Sensor package

Patent metadata

Field	Value
Publication number	US-2025076143-A1
Application number	US-202418804993-A
Country	US
Kind code	A1
Filing date	Aug 14, 2024
Priority date	Aug 29, 2023
Publication date	Mar 6, 2025
Grant date	—

Abstract

A sensor package is provided. The sensor package includes, but not limited to: a mounting adaptor defining a housing and a port channel connecting with the housing; a sensor assembly positioned in the housing and including a sensing element to sense an ambient environment; a potting material deposited within the housing to encapsulate the sensor assembly; and a locking mechanism positioned in the port channel and configured to clip with the mounting adaptor to prevent seepage of the potting material.

First claim

What is claimed is:

1 . A sensor package, comprising:
a mounting adaptor defining a housing and a port channel connecting with the housing; a sensor assembly positioned in the housing and including a sensing element to sense an ambient environment; a potting material deposited within the housing to encapsulate the sensor assembly; and a locking mechanism positioned in the port channel and configured to clip with the mounting adaptor to prevent seepage of the potting material.

2 . The sensor package according to claim 1 , wherein the sensing element of the sensor assembly is a pressure sensor and is configured to detect a pressure of the ambient environment.

3 . The sensor package according to claim 1 , further comprising a terminal connector positioned outside of the mounting adaptor, and a connection wire that electrically couples the sensing element of the sensor assembly to the terminal connector.

4 . The sensor package according to claim 3 , wherein the locking mechanism comprises at least one crush rib configured to clamp around the connection wire.

5 . The sensor package according to claim 4 , wherein the at least one crush rib is crushing radially against the connection wire to prevent the seepage of the potting material and the moisture ingress to the sensor assembly.

6 . The sensor package according to claim 1 , wherein the locking mechanism comprises at least one dovetail groove configured to secure a corresponding dovetail of the mounting adaptor by sliding the corresponding dovetail of the mounting adaptor into the at least one dovetail groove of the locking mechanism.

7 . The sensor package according to claim 1 , further comprising a hydrophobic filter configured to prevent fluid to pass through the hydrophobic filter to the sensing element of the sensor assembly and reduce moisture ingress to the sensing element.

8 . The sensor package according to claim 7 , wherein the hydrophobic filter is positioned adjacent to the sensing element.

9 . The sensor package according to claim 1 , wherein the sensor assembly comprises a silicone gel formed between the sensing element of the sensor assembly and a plastic housing of the sensor assembly.

10 . The sensor package according to claim 1 , wherein the sensor assembly further comprises an application specific integrated circuit (ASIC) configured to adjust an analog electrical signal detected by the sensing element of the sensor assembly.

11 . The sensor package according to claim 10 , wherein the ASIC is configured to adjust the analog electrical signal detected by the sensing element by converting the analog electrical signal to a digital electrical signal or amplifying the analog electrical signal.

12 . A sensor package, comprising:
a mounting adaptor defining a housing and a port channel connecting with the housing; a sensor assembly positioned in the housing and configured to sense an ambient environment, wherein the port channel is configured to couple a sensing element of the sensor assembly to a connection wire; a cover on the mounting adaptor to seal the sensor assembly in the housing; and a locking mechanism positioned in the port channel and configured to clip with the mounting adaptor and the connection wire to prevent moisture ingress to the sensor assembly.

13 . The sensor package according to claim 12 , wherein the sensing element is a pressure sensor and is configured to detect a pressure of the ambient environment.

14 . The sensor package according to claim 12 , further comprising a terminal connector positioned outside of the mounting adaptor, wherein the connection wire electrically couples the sensing element to the terminal connector.

15 . The sensor package according to claim 12 , wherein the locking mechanism comprises a grommet configured to clamp around the connection wire to seal gaps between the port channel and the connection wire.

16 . The sensor package according to claim 15 , wherein the locking mechanism further comprises a flexible bracket configured to clamp to the mounting adaptor to hold the grommet in place.

17 . The sensor package according to claim 15 , wherein the grommet is made of a rubber material of ethylene propylene diene monomer (EPDM), silicone, or flurosilicone.

18 . The sensor package according to claim 12 , wherein the cover is glued to the mounting adaptor by an adhesive to seal the sensor assembly in the housing.

19 . The sensor package according to claim 12 , wherein the sensing element further comprises an application specific integrated circuit (ASIC) configured to adjust an analog electrical signal detected by the sensing element.

20 . The sensor package according to claim 19 , wherein the ASIC is configured to adjust the analog electrical signal detected by the sensing element by converting the analog electrical signal to a digital electrical signal or amplifying the analog electrical signal.

Assignees

• Honeywell Int Inc

Inventors

• B Manjesh Kumar
• Dumpala Basavaprashant
• Sreeramu Sudheer Beligere
• R Gangaraju

Classifications

• G01L19/148

  Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation · CPC title

• G01L19/142

  Multiple part housings · CPC title

• G01L19/083

  electrical · CPC title

• G01L19/0672

  Leakage or rupture protection or detection · CPC title

• G01L19/0084

  to the outside of the housing (other details about the housing see G01L19/14) · CPC title