Display Panel and Method for Manufacturing the Same, Display Device and Tiled Display Device
US-2024405179-A1 · Dec 5, 2024 · US
Display module comprising micro light emitting diode
US2025096177A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2025096177-A1 |
| Application number | US-202418962923-A |
| Country | US |
| Kind code | A1 |
| Filing date | Nov 27, 2024 |
| Priority date | May 27, 2022 |
| Publication date | Mar 20, 2025 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A display module includes: a plurality of light emitting diodes; a substrate having a plurality of indium-tin oxide (ITO) electrodes disposed thereon, the plurality of ITO electrodes being connected to electrodes of the plurality of light emitting diodes; and an assembly configured to connect the electrodes of the plurality of light emitting diodes and the plurality of ITO, wherein the assembly comprises a silver (Ag) paste to be applied on the plurality of ITO electrodes, and the electrodes of the plurality of light emitting diodes and the plurality of ITO electrodes of the substrate may be bonded by eutectic bonding through the assembly during thermal compression bonding.
First claim
Opening claim text (preview).
What is claimed is: 1 . A display module comprising: a plurality of light emitting diodes; a substrate having a plurality of indium-tin oxide (ITO) electrodes disposed thereon, the plurality of ITO electrodes being connected to electrodes of the plurality of light emitting diodes; and an assembly configured to connect the electrodes of the plurality of light emitting diodes and the plurality of ITO electrodes, wherein the assembly comprises a silver (Ag) paste to be applied on the plurality of ITO electrodes, and wherein the electrodes of the plurality of light emitting diodes and the plurality of ITO electrodes are bonded by eutectic bonding through the assembly during thermal compression bonding. 2 . The display module of claim 1 , wherein the electrodes of the plurality of light emitting diodes are made of gold (Au) or an alloy including Au. 3 . The display module of claim 1 , wherein the electrodes of the plurality of light emitting diodes are made of a nickel/gold (Ni/Au) alloy, a titanium/gold (Ti/Au) alloy, copper (Cu), a copper/nickel (Cu/Ni) alloy, or a tin/silver (Sn/Ag) alloy. 4 . The display module of claim 1 , wherein the assembly further comprises a bonding bump comprising a tin-silver-copper/indium (SnAgCu/In) alloy, and wherein the bonding bump is melted with the silver paste during the thermal compression bonding, and a mixture of the bonding bump and the silver paste constitutes the assembly.
Assignees
Inventors
Classifications
comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title
Bond pads specially adapted therefor · CPC title
Soldering or alloying · CPC title
Compression bonding, e.g. thermocompression bonding · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
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- What does patent US2025096177A1 cover?
- A display module includes: a plurality of light emitting diodes; a substrate having a plurality of indium-tin oxide (ITO) electrodes disposed thereon, the plurality of ITO electrodes being connected to electrodes of the plurality of light emitting diodes; and an assembly configured to connect the electrodes of the plurality of light emitting diodes and the plurality of ITO, wherein the assembly…
- Who is the assignee on this patent?
- Samsung Electronics Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10H20/857. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Mar 20 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).