Ceramic electronic device, powder material, paste material, and manufacturing method of ceramic electronic device
US-12073996-B2 · Aug 27, 2024 · US
US2025079083A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2025079083-A1 |
| Application number | US-202418949304-A |
| Country | US |
| Kind code | A1 |
| Filing date | Nov 15, 2024 |
| Priority date | May 20, 2022 |
| Publication date | Mar 6, 2025 |
| Grant date | — |
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A dielectric has a composition represented by Bi2xMgyTizOk. The composition satisfies requirements x≥0.15, y≥0.40, z≥0.25, and x+y+z=1.0. In the composition, k is a value for maintaining electroneutrality.
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What is claimed is: 1 . A dielectric having a composition represented by Bi 2X Mg y Ti z O k , wherein the composition satisfies requirements x≥0.15, y≤0.40, z≥0.25, and x+y+z=1.0, and in the composition, k is a value for maintaining electroneutrality. 2 . The dielectric according to claim 1 , comprising crystalline Bi 2 Ti 2 O 7 . 3 . The dielectric according to claim 1 , comprising at least one selected from the group consisting of crystalline Bi 4 Ti 3 O 12 , crystalline γ—Bi 2 O 3 , and crystalline Bi(Mg 0.5 Ti 0.5 )O 3 . 4 . The dielectric according to claim 1 , comprising at least one selected from the group consisting of crystalline Bi 4 Ti 3 O 12 and crystalline γ—Bi 2 O 3 . 5 . The dielectric according to claim 1 , comprising crystalline γ—Bi 2 O 3 . 6 . The dielectric according to claim 1 , wherein at an electric field strength of 0.5 MV/cm, the dielectric has a dielectric constant of more than 138 when the electric field strength is increased, and the dielectric has a dielectric constant of more than 100 when the electric field strength is decreased. 7 . The dielectric according to claim 1 , wherein at an electric field strength of 0.7 MV/cm, the dielectric has a dielectric constant of more than 138 when the electric field strength is increased, and the dielectric has a dielectric constant of more than 57 when the electric field strength is decreased. 8 . The dielectric according to claim 1 , forming at least one film selected from the group consisting of a pulsed laser deposition film, a vacuum deposition film, a sputtering film, an atomic layer deposition film, a chemical vapor deposition film, and an anodic oxide film. 9 . The dielectric according to claim 1 , being for a capacitor. 10 . A capacitor comprising: a first electrode, the dielectric according to claim 1 disposed on the first electrode; and a second electrode covering at least a portion of the dielectric. 11 . An electrical circuit comprising the capacitor according to claim 10 . 12 . A circuit board comprising the capacitor according to claim 10 . 13 . An apparatus comprising the capacitor according to claim 10 . 14 . An energy storage device comprising the capacitor according to claim 10 .
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