Heat dissipation module and electronic device including the same

Patent metadata

Field	Value
Publication number	US-2025056760-A1
Application number	US-202418666580-A
Country	US
Kind code	A1
Filing date	May 16, 2024
Priority date	Aug 7, 2023
Publication date	Feb 13, 2025
Grant date	—

Abstract

Provided herein may be a heat dissipation module including a first planar component, a partition wall coupled to the first planer component and defining a first path having one side closed by the first planar component, the first path forming a closed loop, and working fluid disposed in the first path. The heat dissipation module and an electronic device including the heat dissipation module in accordance with embodiments may be improved in heat dissipation efficiency.

First claim

What is claimed is:

1 . A heat dissipation module comprising:
a first planar component; a partition wall coupled to the first planer component and defining a first path having one side closed by the first planer component, the first path forming a closed loop; and working fluid disposed in the first path.

2 . The heat dissipation module according to claim 1 , further comprising a second planar component coupled to the partition wall with the partition wall disposed between the first planar component and the second planar component, and defining a second path disposed between the partition wall and the second planar component,
wherein the second path communicates with an outside of the heat dissipation module.

3 . The heat dissipation module according to claim 2 , wherein the first planar component includes a first surface and the second planar component includes a second surface.

4 . The heat dissipation module according to claim 2 ,
wherein the partition wall is disposed to be inclined with respect to the first surface and the second surface, wherein the first path has a width of a third dimension disposed adjacent to the first surface and has a width of a fourth dimension less than the third dimension and disposed adjacent to the second surface, and wherein the second path has a width of a fifth dimension disposed adjacent to the first surface and has a width of a sixth dimension greater than the fifth dimension and disposed adjacent to the second surface.

5 . The heat dissipation module according to claim 4 , wherein an inclined angle formed between the partition and the first surface in an area corresponding to the first path is an acute angle.

6 . The heat dissipation module according to claim 5 ,
wherein the partition wall includes at least two stepped portions, wherein the first path has a width of a seventh dimension disposed between the first surface and the second surface and the seventh dimension is less than the third dimension and greater than the fourth dimension, and wherein the second path has a width of an eighth dimension disposed between the first surface and the second surface and the eighth dimension is greater than the fifth dimension and less than the sixth dimension.

7 . The heat dissipation module according to claim 2 , wherein the partition wall includes an opening in an area facing away from the first planar component and the second path communicates with the outside of the heat dissipation module through the opening.

8 . The heat dissipation module according to claim 2 , wherein the first path has a width of a first dimension and the second path has a width of a second dimension less than the first dimension.

9 . The heat dissipation module according to claim 2 , wherein the first planar component includes a first surface, and the second planar component includes a second surface,
wherein the partition wall includes one or more stepped portions, wherein the first path has a width of a third dimension disposed adjacent to the first surface and has a width of a fourth dimension less than the third dimension and disposed adjacent to the second surface, and wherein the second path has a width of a fifth dimension disposed adjacent to the first surface and has a width of a sixth dimension less than the fifth dimension and disposed adjacent to the second surface.

10 . The heat dissipation module according to claim 1 , wherein the working fluid includes liquid and an air layer.

11 . The heat dissipation module according to claim 10 , wherein a volume of the liquid in the working fluid is 20% or more and less than 100%.

12 . The heat dissipation module according to claim 1 , further comprising a second planar component coupled to the partition wall and defining a second path disposed between the partition wall and the second planar component,
wherein the second planar component includes a hole that exposes at least a portion of the second path.

13 . An electronic device comprising:
a display panel including a plurality of pixels arranged to display an image on a front surface of the display panel; and a heat dissipation module disposed on a rear surface of the display panel, wherein the heat dissipation module comprises: a first planar component facing the rear surface of the display panel; a partition wall coupled to the first planar component and defining a first path one side of which is closed by the first planar component, and a second path spaced apart from the first path and communicating with an outside of the dissipation module, the first path forming a closed loop; and working fluid disposed in the first path.

14 . The electronic device according to claim 13 , further comprising an adhesive component attached to the rear surface of the display panel, and configured to attach the rear surface of the display panel to the first planar component of the heat dissipation module.

15 . The electronic device according to claim 13 , wherein the first planar component includes a first surface connected to the partition wall and the second planar component including a second surface connected to the partition wall.

16 . The electronic device according to claim 15 ,
wherein the partition wall is disposed to be inclined with respect to the first surface and the second surface, wherein the first path has a width of a third dimension disposed adjacent to the first surface and has a width of a fourth dimension less than the third dimension and disposed adjacent to the second surface, and wherein the second path has a width of a fifth dimension disposed adjacent to the first surface and has a width of a sixth dimension greater than the fifth dimension and disposed adjacent to the second surface.

17 . The electronic device according to claim 15 ,
wherein the partition wall includes at least one stepped portions, wherein the first path has a width of a third dimension disposed adjacent to the first surface and has a width of a fourth dimension less than the third dimension and disposed adjacent to the second surface, and wherein the second path has a width of a fifth dimension disposed adjacent to the first surface and has a width of a sixth dimension greater than the fifth dimension and disposed adjacent to the second surface.

18 . The electronic device according to claim 15 , wherein the partition wall includes an opening in an area facing away from the first planar surface and the opening connects the second path to the outside of the heat dissipation module.

19 . The electronic device according to claim 13 , wherein the first path has a width of a first dimension and the second path has a width of a second dimension less than the first dimension.

20 . The electronic device according to claim 13 , further comprising a second planar component facing the first planar component with the partition wall disposed between the first planar component and the second planar component,
wherein the second planar component includes a hole that exposes at least a portion of the second path.

Assignees

• Samsung Display Co Ltd

Inventors

• Son Jun Hee
• Park Haeng Won
• Oh Hyun Joon
• Lee Jee Na

Classifications

• H05K7/20009

  using a gaseous coolant in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title

• H05K7/20272 Primary

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K7/202

  Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers · CPC title

• H05K7/20981 Primary

  Liquid coolant without phase change · CPC title

• H05K7/2099

  Liquid coolant with phase change · CPC title