Metal particles for adhesive paste, solder paste composition including the same, and method of preparing metal particles for adhesive paste

Patent metadata

Field	Value
Publication number	US-2025066644-A1
Application number	US-202418942851-A
Country	US
Kind code	A1
Filing date	Nov 11, 2024
Priority date	Jan 26, 2021
Publication date	Feb 27, 2025
Grant date	—

Abstract

Provided are metal particles for an adhesive paste, a solder paste composition including the same, and a method of preparing the metal particles for an adhesive paste. The metal particles for an adhesive paste may include a core including one or more metal materials; and a shell arranged on part or an entirety of the core and including one or more metal materials. The metal material of the core may have a melting point higher than that of the metal material of the shell. An intermetallic compound is capable of being formed between the metal material of the core and the metal material of the shell. A ratio (D90/D10) of the 90% cumulative mass particle size distribution (D90 size) to the 10% cumulative mass particle size distribution (D10 size) in a particle size distribution of the metal particles may be 1.22 or less.

First claim

What is claimed is:

1 . A method of preparing the metal particles for an adhesive paste, the method comprising:
defining, on a first photoresist layer formed on a substrate, a region where core-shell metal particles are to be formed, through exposure with a first mask; forming a multilayer structure consisting of a first shell layer-core layer-second shell layer by applying a first shell metal material, a core metal material, and a second shell metal material on the region where the core-shell metal particles are to be formed, to; and developing the multilayer structure to prepare core-shell metal particles, and wherein the metal particles for an adhesive paste, comprising metal particles having a core-shell structure comprising: a core including one or more metal materials; and a shell on part or an entirety of the core and including one or more metal materials, wherein the one or more metal materials of the core has a melting point higher than that of the one or more metal materials of the shell, an intermetallic compound is capable of being formed between the one or metal materials of the core and the one or more metal materials of the shell, and wherein the core-shell metal particles have a variable size of less than 100 μm.

2 . The method of claim 1 , wherein, in the forming the multilayer structure, a first shell metal material, a core metal material, and a second shell metal material are sequentially applied on the region where the core-shell metal particles are to be formed, to form the multilayer structure consisting of the first shell layer-core layer-second shell layer.

3 . The method of claim 1 , wherein the forming the multilayer structure comprises:
applying, on the region where the core-shell metal particles are to be formed, a first shell metal material and a core metal material to form a first multilayer structure comprising of a first shell layer-core layer; forming a second photoresist layer on the first multilayer structure and defining a region where a second multilayer structure comprising of a first shell layer-core layer-second shell layer is to be formed, by exposure with a second mask on the second photoresist layer; and applying, on the region where the second multilayer structure is to be formed, a second shell metal material to form the multilayer structure comprising of the first shell layer-core layer-second shell layer.

4 . The method of claim 1 , wherein the core includes a metal material selected from tin, nickel, copper, gold, silver, germanium, antimony, aluminum, titanium, palladium, zinc, or an alloy thereof.

5 . The method of claim 1 , wherein the shell includes a metal material selected from indium, gallium, silver, bismuth, zinc, or an alloy thereof.

6 . The method of claim 1 , wherein
the core includes copper, and the shell has a monolayer or multilayer structure of indium, silver, or a combination thereof.

7 . The method of claim 1 , wherein
the core includes a tin-silver-copper alloy, and the shell has a monolayer or multilayer structure of tin, bismuth, or a combination thereof.

8 . The method of claim 1 , wherein a void is not present in an interface region between the core and the shell.

9 . The method of claim 1 , wherein a cross-section of the core-shell metal particles has a circular shape, an oval shape, a rectangular shape, a square shape, a pentagonal shape, a hexagonal shape, or a higher polygonal shape.

10 . The method of claim 1 , wherein an aspect ratio of a height to length of a cross-section of the core is 0.5 to 4.

11 . The method of claim 1 , wherein the shell has a thickness of 10 nm to less than 100 μm.

12 . The method of claim 1 , wherein a ratio (D90/D10) of a 90% cumulative mass particle size distribution (D90 size) to a 10% cumulative mass particle size distribution (D10 size) in a particle size distribution of the core-shell metal particles is 1.22 or less.

13 . The method of claim 1 , further comprising:
a barrier layer between the core and the shell.

14 . The method of claim 13 , wherein the barrier layer includes nickel.

15 . The method of claim 1 , wherein the exposure is performed with ArF (193 nm), KrF (248 nm), ArF+ immersion (38 nm), EUV (13.5 nm), vacuum ultraviolet (VUV), E-beams, X-rays, or ion beams.

16 . A method of preparing the metal particles for an adhesive paste, the method comprising:
defining, on a first photoresist layer formed on a substrate, a region where core-shell metal particles are to be formed, through exposure with a first mask; forming a core by applying a core metal material on a region where a core is to be formed, and performing exposure and development; forming a second photoresist layer on the core and defining, on the second photoresist layer, a region where a shell is to be formed, by exposure with a second mask that is thicker than a thickness of the first mask; and applying, on the region where the shell is to be formed, a shell metal material, followed by development to prepare the core-shell metal particles, and wherein the metal particles for an adhesive paste, comprising metal particles having a core-shell structure comprising: a core including one or more metal materials; and a shell on part or an entirety of the core and including one or more metal materials, wherein the one or more metal materials of the core has a melting point higher than that of the one or more metal materials of the shell, an intermetallic compound is capable of being formed between the one or metal materials of the core and the one or more metal materials of the shell, and wherein the core-shell metal particles have a variable size of less than 100 μm.

17 . The method of claim 16 , wherein a thickness of the second mask is thicker than a thickness of the first mask by an amount in a range of 10 nm to 100 μm.

18 . The method of claim 16 , wherein the exposure is performed with ArF (193 nm), KrF (248 nm), ArF+ immersion (38 nm), EUV (13.5 nm), vacuum ultraviolet (VUV), E-beams, X-rays, or ion beams.

19 . A solder paste composition comprising:
the metal particles prepared by the method of claim 1 .

20 . A solder paste composition comprising:
the metal particles prepared by the method of claim 15 .

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Junghoon
• Song Byonggwon
• Chu Kunmo

Classifications

• B22F2301/052

  Aluminium · CPC title

• B22F2301/10

  Copper · CPC title

• B22F2301/30

  Low melting point metals, i.e. Zn, Pb, Sn, Cd, In, Ga · CPC title

• B22F2301/25

  Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru · CPC title

• B22F1/052

  characterised by a mixture of particles of different sizes or by the particle size distribution · CPC title