Electronic component module and wireless communication device comprising same

Patent metadata

Field	Value
Publication number	US-2025055176-A1
Application number	US-202418930062-A
Country	US
Kind code	A1
Filing date	Oct 29, 2024
Priority date	May 24, 2022
Publication date	Feb 13, 2025
Grant date	—

Abstract

An electronic component module includes a first substrate, a coupling electrode and a second substrate. The coupling electrode is provided on a first surface of the first substrate, the coupling electrode is configured to be electromagnetically coupled with a conductor pattern on an antenna member. The second substrate is provided on the first surface of the first substrate, the second substrate covers the coupling electrode. A first thermal resistance between the coupling electrode and the second substrate is smaller than a second thermal resistance between the coupling electrode and the first substrate.

First claim

What is claimed is:

1 . An electronic component module, comprising:
a first substrate; a coupling electrode on a first surface of the first substrate, the coupling electrode being configured to be electromagnetically coupled with a conductor pattern on an antenna member; and a second substrate on the first surface of the first substrate, the second substrate covering the coupling electrode, wherein a first thermal resistance between the coupling electrode and the second substrate is smaller than a second thermal resistance between the coupling electrode and the first substrate.

2 . The electronic component module according to claim 1 , further comprising a layer of a hot melt adhesive on a surface of the second substrate that is opposite to a surface of the second substrate that faces the first substrate.

3 . The electronic component module according to claim 1 , wherein conductive particles are dispersed into the second substrate.

4 . The electronic component module according to claim 1 , wherein the second substrate comprises a second material having a thermal conductivity that is higher than a thermal conductivity of a first material of the first substrate.

5 . The electronic component module according to claim 1 , wherein the second substrate is a layer of a hot melt adhesive.

6 . The electronic component module according to claim 1 , wherein the first substrate comprises a material having a first light absorption rate that is lower than a second light absorption rate of the coupling electrode.

7 . The electronic component module according to claim 1 , further comprising:
an integrated circuit (IC) chip on a second surface of the first substrate opposite to the first surface and being electrically connected to the coupling electrode, wherein the IC chip is on the second surface without overlapping the coupling electrode in a plan view of the first substrate.

8 . A wireless communication device, comprising:
an antenna member including an antenna pattern; and an electronic component module having a first substrate, a second substrate and a coupling electrode between the first substrate and the second substrate, wherein:
a first thermal resistance between the coupling electrode and the second substrate is smaller than a second thermal resistance between the coupling electrode and the first substrate;
the second substrate is stuck to the antenna member via a hot melt adhesive; and
the coupling electrode is electromagnetically coupled with the antenna pattern of the antenna member.

9 . The wireless communication device according to claim 8 , wherein the electronic component module comprises a layer of the hot melt adhesive that is on a surface of the second substrate that is opposite to a surface of the second substrate that faces the first substrate.

10 . The wireless communication device according to claim 8 , wherein conductive particles are dispersed into the second substrate.

11 . The wireless communication device according to claim 8 , wherein the second substrate comprises a second material having a thermal conductivity that is higher than a thermal conductivity of a first material of the first substrate.

12 . The wireless communication device according to claim 8 , wherein the second substrate is a layer of the hot melt adhesive.

13 . The wireless communication device according to claim 8 , wherein the first substrate comprises a material having a first light absorption rate that is lower than a second light absorption rate of the coupling electrode.

14 . The wireless communication device according to claim 8 , wherein the electronic component module further comprises an integrated circuit (IC) chip on an opposite surface of the first substrate from the coupling electrode without overlapping the coupling electrode in a plan view of the first substrate, the IC being electrically connected to the coupling electrode.

15 . An electronic component module, comprising:
a first substrate; a second substrate; and at least a coupling electrode between the first substrate and the second substrate, wherein the second substrate is configured to be stuck to an antenna member via a hot melt adhesive, and cause the coupling electrode to be electromagnetically coupled with an antenna pattern of the antenna member, and wherein a first thermal resistance between the coupling electrode and the second substrate is smaller than a second thermal resistance between the coupling electrode and the first substrate.

16 . The electronic component module according to claim 15 , wherein the electronic component module comprises a layer of the hot melt adhesive that is on a surface of the second substrate that is opposite to a surface of the second substrate that faces the first substrate.

17 . The electronic component module according to claim 15 , wherein conductive particles are dispersed into the second substrate.

18 . The electronic component module according to claim 15 , wherein the second substrate comprises a second material having a higher thermal conductivity than a thermal conductivity of a first material of the first substrate.

19 . The electronic component module according to claim 15 , wherein the second substrate is a layer of the hot melt adhesive.

20 . The electronic component module according to claim 15 , wherein the first substrate comprises a material having a first light absorption rate that is lower than a second light absorption rate of the coupling electrode.

Assignees

• Murata Manufacturing Co

Inventors

• Yamawaki Yoshinori
• Kato Noboru
• Washida Ryosuke
• Saito Yoichi
• Kasai Masaki

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/40

  characterised by their materials · CPC title

• H01Q9/285

  Planar dipole (H01Q9/065 takes precedence; patch antenna H01Q9/0407) · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title