Package substrate and semiconductor structure with same

Patent metadata

Field	Value
Publication number	US-2025096144-A1
Application number	US-202418963719-A
Country	US
Kind code	A1
Filing date	Nov 28, 2024
Priority date	Feb 5, 2021
Publication date	Mar 20, 2025
Grant date	—

Abstract

A package substrate is provided. The package substrate includes a body and a plurality of conducive bridges. The body includes an opening region. The plurality of conductive bridges are disposed separately in the opening region, and the plurality of conductive bridges comprise: a first conductive bridge provided with at least two first through holes.

First claim

What is claimed is:

1 . A package substrate, comprising:
a body including an opening region; and a plurality of conductive bridges disposed separately in the opening region; and, wherein, the plurality of conductive bridges comprise: a first conductive bridge provided with at least two first through holes.

2 . The package substrate of claim 1 , wherein the at least two first through holes are disposed separately along a length direction of the first conductive bridge.

3 . The package substrate of claim 1 , wherein the body further comprises a bottom surface and a top surface which are disposed oppositely, and the opening region is located on the bottom surface.

4 . The package substrate of claim 1 , wherein the body further comprises a conductive layer is disposed around the opening region.

5 . The package substrate of claim 4 , wherein a plurality of cutout through holes are formed on the conductive layer, the plurality of cutout through holes are outside of the opening region.

6 . The package substrate of claim 1 , wherein the plurality of conductive bridges further comprise:
a second conductive bridge; and a third conductive bridge, wherein the first conductive bridge, the second conductive bridge and the third conductive bridge are disposed in sequence, and a distance value between the first conductive bridge and the second conductive bridge is not equal to a distance value between the second conductive bridge and the third conductive bridge.

7 . The package substrate of claim 6 , wherein the second conductive bridge is provided with a second through hole, and the third conductive bridge is provided with a third through hole.

8 . A package substrate, comprising:
a body including an opening region and a vent hole; and a plurality of conductive bridges disposed separately in the opening region, a gap is provided between the adjacent conductive bridges; and, wherein the plurality of conductive bridges comprise: a first conductive bridge provided with at least two first through holes; and the vent hole is opposite to the gap.

9 . The package substrate of claim 8 , wherein there are a plurality of vent holes, and each of the plurality of vent holes corresponds to a respective gap.

10 . The package substrate of claim 9 , wherein there are a plurality of hole pitches between the plurality of vent holes, a hole pitch is a pitch between adjacent vent holes, and at least two holes pitches in the plurality of hole pitches are not equal.

11 . The package substrate of claim 10 , wherein the plurality of hole pitches are all different from each other, and the plurality of hole pitches gradually increase along a first length direction of the opening region.

12 . The package substrate of claim 10 , wherein there are at least two conductive bridges between adjacent vent holes.

13 . The package substrate of claim 8 , wherein the body further includes a solder ball region, and the solder ball region is located outside the opening region.

14 . The package substrate of claim 8 , wherein the at least first through holes are disposed separately along a length direction of the first conductive bridge.

15 . The package substrate of claim 8 , wherein the plurality of conductive bridges further comprise:
a second conductive bridge; and a third conductive bridge, wherein the first conductive bridge, the second conductive bridge and the third conductive bridge are disposed in sequence.

16 . The package substrate of claim 15 , wherein a distance value between the first conductive bridge and the second conductive bridge is not equal to a distance value between the second conductive bridge and the third conductive bridge.

17 . The package substrate of claim 15 , wherein the second conductive bridge is provided with a second through hole, and the third conductive bridge is provided with a third through hole.

18 . The package substrate of claim 8 , wherein structures of the at least two first through holes are different.

19 . The package substrate of claim 8 , wherein a packaging resin is filled between the vent hole and a conductive bridge of the plurality of conductive bridges.

20 . A package substrate, comprising:
a body including an opening region, a vent hole and conductive layer; and a plurality of conductive bridges disposed separately in the opening region, a gap is provided between the adjacent conductive bridges; and, wherein the plurality of conductive bridges comprise: a first conductive bridge provided with at least two first through holes; the vent hole is opposite to the gap; and the conductive layer is disposed around the opening region.

Assignees

• Changxin Memory Tech Inc

Inventors

• Wang Hailin

Classifications

• H10W70/635

  Through-vias · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W70/65 Primary

  Shapes or dispositions of interconnections · CPC title