Capacitor, electric circuit, circuit board, apparatus, and method for manufacturing capacitor

Patent metadata

Field	Value
Publication number	US-2025087426-A1
Application number	US-202418960931-A
Country	US
Kind code	A1
Filing date	Nov 26, 2024
Priority date	Jun 1, 2022
Publication date	Mar 13, 2025
Grant date	—

Abstract

A capacitor includes a metallic tantalum, an electric conductor, and an oxidized tantalum film. The oxidized tantalum film is disposed between the metallic tantalum and the electric conductor, where the oxidized tantalum film is in contact with the metallic tantalum. The oxidized tantalum film includes a first portion containing fluorine, and a second portion. The second portion is located closer to the metallic tantalum than the first portion in a thickness direction of the oxidized tantalum film. And a fluorine concentration at the second portion is lower than a fluorine concentration at the first portion.

First claim

What is claimed is:

1 . A capacitor comprising:
metallic tantalum; an electric conductor; and an oxidized tantalum film disposed between the metallic tantalum and the electric conductor, the oxidized tantalum film being in contact with the metallic tantalum, wherein the oxidized tantalum film includes a first portion containing fluorine and a second portion located closer to the metallic tantalum than the first portion in a thickness direction of the oxidized tantalum film, and a fluorine concentration at the second portion is lower than a fluorine concentration at the first portion.

2 . The capacitor according to claim 1 , wherein
the first portion is amorphous.

3 . The capacitor according to claim 1 , wherein
the first portion has a composition represented by TaO x F y , and the composition satisfies a requirement 0<x<2.5.

4 . The capacitor according to claim 3 , wherein
the composition further satisfies a requirement y≥0.015.

5 . The capacitor according to claim 4 , wherein
the composition further satisfies a requirement y≤0.40.

6 . The capacitor according to claim 1 , wherein
the fluorine concentration at the second portion is 0.4% or less on the basis of the number of atoms.

7 . The capacitor according to claim 1 , wherein
the second portion has a thickness of more than 5 nm and not more than 100 nm.

8 . The capacitor according to claim 1 , further comprising an electrolyte disposed between the oxidized tantalum film and the electric conductor.

9 . An electric circuit comprising the capacitor according to claim 1 .

10 . A circuit board comprising the capacitor according to claim 1 .

11 . An apparatus comprising the capacitor according to claim 1 .

12 . A method for manufacturing a capacitor, the method comprising:
anodizing metallic tantalum in contact with a fluorine-free aqueous solution to form a tantalum oxide layer on the metallic tantalum; and anodizing the tantalum oxide layer in contact with a fluorine-containing aqueous solution to form a fluorine-containing oxidized tantalum film on a surface region of the tantalum oxide layer.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Goto Takehito
• Kitamura Naoya
• Kanou Manabu
• Kikuchi Ryosuke

Classifications

• H05K2201/0175

  Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor · CPC title

• H05K2203/0315

  Oxidising metal · CPC title

• H05K1/162

  incorporating printed capacitors · CPC title

• H01G9/0032

  formation of the dielectric layer · CPC title

• H01G9/052

  Sintered electrodes · CPC title