Fluid immersion cooling system

Patent metadata

Field	Value
Publication number	US-2025040090-A1
Application number	US-202418783198-A
Country	US
Kind code	A1
Filing date	Jul 24, 2024
Priority date	Jul 24, 2023
Publication date	Jan 30, 2025
Grant date	—

Abstract

The present application provides a fluid immersion cooling system, including a housing, a circuit board and a partition. There are a plurality of circuit boards, the plurality of circuit boards are spaced apart from each other in an accommodating cavity and are all located at a bottom of the housing, and a side of the circuit board close to the bottom of the housing is provided with a guide hole. There are a plurality of partitions, and one partition is located between two adjacent circuit boards and spaced apart from the corresponding circuit board. Areas between the partitions and the circuit boards, top areas of the partitions and the guide holes together form a continuously bent flow channel for the cooling liquid to flow.

First claim

What is claimed is:

1 . A fluid immersion cooling system, comprising a housing, a circuit board and a partition, wherein the housing has an accommodating cavity, and the accommodating cavity is configured for accommodating cooling liquid; there are a plurality of circuit boards, the plurality of circuit boards are spaced apart from each other in the accommodating cavity and are all located at a bottom of the housing, and a side of the circuit board close to the bottom of the housing is provided with a guide hole; there are a plurality of partitions, and one partition is located between two adjacent circuit boards and spaced apart from the corresponding circuit board;
areas between the partitions and the circuit boards, top areas of the partitions and the guide holes together form a continuously bent flow channel for the cooling liquid to flow.

2 . The fluid immersion cooling system according to claim 1 , wherein a chip is provided on the circuit board, a surface on which the chip is provided on the circuit board is a front surface, a surface on which the chip is not provided is a back surface, and a distance between the front surface and a corresponding partition is greater than a distance between the back surface and a corresponding partition.

3 . The fluid immersion cooling system according to claim 2 , wherein the distance between the front surface and the corresponding partition is A, the distance between the back surface and the corresponding partition is B, and a relationship between A and B is:

A
B

≥
4

,

A
≥

4
⁢

mm
.

4 . The fluid immersion cooling system according to claim 3 , wherein a side of the partition away from the bottom of the housing is spaced apart from an inner wall of a top of the housing;
a side of the circuit board away from the bottom of the housing is spaced apart from the inner wall of the top of the housing, or, the side of the circuit board away from the bottom of the housing is closely arranged with the inner wall of the top of the housing.

5 . The fluid immersion cooling system according to claim 3 , wherein in a direction perpendicular to an extending direction of the circuit board, an orthographic projection of the partition on the housing at least covers an orthographic projection of the circuit board on the housing.

6 . The fluid immersion cooling system according to claim 3 , wherein there are a plurality of guide holes, and the plurality of guide holes are spaced apart from each other in an array on the circuit board.

7 . The fluid immersion cooling system according to claim 2 , wherein one circuit board is provided with a plurality of chips, and the plurality of chips are spaced apart from each other in an array on the circuit board;
the fluid immersion cooling system further comprises a heat conducting member, and there are a plurality of heat conducting members; the plurality of heat conducting members correspond to the plurality of chips and are provided on a side of the corresponding chips away from the circuit board.

8 . The fluid immersion cooling system according to claim 7 , wherein the heat conducting member comprises a metal member or graphite, and the heat conducting member at least covers a part of the corresponding chip.

9 . The fluid immersion cooling system according to claim 8 , wherein a side of the partition away from the bottom of the housing is spaced apart from an inner wall of a top of the housing;
a side of the circuit board away from the bottom of the housing is spaced apart from the inner wall of the top of the housing, or, the side of the circuit board away from the bottom of the housing is closely arranged with the inner wall of the top of the housing.

10 . The fluid immersion cooling system according to claim 8 , wherein in a direction perpendicular to an extending direction of the circuit board, an orthographic projection of the partition on the housing at least covers an orthographic projection of the circuit board on the housing.

11 . The fluid immersion cooling system according to claim 7 , wherein a side of the partition away from the bottom of the housing is spaced apart from an inner wall of a top of the housing;
a side of the circuit board away from the bottom of the housing is spaced apart from the inner wall of the top of the housing, or, the side of the circuit board away from the bottom of the housing is closely arranged with the inner wall of the top of the housing.

12 . The fluid immersion cooling system according to claim 7 , wherein in a direction perpendicular to an extending direction of the circuit board, an orthographic projection of the partition on the housing at least covers an orthographic projection of the circuit board on the housing.

13 . The fluid immersion cooling system according to claim 2 , wherein a side of the partition away from the bottom of the housing is spaced apart from an inner wall of a top of the housing;
a side of the circuit board away from the bottom of the housing is spaced apart from the inner wall of the top of the housing, or, the side of the circuit board away from the bottom of the housing is closely arranged with the inner wall of the top of the housing.

14 . The fluid immersion cooling system according to claim 2 , wherein in a direction perpendicular to an extending direction of the circuit board, an orthographic projection of the partition on the housing at least covers an orthographic projection of the circuit board on the housing.

15 . The fluid immersion cooling system according to claim 2 , wherein there are a plurality of guide holes, and the plurality of guide holes are spaced apart from each other in an array on the circuit board.

16 . The fluid immersion cooling system according to claim 1 , wherein a side of the partition away from the bottom of the housing is spaced apart from an inner wall of a top of the housing;
a side of the circuit board away from the bottom of the housing is spaced apart from the inner wall of the top of the housing, or, the side of the circuit board away from the bottom of the housing is closely arranged with the inner wall of the top of the housing.

17 . The fluid immersion cooling system according to claim 1 , wherein in a direction perpendicular to an extending direction of the circuit board, an orthographic projection of the partition on the housing at least covers an orthographic projection of the circuit board on the housing.

18 . The fluid immersion cooling system according to claim 1 , wherein there are a plurality of guide holes, and the plurality of guide holes are spaced apart from each other in an array on the circuit board.

19 . The fluid immersion cooling system according to claim 1 , further comprising an internal condenser tube and an external condenser tube which are communicated with each other; the internal condenser tube is located in the accommodating cavity and is arranged close to a top of the housing; the external condenser tube is located outside the housing and is communicated with the internal condenser tube.

20 . T

Assignees

• Bitmain Tech Inc

Inventors

• Yang Yinchuang
• Li Minghao
• Zeng Zhaoxiang
• Pi Te
• Nie Zesen

Classifications

• H05K7/20809

  within server blades for removing heat from heat source · CPC title

• H05K7/203 Primary

  by immersion · CPC title

• H05K7/20327

  Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K7/20318

  Condensers · CPC title

• H05K7/2029

  using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title