Embeddable Electrically Insulating Thermal Connector and Circuit Board Including the Same

Patent metadata

Field	Value
Publication number	US-2025106979-A1
Application number	US-202418973212-A
Country	US
Kind code	A1
Filing date	Dec 9, 2024
Priority date	Jun 28, 2021
Publication date	Mar 27, 2025
Grant date	—

Abstract

A heat sink component can include a body including a thermally conductive material that is electrically non-conductive, a lower conductive layer formed over a bottom surface of the body and electrically connected with the ground plane layer, and an upper conductive layer formed over a top surface of the body. The heat sink component can have a length in an X-direction that is parallel with the top surface of the body and a thickness in a direction perpendicular to the top surface. A ratio of the length to the thickness can be greater than about 7.

First claim

1 . A heat sink component comprising
a body comprising a thermally conductive material that is electrically non-conductive; a lower conductive layer formed over a bottom surface of the body; an upper conductive layer formed over a top surface of the body; and at least one thin film component formed on at least one of the top surface, the bottom surface, or a side surface of the body, wherein the heat sink component has a length in an X-direction that is parallel with the top surface of the body and a thickness in a direction perpendicular to the top surface, and wherein a ratio of the length to the thickness is greater than about 7.

2 . (canceled)

3 . The heat sink component of claim 1 , wherein the at least one thin film component comprises one or more of a resistor, varistor, capacitor, or inductor.

4 . The heat sink component of claim 1 , further comprising at least one additional upper conductive layer formed over the top surface of the body of the heat sink component, and wherein the at least one additional upper conductive layer is spaced apart from the upper conductive layer on the top surface.

5 . (canceled)

6 . The heat sink component of claim 1 , wherein the upper conductive layer has a thickness in the Z-direction that is greater than about 1 micron.

7 . The heat sink component of claim 1 , wherein the heat sink component has a width in a Y-direction that is perpendicular to the X-direction and parallel with top surface, and wherein a ratio of the width of the heat sink component to the length of the heat sink component ranges from 0.2 to 5.

8 . The heat sink component of claim 1 , wherein the heat sink component comprises a material having a thermal conductivity from about 150 W/m·° C. to about 300 W/m·° C. at about 22° C.

9 . The heat sink component of claim 1 , wherein the heat sink component comprises aluminum nitride.

10 . The heat sink component of claim 1 , wherein the heat sink component comprises beryllium oxide.

11 . The heat sink component of claim 1 , wherein the thickness of the heat sink component is less than about 250 microns.

12 . A circuit board comprising:
a substrate comprising a mounting surface; a ground plane layer spaced apart from the mounting surface; and a heat sink component at least partially embedded within the substrate, the heat sink component comprising:
a body comprising a thermally conductive material that is electrically non-conductive;
a lower conductive layer formed over a bottom surface of the body and electrically connected with the ground plane layer; and
an upper conductive layer formed over a top surface of the body; and
a via electrically connected with the upper conductive layer and extending toward the mounting surface.

13 . The circuit board of claim 12 , wherein the lower conductive layer of the heat sink component directly contacts the ground plane layer.

14 . The circuit board of claim 12 , further comprising at least an additional via that electrically connects the lower conductive layer with the ground plane layer.

15 . The circuit board of claim 12 , further comprising a heat sink terminal on the mounting surface, wherein the via extends from the upper conductive layer to the mounting surface and connects with the heat sink terminal.

16 . The circuit board of claim 12 , wherein the heat sink component further comprises at least one thin film component formed on at least one of the top surface, the bottom surface, or a side surface of the body.

17 . The circuit board of claim 12 , wherein the heat sink component has a length in a direction parallel with the mounting surface of the substrate and a thickness in a direction perpendicular to the mounting surface, and wherein a ratio of the length to the thickness is greater than about 7.

18 . The circuit board of claim 12 , further comprising at least one additional upper conductive layer formed over the top surface of the body of the heat sink component, and wherein the at least one additional upper conductive layer is spaced apart from the upper conductive layer on the top surface.

19 - 26 . (canceled)

27 . The heat sink component of claim 4 , wherein the at least one additional upper conductive layer comprises a connector extending therefrom, and wherein the upper conductive layer has an edge aligned with a first side surface of the body and the at least one additional upper conductive layer has an edge aligned with a second side surface of the body that is opposite the first side surface, and wherein the connector of the at least one additional conductive layer has an edge aligned with the first side surface of the body.

28 . The heat sink component of claim 4 , wherein the at least one thin film component is formed over the top surface of the body and is connected between the upper conductive layer and the at least one additional upper conductive layer.

29 . The circuit board of claim 18 , wherein the at least one additional upper conductive layer comprises a connector extending therefrom, wherein the via is a first via and a second via is electrically connected with the at least one additional upper conductive layer and extends toward the mounting surface, and wherein a third via is electrically connected with the connector of the at least one additional upper conductive layer and extends toward the mounting surface.

30 . A heat sink component comprising
a body comprising a thermally conductive material that is electrically non-conductive; a lower conductive layer formed over a bottom surface of the body; a first upper conductive layer formed over a top surface of the body; and a second upper conductive layer formed over the top surface of the body, the second upper conductive layer spaced apart from the first upper conductive layer on the top surface, the second upper conductive layer comprising a connector extending therefrom, wherein the connector extends parallel to at least a portion of the first upper conductive layer in an X-direction that is parallel with the top surface of the body, wherein the second upper conductive layer extends parallel to the first upper conductive layer in a Y-direction that is parallel with the top surface of the body and perpendicular to the X-direction.

Assignees

• Kyocera Avx Components Corp

Inventors

• Nelson Cory
• Borgman Jeff
• Berolini Marianne

Classifications

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K1/0207

  using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes · CPC title

• H05K1/0204

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title

• H05K1/0206

  by printed thermal vias · CPC title

• H05K1/11

  Printed elements for providing electric connections to or between printed circuits · CPC title