Irreversible circuit element and method of manufacturing irreversible circuit element

Patent metadata

Field	Value
Publication number	US-2025079676-A1
Application number	US-202217917738-A
Country	US
Kind code	A1
Filing date	Feb 15, 2022
Priority date	Feb 15, 2022
Publication date	Mar 6, 2025
Grant date	—

Abstract

An irreversible circuit element includes: a housing; a plurality of irreversible circuit plates accommodated in the housing; and a plurality of terminals connected to an outer surface of the housing, the plurality of irreversible circuit plates are arranged such that the adjacent irreversible circuit plates face each other, each of the plurality of irreversible circuit plates includes a metal layer, a first insulating layer, a loss layer, and a first magnetic field applying layer laminated in sequence in a thickness direction, each of the plurality of irreversible circuit plates transmits a signal irreversibly between a first end and a second end, and the first end and the second end of each of the plurality of irreversible circuit plates are connected to different terminals of the plurality of terminals.

First claim

1 . An irreversible circuit element comprising: a housing; a plurality of irreversible circuit plates accommodated in the housing; and a plurality of terminals connected to an outer surface of the housing,
wherein the plurality of irreversible circuit plates are arranged such that the adjacent irreversible circuit plates face each other, each of the plurality of irreversible circuit plates includes a metal layer, a first insulating layer, a loss layer, and a first magnetic field applying layer laminated in sequence in a thickness direction, each of the plurality of irreversible circuit plates transmits a signal irreversibly between a first end and a second end, and the first end and the second end of each of the plurality of irreversible circuit plates are connected to different terminals of the plurality of terminals.

2 . The irreversible circuit element according to claim 1 ,
wherein the first end of each of the plurality of irreversible circuit plates is connected to any one of terminals connected to a first surface of the housing among the plurality of terminals, and the second end of each of the plurality of irreversible circuit plates is connected to any one of terminals connected to a second surface of the housing facing the first surface of the housing among the plurality of terminals.

3 . The irreversible circuit element according to claim 1 ,
wherein at least one of the plurality of irreversible circuit plates further comprises a third end, each signal is irreversibly transmitted between the first end and the second end, between the second end and the third end, and between the third end and the first end, and the third end is connected to any one of the plurality of terminals.

4 . The irreversible circuit element according to any claim 1 ,
wherein the first magnetic field applying layer includes any one selected from the group consisting of TbFeCo, GdFeCo, SmFeCo, a (Co/Pt) multilayer film, and a (Co/Pd) multilayer film.

5 . The irreversible circuit element according to claim 1 ,
wherein each of the plurality of irreversible circuit plates further includes a second insulating layer and a second magnetic field applying layer, and the second insulating layer is located between the metal layer and the second magnetic field applying layer.

6 . The irreversible circuit element according to claim 5 ,
wherein the second magnetic field applying layer includes any one selected from the group consisting of TbFeCo, GdFeCo, SmFeCo, (Co/Pt) multilayer film, and (Co/Pd) multilayer film.

7 . The irreversible circuit element according to claim 1 , further comprising at least one or more magnetic shield layers,
wherein the magnetic shield layer is located between the adjacent irreversible circuit plates.

8 . The irreversible circuit element according to claim 1 ,
wherein each of the plurality of irreversible circuit plates further includes a third insulating layer opposite to the first insulating layer with reference to the metal layer, and a first irreversible circuit plate and a second irreversible circuit plate among the adjacent irreversible circuit plates come into contact with the third insulating layer of the first irreversible circuit plate and the first magnetic field applying layer of the second irreversible circuit plate.

9 . The irreversible circuit element according to claim 1 ,
wherein the loss layer has a first region between the first end and the second end, and a second region, in which a magnetic field applied to the metal layer by the first region is greatly attenuated, in a plane, and the first region has at least a magnetic material.

10 . The irreversible circuit element according to claim 9 ,
wherein the first region includes any one selected from the group consisting of Co-based amorphous, ferrite, Fe 85 Si 2 B 8 P 4 Cu, Fe 86 AlB 8 P 4 Cu, Fe 78 Si 9 B 13 , and yttrium-iron-garnet (YIG).

11 . The irreversible circuit element according to claim 9 ,
wherein the second region includes any one selected from the group consisting of iron, BN, conductive carbon, SiC, and Ni-based ferrite.

12 . The irreversible circuit element according to claim 9 , further comprising an insulating region between the first region and the second region,
wherein the insulating region electrically or magnetically insulates the first region and the second region from each other.

13 . The irreversible circuit element according to claim 1 ,
wherein the loss layer has a plurality of ferromagnetic layers separated and arranged in a plane, and the plurality of ferromagnetic layers are alternately arranged in one direction in the plane with the insulating layer sandwiched therebetween.

14 . The irreversible circuit element according to claim 1 ,
wherein the loss layer has a plurality of ferromagnetic layers scattered in an islands shape in a plane, and the plurality of ferromagnetic layers are arranged in closest packing.

15 . A method of manufacturing an irreversible circuit element, comprising the steps of:
laminating a loss layer on an insulating layer, which is laminated on a metal layer, using a sputtering method and producing an irreversible circuit plate; and connecting each of a plurality of irreversible circuit plates including the irreversible circuit plate to a terminal.

16 . A method of manufacturing an irreversible circuit element, comprising the steps of:
forming a loss layer on an insulating layer, which is laminated on a metal layer, using a nanoimprint method and producing an irreversible circuit plate; and connecting each of a plurality of irreversible circuit plates including the irreversible circuit plate to a terminal.

17 . The irreversible circuit element according to claim 2 ,
wherein at least one of the plurality of irreversible circuit plates further comprises a third end, each signal is irreversibly transmitted between the first end and the second end, between the second end and the third end, and between the third end and the first end, and the third end is connected to one of the plurality of terminals.

18 . The irreversible circuit element according to claim 2 ,
wherein the first magnetic field applying layer includes any one selected from the group consisting of TbFeCo, GdFeCo, SmFeCo, a (Co/Pt) multilayer film, and a (Co/Pd) multilayer film.

19 . The irreversible circuit element according to claim 2 ,
wherein each of the plurality of irreversible circuit plates further includes a second insulating layer and a second magnetic field applying layer, and the second insulating layer is located between the metal layer and the second magnetic field applying layer.

20 . The irreversible circuit element according to claim 2 , further comprising at least one or more magnetic shield layers,
wherein the magnetic shield layer is located between the adjacent irreversible circuit plates.

Assignees

• Tdk Corp

Inventors

• Sasaki Tomoyuki
• Sato Yoshiaki

Classifications

• H01P1/387

  Strip line circulators · CPC title

• H01P1/38

  Circulators · CPC title

• H01P1/32

  Non-reciprocal transmission devices (H01P1/02 - H01P1/30 take precedence) · CPC title

• H01P1/36 Primary

  Isolators · CPC title

• H01P1/37 Primary

  Field displacement isolators · CPC title