each other. 2 . The sensor device package according to claim 1 , wherein the sensor device further comprises touch sensor pads electrically connected with the touch sensing electrodes and an antenna pad electrically connected with the antenna unit; the first touch sensor signal lines of the circuit board are bonded to the touch sensor pads respectively; and the first antenna signal line of the circuit board is bonded to the antenna pad. 3 . The sensor device package according to claim 2 , wherein the touch sensor pads and the antenna pad are arranged at one end of the sensor device to form a single pad row. 4 . The sensor device package according to claim 3 , wherein the sensor device further comprises a blocking pad which is included in the single pad row and inserted between adjacent touch sensor pads of the touch sensor pads, or a guard pad disposed at an end of the single pad row. 5 . The sensor device package according to claim 4 , wherein the sensor device further comprises: traces which connect the touch sensing electrodes and the touch sensor pads with each other; and a blocking line which extends from the blocking pad between adjacent traces of the traces. 6 . The sensor device package according to claim 4 , wherein the sensor device further comprises a guard line of a loop shape, which extends from the guard pad and surrounds the touch sensing electrodes. 7 . The sensor device package according to claim 3 , further comprising one anisotropic conductive film which bonds the single pad row and the first conductive layer of the circuit board. 8 . The sensor device package according to claim 2 , wherein the antenna unit comprises a radiator and a transmission line which extends from the radiator to be connected to the antenna pad. 9 . The sensor device package according to claim 8 , wherein a plurality of antenna units are arranged in a row direction, and the antenna pads are independently connected to each of the antenna units. 10 . The sensor device package according to claim 9 , wherein the transmission lines connected to each of the plurality of antenna units have a bent line shape and have the same length. 11 . The sensor device package according to claim 9 , wherein at least one touch sensor pad of the touch sensor pads is arranged between the antenna pads connected to adjacent antenna units of the antenna units. 12 . The sensor device package according to claim 1 , further comprising: a touch sensor driving circuit/touch sensor connection structure electrically connected with the second touch sensor signal lines on the second surface of the core layer; and an antenna driving circuit/antenna connection structure electrically connected with the second antenna signal line on the second surface of the core layer. 13 . The sensor device package according to claim 12 , wherein the antenna driving circuit/antenna connection structure comprises an antenna driving integrated circuit chip or an antenna connector, and the touch sensor driving circuit/touch sensor connection structure comprises a touch sensor driving integrated circuit chip or a touch sensor connector. 14 . The sensor device package according to claim 1 , wherein the circuit board further comprises a mid-ground layer disposed between the first conductive layer and the second conductive layer in the core layer. 15 . The sensor device package according to claim 14 , wherein the antenna via structure and the touch sensor via structure are electrically separated from the mid-ground layer and penetrate the mid-ground layer. 16 . The sensor device package according to claim 1 , wherein the sensor device further comprises a substrate layer, wherein the touch sensing electrodes and the antenna unit are arranged together at the same level on the upper surface of the substrate layer. 17 . The sensor device package according to claim 16 , wherein the substrate layer comprises an active area where the touch sensing electrodes are distributed and a peripheral area surrounding the active area, wherein the antenna unit is partially disposed on the active area. 18 . An image display device comprising: a display panel; and the sensor device package according to claim 1 .

Assignees

Inventors

Classifications

  • Adaptation for use in or on movable bodies (H01Q1/08, H01Q1/12, H01Q1/18 take precedence) · CPC title

  • Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads · CPC title

  • Digitisers structurally integrated in a display · CPC title

  • using a single layer of sensing electrodes · CPC title

  • using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes · CPC title

Patent family

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Frequently asked questions

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What does patent US2025138683A1 cover?
A sensor device package includes a sensor device including touch sensing electrodes and an antenna unit, and a circuit board bonded to the sensor device. The circuit board includes a core layer including a first surface and a second surface which face each other, a first conductive layer including first touch sensor signal lines and a first antenna signal line distributed at the same level on t…
Who is the assignee on this patent?
Dongwoo Fine Chem Co Ltd
What technology area does this patent fall under?
Primary CPC classification G06F3/04164. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu May 01 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).