Semiconductor device

Patent metadata

Field	Value
Publication number	US-2025098289-A1
Application number	US-202418589752-A
Country	US
Kind code	A1
Filing date	Feb 28, 2024
Priority date	Sep 19, 2023
Publication date	Mar 20, 2025
Grant date	—

Abstract

An embodiment includes a transistor section, a gate electrode pad, a gate connection member, a gate circuit section, and a casing. The transistor section includes a drain electrode, a source electrode and a gate electrode. The transistor section and the gate electrode pad are provided on a semiconductor substrate. The gate connection member connects a gate terminal and the gate electrode pad. The gate circuit section connects the gate electrode pad and the gate electrode, and includes a parallel circuit with a capacitor and a resistive element, a first connection member electrically connecting the capacitor to the gate electrode pad and a second connection member electrically connecting the capacitor to the gate electrode. The casing accommodates the transistor section, the gate electrode pad and the gate circuit section.

First claim

What is claimed is:

1 . A semiconductor device, comprising:
a transistor section including a source electrode that is provided on a first face of a semiconductor substrate and is electrically connected to a source terminal, a drain electrode that is provided on a second face opposite to the first face in the semiconductor substrate and is electrically connected to a drain terminal, and a gate electrode that is provided between the source electrode and the drain electrode; a gate electrode pad that is provided on the first face; a gate connection member that electrically connects the gate electrode pad and a gate terminal; a gate circuit section that is provided on the first face and is electrically connected between the gate electrode pad and the gate electrode; and a casing that accommodates the transistor section, the gate electrode pad, and the gate circuit section, the gate circuit section including, a capacitor, a resistive element that is connected to the capacitor in parallel, a first connection member that electrically connects one electrode of the capacitor to the gate electrode pad, and a second connection member that electrically connects the other electrode of the capacitor to the gate electrode.

2 . The device according to claim 1 ,
wherein in plan view, the transistor section, the gate electrode pad, the capacitor, and the resistive element are disposed so as not to overlap each other, the capacitor is disposed adjacent to the gate electrode pad, and the first connection member is provided between the gate electrode pad and the capacitor.

3 . The device according to claim 2 ,
wherein the capacitor is disposed adjacent to the transistor section, and the second connection member is provided between the capacitor and the transistor section.

4 . The device according to claim 1 ,
wherein an inductance value of a series circuit of the gate connection member, the first wiring, and the second wiring is less than 8 nH.

5 . The device according to claim 1 ,
wherein the transistor section includes, a drift layer of a first conductivity type which is provided on the first face, a base layer of a second conductivity type which is provided on the drift layer, a source layer of the first conductivity type which is selectively provided on the base layer, and a gate electrode that faces a part of the drift layer and the base layer through a gate insulating film, the semiconductor substrate contains an impurity of the first conductivity type, the source electrode is electrically connected to the base layer and the source layer on the base layer and on the source layer, and the capacitor includes, a first capacitor electrode that is electrically connected to the gate electrode pad through the first wiring, a second capacitor electrode that is electrically connected to the gate electrode through the second wiring, and a dielectric film that is provided between the first capacitor electrode and the second capacitor electrode.

6 . The device according to claim 5 ,
wherein the first capacitor electrode is provided on the drift layer through a first insulating layer, the dielectric layer is provided on the first capacitor electrode, and the second capacitor electrode is provided on the dielectric layer.

7 . The device according to claim 5 ,
wherein the transistor section includes a conductive body that extends in the drift layer, the conductive body includes a conductive body that faces the drift layer through a first insulating film, and faces the gate electrode through a second insulating film, the first capacitor electrode faces a part of the drift layer through a third insulating film, and the second capacitor electrode extends in the drift layer, faces the drift layer through a fourth insulating film, and faces the first capacitor electrode through the dielectric layer.

8 . The device according to claim 7 ,
wherein the capacitor includes the base layer on the drift layer, and the first capacitor electrode faces a part of the drift layer and the base layer.

9 . The device according to claim 1 ,
wherein the capacitor and the resistive element are disposed on the gate electrode pad through the first connection member and are electrically connected to the gate electrode pad.

10 . The device according to claim 9 ,
wherein the first connection member is provided between the capacitor and the gate electrode pad.

11 . The device according to claim 2 ,
wherein an inductance value of a series circuit of the gate connection member, the first wiring, and the second wiring is less than 8 nH.

12 . The device according to claim 3 ,
wherein an inductance value of a series circuit of the gate connection member, the first wiring, and the second wiring is less than 8 nH.

13 . The device according to claim 2 ,
wherein the transistor section includes, a drift layer of a first conductivity type which is provided on the first face, a base layer of a second conductivity type which is provided on the drift layer, a source layer of the first conductivity type which is selectively provided on the base layer, and a gate electrode that faces a part of the drift layer and the base layer through a gate insulating film, the semiconductor substrate contains an impurity of the first conductivity type, the source electrode is electrically connected to the base layer and the source layer on the base layer and on the source layer, and the capacitor includes, a first capacitor electrode that is electrically connected to the gate electrode pad through the first wiring, a second capacitor electrode that is electrically connected to the gate electrode through the second wiring, and a dielectric film that is provided between the first capacitor electrode and the second capacitor electrode.

14 . The device according to claim 3 ,
wherein the transistor section includes, a drift layer of a first conductivity type which is provided on the first face, a base layer of a second conductivity type which is provided on the drift layer, a source layer of the first conductivity type which is selectively provided on the base layer, and a gate electrode that faces a part of the drift layer and the base layer through a gate insulating film, the semiconductor substrate contains an impurity of the first conductivity type, the source electrode is electrically connected to the base layer and the source layer on the base layer and on the source layer, and the capacitor includes, a first capacitor electrode that is electrically connected to the gate electrode pad through the first wiring, a second capacitor electrode that is electrically connected to the gate electrode through the second wiring, and a dielectric film that is provided between the first capacitor electrode and the second capacitor electrode.

15 . The device according to claim 4 ,
wherein the transistor section includes, a drift layer of a first conductivity type which is provided on the first face, a base layer of a second conductivity type which is provided on the drift layer, a source layer of the first conductivity type which is selectively provided on the base layer, and a gate electrode that faces a part of the drift layer and the base layer through a gate insulating film, the semiconductor substrate contains an impurity of the first conductivity type, the source electrode is electrically connected to the base layer and the source layer on the base layer and on the source layer, and the capacitor includes, a first capacitor electrode that is electrically conne

Assignees

• Toshiba Kk

Inventors

• Kobayashi Yusuke
• Inokuchi Tomoaki
• Sakano Tatsunori
• Yoshida Satoshi
• Adachi Kento
• Gangi Hiro
• Baba Shotaro
• Fukuda Taichi

Classifications

• H10W72/5453

  connecting between multiple bond pads on a chip, e.g. daisy chain · CPC title

• H10D1/47 Primary

  Resistors having no potential barriers · CPC title

• H10D30/668

  having trench gate electrodes, e.g. UMOS transistors · CPC title

• H10D64/117

  Recessed field plates, e.g. trench field plates or buried field plates · CPC title

• H10D84/811 Primary

  Combinations of field-effect devices and one or more diodes, capacitors or resistors · CPC title