Backlight module, display module and display apparatus

Patent metadata

Field	Value
Publication number	US-2025085590-A1
Application number	US-202318552796-A
Country	US
Kind code	A1
Filing date	Feb 20, 2023
Priority date	Mar 31, 2022
Publication date	Mar 13, 2025
Grant date	—

Abstract

A backlight module includes a light-emitting substrate, at least one chip-on-film and a backplane. The light-emitting substrate includes a signal line group and a plurality of light-emitting units, and the plurality of light-emitting units are electrically connected to the signal line group. The at least one chip-on-film is arranged on a non-light exit side of the light-emitting substrate, and electrically connected to the signal line group. The backplane is disposed on the non-light exit side of the light-emitting substrate, and the at least one chip-on-film is located between the backplane and the light-emitting substrate. The backplane is provided with a groove therein, a notch of the groove faces the light-emitting substrate, and at least portion of a chip-on-film film of the at least one chip-on-film is disposed in the groove.

First claim

1 . A backlight module, comprising:
a light-emitting substrate, including a signal line group and a plurality of light-emitting units, the plurality of light-emitting units being electrically connected to the signal line group; at least one chip-on-film arranged on a non-light exit side of the light-emitting substrate, the at least one chip-on-film being electrically connected to the signal line group; and a backplane disposed on the non-light exit side of the light-emitting substrate, and the at least one chip-on-film being located between the backplane and the light-emitting substrate; wherein the backplane is provided with a groove therein, a notch of the groove faces the light-emitting substrate, and at least portion of a chip-on-film film of the at least one chip-on-film is disposed in the groove.

2 . The backlight module according to claim 1 , wherein the chip-on-chip film includes:
a flexible film electrically connected to the signal line group; and at least one driver chip electrically connected to the flexible film, the at least one driver chip being arranged in the groove.

3 . The backlight module according to claim 2 , wherein a sidewall of the groove is of a stepped structure; in a thickness direction of the light-emitting substrate and from the notch to a bottom surface of the groove, the sidewall of the groove includes a first sub-wall, a stepped surface and a second sub-wall that are connected in sequence, and the first sub-wall and the second sub-wall both intersect with the stepped surface;
the groove includes at least one first sub-groove and at least one second sub-groove a first sub-groove of the at least one first sub-groove includes the first sub-wall and the stepped surface, and a second sub-groove of the at least one second sub-groove includes the second sub-wall and at least portion of the bottom surface of the groove; and a driver chip of the at least one driver chip is arranged in the second sub-groove, and at least portion of the flexible film is arranged in the first sub-groove.

4 . The backlight module according to claim 3 , wherein the groove includes a plurality of second sub-grooves arranged in a first direction; the first direction is parallel to an extending direction of a side edge of a bonding side of the light-emitting substrate;
the backlight module comprises a plurality of the chip-on-films, and the plurality of the chip-on-films are arranged in sequence in the first direction; wherein each of the plurality of chip-on-films includes at least one driver chip, and all driver chips included in a same chip-on-film are disposed in a same second sub-groove.

5 . The backlight module according to claim 4 , wherein the groove includes a plurality of the first sub-grooves, the first sub-grooves and the second sub-grooves are arranged alternately in the first direction;
each of the plurality of chip-on-films further includes a flexible film; of each of the plurality of chip-on-films, two side edges of the flexible film respectively exceed two side edges of the at least one driver chip in the first direction, and the two side edges of the flexible film are respectively located in two first sub-grooves located on two sides of a second sub-groove where the at least one driving chip is located.

6 . The backlight module according to claim 2 , further comprising:
a heat dissipation layer disposed between a bottom surface of the groove and the at least one driver chip, the heat dissipation layer being connected to the bottom surface of the groove.

7 . The backlight module according to claim 1 , wherein the backplane includes a backplane body, the backplane body is arranged around the groove, and a top of a sidewall of the groove is connected to the backplane body; and
in a thickness direction of the light-emitting substrate, a bottom surface of the groove is farther away from the light-emitting substrate than the backplane body.

8 . The backlight module according to claim 1 , further comprising:
a flexible circuit board, an end of the flexible circuit board being electrically connected to the light-emitting substrate; wherein the backplane is provided with a first opening therein, and another end of the flexible circuit board passes through the first opening and extends to a side of the backplane away from the light-emitting substrate.

9 . The backlight module according to claim 8 , wherein the first opening is located at a side of the groove proximate to a side edge of a bonding side of the light-emitting substrate.

10 . The backlight module according to claim 1 , further comprising:
a first fixed adhesive layer disposed between the light-emitting substrate and the backplane, the first fixed adhesive layer being arranged avoiding the groove and the at least one chip-on-film.

11 . The backlight module according to claim 1 , further comprising:
an optical adjustment film disposed on a light exit side of the light-emitting substrate; and a mold frame arranged around the optical adjustment film, the mold frame being disposed on the light exit side of the light-emitting substrate.

12 . The backlight module according to claim 11 , further comprising:
a second fixed adhesive layer disposed between the light-emitting substrate and the mold frame.

13 . A display module, comprising:
the backlight module according to claim 1 ; and a display panel disposed on a light exit side of the backlight module.

14 . The display module according to claim 13 , further comprising:
a circuit board disposed on a side of the backlight module away from the display panel and disposed at a side of the groove of the backplane of the backlight module: wherein the backlight module further includes a flexible circuit, and the circuit board is electrically connected to the flexible circuit board of the backlight module.

15 . The display module according to claim 14 , further comprising:
another flexible circuit board, the display panel being electrically connected to the circuit board through the another flexible circuit board.

16 . The display module according to claim 14 , further comprising:
a connector disposed on a side of the circuit board away from the backlight module; wherein the flexible circuit board is inserted into the connector.

17 . A display apparatus, comprising the display module according to claim 13 .

18 . The backlight module according to claim 1 , wherein the light-emitting substrate has a bonding side, and each of the at least one chip-on-film is bonded to the light-emitting substrate at the bonding side of the light-emitting substrate.

19 . The backlight module according to claim 4 , wherein the plurality of chip-on-films are of a one-piece structure.

20 . The display module according to claim 14 , wherein a thickness of the groove is approximately equal to a thickness of the circuit board.

Assignees

• Chongqing Boe Optoelectronics Tech Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Wang Yu
• Luo Wencheng
• Hu Meilong
• Zhang Jinhong
• Quan Wenqi
• Ran Wei
• Li Zhi
• Zhang Hening
• Xiong Bowen
• Yuan Qiong
• Cen Xin
• Liao Ke
• Cheng Yiming

Classifications

• G02F1/133607

  the light controlling member including light directing or refracting elements, e.g. prisms or lenses · CPC title

• G02F1/133612 Primary

  Electrical details · CPC title

• G02F1/133603 Primary

  with LEDs · CPC title

• G02F1/133611

  including means for improving the brightness uniformity · CPC title

• G02F1/133608

  including particular frames or supporting means · CPC title