Method for manufacturing josephson junction device and method for manufacturing qubit

Patent metadata

Field	Value
Publication number	US-2025057052-A1
Application number	US-202418930149-A
Country	US
Kind code	A1
Filing date	Oct 29, 2024
Priority date	Jun 17, 2022
Publication date	Feb 13, 2025
Grant date	—

Abstract

A method for manufacturing a Josephson junction device, includes: forming, on a substrate, a mask layer where mask patterns are arranged in a first direction, each pattern having a first opening extending in the first direction and a second opening extending in a second direction intersecting the first direction and the first opening; forming, using the mask layer, a first film by first film formation from obliquely above in the first direction, and then forming a second film by second film formation from obliquely above in a direction different from the first film formation, and forming a superconducting film including the first and second films; forming an insulating film on the superconducting film; and forming a third film overlapping the superconducting film via the insulating film by third film formation from obliquely above in the second direction, and forming another superconducting film including the third film.

First claim

What is claimed is:

1 . A method for manufacturing a Josephson junction device, comprising:
forming, on a substrate, a mask layer in which a plurality of mask patterns, each of which has a first opening that extends in a first direction and a second opening that extends in a second direction that intersects the first direction and that intersects the first opening, is arranged in the first direction; forming, using the mask layer as a mask, a first film above the substrate by first film formation from obliquely above in the first direction, and forming, after the forming the first film, a second film above the substrate by second film formation from obliquely above in a direction different from the direction of the first film formation relative to the substrate, and forming a first superconducting film that includes the first film and the second film; forming an insulating film on a surface of the first superconducting film; and forming, using the mask layer as a mask, a third film that has a region in which the third film overlaps the first superconducting film via the insulating film above the substrate by third film formation from obliquely above in the second direction, and forming a second superconducting film that includes the third film.

2 . The method for manufacturing a Josephson junction device according to claim 1 , wherein
the first film formation and the second film formation are oblique deposition, and a distance from a deposition source to a center of the substrate in the first film formation is 95% or more and 105% or less of a distance from the deposition source to the center of the substrate in the second film formation.

3 . The method for manufacturing a Josephson junction device according to claim 2 , wherein an angle at which the deposition material is incident to the center of the substrate in the first film formation is 70% or more and 130% or less of an angle at which the deposition material is incident to the center of the substrate in the second film formation.

4 . The method for manufacturing a Josephson junction device according to claim 2 , wherein, in the forming the first superconducting film, the first film and the second film are formed such that a thickness of the second film at the center of the substrate is 97% or more and 103% or less of a thickness of the first film at the center of the substrate.

5 . The method for manufacturing a Josephson junction device according to claim 1 , wherein, in the forming the second superconducting film, after the third film is formed by the third film formation, a fourth film is formed above the substrate by fourth film formation from obliquely above in a direction different from the direction of the third film formation by 180°±5°, and the second superconducting film that includes the third film and the fourth film is formed.

6 . The method for manufacturing a Josephson junction device according to claim 1 , wherein, in the forming the mask layer, the mask layer that includes an upper layer in which the first opening and the second opening are formed and a lower layer which is positioned below the first opening and the second opening and has a larger gap than the first opening and the second opening in plan view is formed.

7 . The method for manufacturing a Josephson junction device according to claim 1 , wherein the second film formation is executed from a direction different from the direction of the first film formation by 180°±5° in plan view of a surface of the substrate.

8 . A method for manufacturing a qubit, comprising:
forming a Josephson junction device; and forming a capacitor coupled in parallel to the Josephson junction device. wherein the forming the Josephson junction device includes: forming, on a substrate, a mask layer in which a plurality of mask patterns, each of which has a first opening that extends in a first direction and a second opening that extends in a second direction that intersects the first direction and that intersects the first opening, is arranged in the first direction; forming, using the mask layer as a mask, a first film above the substrate by first film formation from obliquely above in the first direction, and forming, after the forming the first film, a second film above the substrate by second film formation from obliquely above in a direction different from the direction of the first film formation relative to the substrate, and forming a first superconducting film that includes the first film and the second film; forming an insulating film on a surface of the first superconducting film; and forming, using the mask layer as a mask, a third film that has a region in which the third film overlaps the first superconducting film via the insulating film above the substrate by third film formation from obliquely above in the second direction, and forming a second superconducting film that includes the third film.

Assignees

• Fujitsu Ltd

Inventors

• Takahashi Tsuyoshi

Classifications

• H10N60/12

  Josephson-effect devices · CPC title

• H10N69/00

  Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00 · CPC title

• H10N60/0912 Primary

  of Josephson-effect devices · CPC title

• H10N60/805

  for Josephson-effect devices · CPC title