Resist composition and resist pattern forming method

US2025068072A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025068072-A1
Application numberUS-202218714343-A
CountryUS
Kind codeA1
Filing dateDec 22, 2022
Priority dateDec 28, 2021
Publication dateFeb 27, 2025
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

A resist composition containing a resin, an acid generator, and a crosslinking agent, in which the resin is an alkali-soluble resin having a molar absorption coefficient of 2,000 mol −1 ·L·cm −1 or less at a wavelength of 248 nm, and the crosslinking agent is at least one of a melamine-based crosslinking agent, a urea-based crosslinking agent, an alkylene urea-based crosslinking agent, a glycoluril-based crosslinking agent, and an epoxy-based crosslinking agent.

First claim

Opening claim text (preview).

What is claimed is: 1 . A resist composition comprising: a resin (A); an acid generator (B); and a crosslinking agent (C), wherein the resin (A) is an alkali-soluble resin having a molar absorption coefficient of 2,000 mol −1 ·L·cm −1 or less at a wavelength of 248 nm, and the crosslinking agent (C) is at least one crosslinking agent selected from the group consisting of a melamine-based crosslinking agent, a urea-based crosslinking agent, an alkylene urea-based crosslinking agent, a glycoluril-based crosslinking agent, and an epoxy-based crosslinking agent. 2 . The resist composition according to claim 1 , wherein the resist composition has a concentration of solid contents of 15% by mass or more. 3 . The resist composition according to claim 1 , wherein a weight average molecular weight of the alkali-soluble resin is less than 4,000. 4 . The resist composition according to claim 1 , wherein the alkali-soluble resin has a constitutional unit (a10) represented by General Formula (a10-1) and a constitutional unit (a20) represented by General Formula (a20-1), wherein R x1 represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, Ya x1 represents a single bond or a divalent linking group, Wa x1 represents an aromatic hydrocarbon group which may have a substituent, n ax1 represents an integer of 1 or more, R x2 represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, Ya x2 represents a divalent linking group, and Ra x2 represents an aliphatic hydrocarbon group. 5 . The resist composition according to claim 4 , wherein a molar ratio of the constitutional unit (a10) to the constitutional unit (a20) in the alkali-soluble resin is in a range of 95:5 to 50:50. 6 . The resist composition according to claim 1 , wherein the acid generator (B) includes a compound (B0) represented by General Formula (b0), wherein X − represents a counter anion, Rb 001 represents an aryl group which may have a substituent, Lb 01 represents a single bond or a divalent linking group, Yb 01 represents a group that forms an aliphatic ring together with a sulfur atom in the formula, and the aliphatic ring formed by the sulfur atom and Yb 01 in the formula may have a substituent. 7 . A resist pattern forming method comprising: forming a resist film on a support using the resist composition according to claim 1 ; exposing the resist film; and developing the exposed resist film to form a resist pattern.

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Classifications

  • Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title

  • with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

  • Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

  • G03F7/004Primary

    Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title

  • Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title

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What does patent US2025068072A1 cover?
A resist composition containing a resin, an acid generator, and a crosslinking agent, in which the resin is an alkali-soluble resin having a molar absorption coefficient of 2,000 mol −1 ·L·cm −1 or less at a wavelength of 248 nm, and the crosslinking agent is at least one of a melamine-based crosslinking agent, a urea-based crosslinking agent, an alkylene urea-based crosslinking agent, a glyco…
Who is the assignee on this patent?
Tokyo Ohka Kogyo Co Ltd
What technology area does this patent fall under?
Primary CPC classification G03F7/004. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Feb 27 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).