Substrate and light emitting device

Patent metadata

Field	Value
Publication number	US-2025098389-A1
Application number	US-202418883216-A
Country	US
Kind code	A1
Filing date	Sep 12, 2024
Priority date	Sep 20, 2023
Publication date	Mar 20, 2025
Grant date	—

Abstract

A substrate includes a first member having a through hole extending from an upper surface to a lower surface thereof, and a second member disposed inside the through hole. The second member includes a first region containing graphite, a second region located outward of the first region in a top view, containing graphite and a thermally conductive material that contains at least one of a metal or a ceramic, and having a volume fraction of the graphite lower than a volume fraction of the graphite in the first region, and a third region located outward of the second region in the top view, containing a thermally conductive material that contains at least one of a metal or a ceramic, and having a volume fraction of the thermally conductive material higher than a volume fraction of the thermally conductive material in the second region.

First claim

What is claimed is:

1 . A substrate comprising:
a first member having a through hole extending from an upper surface to a lower surface thereof; and a second member disposed inside the through hole, wherein: the second member includes:
a first region containing graphite,
a second region located outward of the first region in a top view, containing graphite and a thermally conductive material that contains at least one of a metal or a ceramic, and having a volume fraction of the graphite lower than a volume fraction of the graphite in the first region, and
a third region located outward of the second region in the top view, containing a thermally conductive material that contains at least one of a metal or a ceramic, and having a volume fraction of the thermally conductive material higher than a volume fraction of the thermally conductive material in the second region.

2 . The substrate according to claim 1 , wherein the first region further contains a thermally conductive material that contains at least one of a metal or a ceramic.

3 . The substrate according to claim 1 , wherein:
the volume fraction of the graphite in the first region is 70 vol % or more and 100 vol % or less, and the volume fraction of the graphite in the second region is 30 vol % or more and 70 vol % or less.

4 . The substrate according to claim 2 , wherein each of the thermally conductive material of the first region, the thermally conductive material of the second region, and the thermally conductive material of the third region contains at least one of copper or aluminum.

5 . The substrate according to claim 1 , further comprising:
an adhesive member disposed between the first member and the second member, and configured to fix the second member to an inner side of the through hole, wherein: one or more surfaces defining the through hole of the first member form a shape such that a width of the through hole decreases toward the lower surface of the first member.

6 . The substrate according to claim 1 , further comprising:
an adhesive member disposed between the first member and the second member, and configured to fix the second member to an inner side of the through hole, wherein: one or more surfaces located at a periphery of the second member form a shape such that a width of the second member decreases toward a lower surface of the second member.

7 . The substrate according to claim 1 , further comprising:
an adhesive member disposed between the first member and the second member, and configured to fix the second member to an inner side of the through hole, wherein: one or more surfaces defining the through hole of the first member form a shape such that a width of the through hole decreases toward the lower surface of the first member, one or more surfaces located at a periphery of the second member form a shape such that a width of the second member decreases toward a lower surface of the second member, and an angle formed by the lower surface of the first member and one of the one or more surfaces defining the through hole of the first member is less than an angle formed by the lower surface of the first member and one of the one or more surfaces located on the periphery of the second member in a cross-sectional view.

8 . The substrate according to claim 1 , wherein:
a thickness of the second member is less than a thickness of the first member, and a position of an upper surface of the second member is lower than a position of an upper surface of the first member.

9 . The substrate according to claim 1 , wherein a metal film is disposed on each of an upper surface and a lower surface of the second member.

10 . A light emitting device comprising:
a substrate; and a light source disposed above the substrate, wherein: the substrate comprises:
a first member having a through hole extending from an upper surface to a lower surface thereof, and
a second member disposed inside the through hole, and
the second member includes:
a first region containing graphite, and located at a position overlapping the light source in a top view,
a second region located outward of the first region in the top view, containing graphite and a thermally conductive material that contains at least one of a metal or a ceramic, and having a volume fraction of the graphite lower than a volume fraction of the graphite in the first region, and
a third region located outward of the second region in the top view, containing a thermally conductive material that contains at least one of a metal or a ceramic, and having a volume fraction of the thermally conductive material higher than a volume fraction of the thermally conductive material in the second region.

Assignees

• Nichia Corp

Inventors

• Sasaoka Norifumi
• Yamada Shoichi
• Izuno Kunihiro
• Iwakura Daisuke
• Kageyama Yoshiyuki
• Kuroda Hiroaki

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/8581 Primary

  characterised by their material · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/8506

  Containers · CPC title

• H10H20/8582

  characterised by their shape · CPC title