Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
US2025107285A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2025107285-A1 |
| Application number | US-202418796795-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 7, 2024 |
| Priority date | Sep 25, 2023 |
| Publication date | Mar 27, 2025 |
| Grant date | — |
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The present disclosure provides a face-up type ultraviolet light emitting device capable of improving the light extraction efficiency. The face-up type ultraviolet light emitting device includes an n-type layer made of n-type group III nitride semiconductor, an active layer formed on the n-type layer and made of group III nitride semiconductor, a p-type layer formed on the active layer 22 and made of p-type group III nitride semiconductor, a p-side electrode formed on one part on the p-type layer, an insulating anti-reflective layer formed on other part on the p-type layer, made of a material having insulating properties, and preventing reflection of ultraviolet light with an emission wavelength.
Opening claim text (preview).
What is claimed is: 1 . A face-up type ultraviolet light emitting device comprising: an n-type layer made of n-type group III nitride semiconductor; an active layer formed on the n-type layer and made of group III nitride semiconductor; a p-type layer formed on the active layer and made of p-type group III nitride semiconductor; a p-side electrode formed on one part on the p-type layer; and an insulating anti-reflective layer formed on other part on the p-type layer, made of a material having insulating properties, and preventing reflection of ultraviolet light with an emission wavelength. 2 . The light emitting device according to claim 1 , further comprising: a p-side transparent electrode formed on and in contact with the p-type layer, and transmitting ultraviolet light with an emission wavelength, wherein the p-side electrode is formed on one part on the p-side transparent electrode, and the insulating anti-reflective layer is formed on other part on the p-side transparent electrode. 3 . The light emitting device according to claim 2 , wherein the refractive index of the insulating anti-reflective layer is set between the refractive index of the p-side transparent electrode and the refractive index of air. 4 . The light emitting device according to claim 1 , wherein the insulating anti-reflective layer has a multilayer structure formed by depositing materials having different refractive indices. 5 . The light emitting device according to claim 1 , wherein the insulating anti-reflective layer contains at least one selected from a group consisting of Hf oxide, Zr oxide, Si oxide, Al oxide, and Mg fluoride. 6 . The light emitting device according to claim 2 , wherein the p-side transparent electrode is formed thinner than the thickness of the insulating anti-reflective layer. 7 . The light emitting device according to claim 2 , wherein the thickness of the p-side transparent electrode is 20 nm or less. 8 . The light emitting device according to claim 7 , wherein the thickness of the insulating anti-reflective layer is 1 nm to 300 nm. 9 . The light emitting device according to claim 1 , wherein the p-type layer is made of GaN or AlGaN. 10 . An insulating anti-reflective layer used for a face-up type ultraviolet light emitting device, formed on a p-type layer, containing at least one selected from a group consisting of Hf oxide, Zr oxide, Si oxide, Al oxide, and Mg fluoride, and preventing reflectance of ultraviolet light with an emission wavelength.
Coatings, e.g. passivation layers or antireflective coatings · CPC title
Transparent materials · CPC title
containing nitrogen, e.g. GaN · CPC title
Reflective coatings, e.g. dielectric Bragg reflectors · CPC title
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