METHOD OF PREPARING MESOPOROUS CuO MATERIALS

US2025091894A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025091894-A1
Application numberUS-202318370561-A
CountryUS
Kind codeA1
Filing dateSep 20, 2023
Priority dateSep 20, 2023
Publication dateMar 20, 2025
Grant date

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Abstract

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A method for preparing mesoporous copper oxide (CuO) includes providing a copper composition including copper (Cu), phenanthroline, and a Schiff base, combining the copper composition with a sodium salt to provide a salt mixture, and calcining the salt mixture to provide the mesoporous CuO. The mesoporous copper oxide has an ordered structure and a diameter ranging from about 0.5 μm to about 3 μm.

First claim

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1 . A method for preparing mesoporous CuO, comprising: providing a copper (Cu) composition including copper (Cu), phenanthroline, and a Schiff base; combining the copper (Cu) composition with a NaX salt to provide a salt mixture; and calcining the salt mixture to provide the mesoporous CuO, wherein X is selected from the group consisting of Cl, Br, and NO 3 ; wherein the phenanthroline has the structure; and wherein the Schiff base has the structure: 2 . The method as recited in claim 1 , wherein the copper (Cu) composition is prepared by a method comprising: dissolving CuBr 2 ·4H 2 O in an alcohol to form a first mixture; dispersing phenanthroline in an alcohol to form a second mixture; combining the first mixture and the second mixture to form a third mixture; and adding a Schiff base ligand to the third mixture to provide the copper (Cu) composition. 3 . The method as recited in claim 1 , wherein the salt mixture is calcined until a temperature ranging from about 500° C. to about 600° C. is achieved. 4 . Mesoporous CuO prepared according to the method of claim 1 . 5 . The mesoporous CuO of claim 4 , wherein the mesoporous CuO has a diameter ranging from about 0.5 μm to about 3 μm. 6 . A method for preparing mesoporous CuO, comprising: providing a copper (Cu) composition including copper (Cu), phenanthroline, and a Schiff base; combining the copper (Cu) composition with a NaX salt to provide a salt mixture; calcining the salt mixture until a temperature ranging from about 500° C. to about 600° C. is achieved, to provide the mesoporous CuO, wherein X is selected from the group consisting of Cl, Br, and NO 3 ; wherein the phenanthroline has the structure: and wherein the Schiff base has the structure: 7 . The method as recited in claim 6 , wherein the copper (Cu) composition is prepared by a method comprising: dissolving CuBr 2 ·4H 2 O in an alcohol to form a first mixture; dispersing phenanthroline in an alcohol to form a second mixture; combining the first mixture and the second mixture to form a third mixture; and adding a Schiff base ligand to the third mixture to provide the composition. 8 . Mesoporous CuO prepared according to the method of claim 7 . 9 . The mesoporous CuO of claim 8 , wherein the mesoporous CuO has a diameter ranging from about 0.5 μm to about 3 μm. 10 . A method for preparing mesoporous CuO, comprising: providing a copper (Cu) composition including copper (Cu), phenanthroline, and a Schiff base; combining the copper (Cu) composition with a NaX salt to provide a salt mixture; calcining the salt mixture to provide the mesoporous CuO, wherein X is selected from the group consisting of Cl, Br, and NO 3 , and the mesoporous CuO has a diameter ranging from about 0.5 μm to about 3 μm; wherein the phenanthroline has the structure: and wherein the Schiff base has the structure: 11 . The method as recited in claim 10 , wherein the copper (Cu) composition is prepared by a method comprising: dissolving CuBr 2 ·4H 2 O in an alcohol to form a first mixture; dispersing phenanthroline in an alcohol to form a second mixture; combining the first mixture and the second mixture to form a third mixture; and adding a Schiff base ligand to the third mixture to provide the copper (Cu) composition. 12 . Mesoporous CuO prepared according to the method of claim 10 .

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What does patent US2025091894A1 cover?
A method for preparing mesoporous copper oxide (CuO) includes providing a copper composition including copper (Cu), phenanthroline, and a Schiff base, combining the copper composition with a sodium salt to provide a salt mixture, and calcining the salt mixture to provide the mesoporous CuO. The mesoporous copper oxide has an ordered structure and a diameter ranging from about 0.5 μm to about 3 μm.
Who is the assignee on this patent?
Kuwait Univ
What technology area does this patent fall under?
Primary CPC classification C01G3/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Mar 20 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).