Wireless measurement of suture tension

US2025127457A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025127457-A1
Application numberUS-202218682599-A
CountryUS
Kind codeA1
Filing dateAug 9, 2022
Priority dateAug 9, 2021
Publication dateApr 24, 2025
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Certain examples of the disclosure concern an implantable sensor. The implantable sensor includes a sensor assembly configured to connect to a suture. The sensor assembly also includes a substrate and a resonant circuit coupled to the substrate. The resonant circuit is configured to electrically resonate at a resonant frequency when exposed to a first electromagnetic field and to emit a second remotely detectable electromagnetic field. The substrate is configured to deform in response to a tensile force applied by the suture and to change a resonant parameter of the resonant circuit in response to the deformation.

First claim

Opening claim text (preview).

1 - 113 . (canceled) 114 . An implantable sensor, comprising: a sensor body configured to connect to a suture; and a resonant circuit embedded within the sensor body, wherein the resonant circuit is configured to electrically resonate at a resonant frequency when exposed to a first electromagnetic field and to emit a second remotely detectable electromagnetic field; wherein a deformation of the sensor body in response to a tensile force applied by the suture is configured to change a resonant parameter of the resonant circuit in response to the deformation. 115 . The implantable sensor of claim 114 , wherein the sensor body comprises a biodegradable material. 116 . The implantable sensor of claim 114 , wherein the sensor body comprises a top portion, a base portion, and one or more legs connecting the top portion to the base portion, wherein the top portion comprises a first layer and a second layer, wherein the resonant circuit is disposed between the first layer and the second layer. 117 . The implantable sensor of claim 116 , wherein the resonant circuit is printed on a substrate sandwiched between the first layer and the second layer, wherein the substrate is biodegradable. 118 . The implantable sensor of claim 116 , wherein the base portion comprises a conductive layer or another resonant circuit. 119 . The implantable sensor of claim 118 , wherein the conductive layer is biodegradable. 120 . The implantable sensor of claim 114 , wherein the sensor body comprises a coupling mechanism configured to receive the suture. 121 . The implantable sensor of claim 114 , wherein the resonant circuit comprises an inductor coil, wherein the resonant frequency of the resonant circuit is determined at least in part by an inductance of the inductor coil and an inherent parasitic capacitance of the inductor coil. 122 . The implantable sensor of claim 121 , wherein the deformation of the sensor body is configured to change the inductance of the inductor coil or the parasitic capacitance. 123 . The implantable sensor of claim 114 , further comprising the suture connected to the sensor body. 124 . The implantable sensor of claim 123 , wherein the suture comprises a conductive polymer. 125 . An implantable sensor, comprising: a sensor assembly configured to connect to a suture, wherein the sensor assembly includes a substrate and a resonant circuit coupled to the substrate; wherein the resonant circuit is configured to electrically resonate at a resonant frequency when exposed to a first electromagnetic field and to emit a second remotely detectable electromagnetic field; wherein the substrate is configured to deform in response to a tensile force applied by the suture and to change a resonant parameter of the resonant circuit in response to the deformation. 126 . The implantable sensor of claim 125 , wherein the resonant circuit comprises at least one inductor connected to at least one capacitor, wherein the resonant frequency of the resonant circuit is determined at least by an inductance of the at least one inductor and a capacitance of the at least one capacitor. 127 . The implantable sensor of claim 126 , wherein the resonant circuit further comprises a resistive transducer having a resistance that varies in response to a deformation of the resistive transducer caused by the deformation of the substrate. 128 . The implantable sensor of claim 126 , wherein the deformation of the substrate is configured to change the inductance of the at least one inductor or the capacitance of the at least one capacitor, thereby changing the resonant frequency of the resonant circuit. 129 . The implantable sensor of claim 126 , wherein the resonant circuit comprises a resistive transducer having a resistance that varies in response to the deformation; wherein the resonant circuit has a resonance quality factor determined at least by an inductance of the at least one inductor, a capacitance of the at least one capacitor, and the resistance of the resistive transducer; wherein the deformation of the substrate is configured to deform the resistive transducer, thereby changing the resistance of the resistive transducer and the resonance quality factor of the resonant circuit. 130 . The implantable sensor of claim 125 , wherein the substrate comprises an enclosure enclosing the resonant circuit; wherein the resonant circuit comprises at least one inductor and at least one capacitor, wherein the resonant circuit has a resonant frequency determined at least in part by an inductance of the at least one inductor and a capacitance of the at least one capacitor; wherein the enclosure is configured to deform in response to the tensile force applied by the suture; wherein the deformation of the enclosure is configured to change the inductance of the at least one inductor and/or the capacitance of the at least one capacitor, thereby changing the resonant frequency of the resonant circuit. 131 . The implantable sensor of claim 125 , wherein the substrate comprises an enclosure enclosing the resonant circuit; wherein the resonant circuit comprises at least one inductor, at least one capacitor, and a resistive transducer having a resistance that varies in response to the deformation; wherein the resonant circuit has a resonance quality factor determined at least by an inductance of the at least one inductor, a capacitance of the at least one capacitor, and the resistance of the resistive transducer; wherein the enclosure is configured to deform in response to the tensile force applied by the suture; wherein the deformation of the enclosure is configured to deform the resistive transducer, thereby changing the resistance of the resistive transducer and the resonance quality factor of the resonant circuit. 132 . The implantable sensor of claim 125 , wherein the resonant circuit comprises at least one inductor, at least one capacitor, and a resistive transducer having a resistance that varies in response to the deformation; wherein the resonant circuit has a resonance quality factor determined at least by an inductance of the at least one inductor, a capacitance of the at least one capacitor, and the resistance of the resistive transducer; wherein the deformation of the substrate is configured to deform the resistive transducer, thereby changing the resistance of the resistive transducer and the resonance quality factor of the resonant circuit. 133 . A system, comprising: a medical implant configured to be implanted inside a body of a patient; and a detector located outside the body of the patient; wherein the medical implant comprises a sensor and a suture connected to the sensor, wherein the sensor comprises a substrate and a resonant circuit coupled to the substrate, wherein a tensile force applied by the suture is configured to cause a deformation of the substrate which changes a resonant parameter of the resonant circuit; wherein the detector is configured to wirelessly detect the change of the resonant parameter.

Assignees

Inventors

Classifications

  • the sensor is mounted in or on a conformable substrate or carrier · CPC title

  • (bio)absorbable, (bio)resorbable or resorptive · CPC title

  • Sutures (suture materials A61L17/00; manufacture of artificial threads D01D; treatment of threads D06M) · CPC title

  • Biofeedback (using electroencephalography [EEG] A61B5/375) · CPC title

  • Tendons · CPC title

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Frequently asked questions

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What does patent US2025127457A1 cover?
Certain examples of the disclosure concern an implantable sensor. The implantable sensor includes a sensor assembly configured to connect to a suture. The sensor assembly also includes a substrate and a resonant circuit coupled to the substrate. The resonant circuit is configured to electrically resonate at a resonant frequency when exposed to a first electromagnetic field and to emit a second …
Who is the assignee on this patent?
Univ Oregon
What technology area does this patent fall under?
Primary CPC classification A61B5/6883. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Thu Apr 24 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).