Electroconductive adhesive

Patent metadata

Field	Value
Publication number	US-2025084286-A1
Application number	US-202418963230-A
Country	US
Kind code	A1
Filing date	Nov 27, 2024
Priority date	May 26, 2016
Publication date	Mar 13, 2025
Grant date	—

Abstract

An electroconductive adhesive comprising a plurality of metal fine particles A that each comprise a protective layer, wherein: (a) the metal fine particles A comprise two or more different types of particles, each coated with a C5-C7 monoalkylamine, wherein the two or more different types of particles comprise: (i) a first type of particle having an average particle diameter of 100-300 nm, and (ii) a second type of particle having an average particle diameter of 30-100 nm; and (b) the protective layer suppresses mutual aggregation of the metal fine particles A. Also disclosed are sintered objects of the electroconductive adhesive, methods of manufacturing the electroconductive adhesive and methods of bonding members with the electroconductive adhesive.

First claim

What is claimed is:

1 . An electroconductive adhesive comprising a plurality of metal fine particles A that each comprise a protective layer, wherein:
(a) the metal fine particles A comprise two or more different types of particles, each coated with a C5-C7 monoalkylamine, wherein the two or more different types of particles comprise:
(i) a first type of particle having an average particle diameter of 100-300 nm, and
(ii) a second type of particle having an average particle diameter of 30-100 nm; and
(b) the protective layer suppresses mutual aggregation of the metal fine particles A.

2 . The electroconductive adhesive according to claim 1 , wherein:
(i) the first type of particle has an average particle diameter of 200 nm, and (ii) the second type of particle has an average particle diameter of 75 nm.

3 . The electroconductive adhesive according to claim 1 , wherein the C5-C7 monoalkylamine in the first type and the second type of particles is n-hexylamine.

4 . The electroconductive adhesive according to claim 1 , wherein the plurality of metal fine particles A further comprises a third type of particle coated with a C5-C7 monoalkylamine, wherein the plurality of metal fine particles A has an average particle diameter of 30-100 nm.

5 . The electroconductive adhesive according to claim 3 , wherein the C5-C7 monoalkylamine in the coating of the third type of particles is n-hexylamine.

6 . The electroconductive adhesive according to claim 1 , wherein the protective layer of at least one of the two or more different types of particles further comprises a fatty acid.

7 . The electroconductive adhesive according to claim 1 , further comprising a solvent.

8 . A sintered object of the electroconductive adhesive according to claim 1 .

9 . A circuit or an apparatus comprising a part that bonds between members, wherein the part is the sintered object according to claim 8 .

10 . A method of manufacturing the electroconductive adhesive according to claim 1 , the method comprising a step of mixing the first type of particle with the second type of particle.

11 . A method of bonding members comprising the steps of:
disposing the electroconductive adhesive according to claim 1 between members; and heating the electroconductive adhesive for sintering.

Assignees

• Osaka Soda Co Ltd

Inventors

• Mori Takamichi
• Minami Junichiro
• Iwasa Naruhito

Classifications

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/01308

  using permanent auxiliary members, e.g. using alignment marks · CPC title

• H10W72/383

  Reinforcing structures, e.g. collars · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title