Programmable SiPM Arrays

Patent metadata

Field	Value
Publication number	US-2025035800-A1
Application number	US-202418918915-A
Country	US
Kind code	A1
Filing date	Oct 17, 2024
Priority date	Sep 20, 2019
Publication date	Jan 30, 2025
Grant date	—

Abstract

The present disclosure relates to devices, systems, and methods relating to configurable silicon photomultiplier (SiPM) devices. An example device includes a substrate and a plurality of single photon avalanche diodes (SPADs) coupled to the substrate. The device also includes a plurality of outputs coupled to the substrate and a plurality of electrical components coupled to the substrate. The plurality of electrical components are configured to selectively connect the plurality of SPADs to the plurality of outputs by selecting which output of the plurality of outputs is connected to each SPAD of the plurality of SPADs and to thereby define a plurality of SiPMs in the device such that each SiPM of the plurality of SiPMs comprises a respective set of one or more SPADs connected to a respective output of the plurality of outputs.

First claim

What is claimed is:

1 . A method of manufacturing a LIDAR system, the method comprising:
providing at least one light-emitter device; providing a receiver subsystem, wherein the receiver subsystem comprises:
a substrate;
a plurality of single photon avalanche diodes (SPADs) coupled to the substrate;
a plurality of outputs coupled to the substrate; and
a plurality of electrical components coupled to the substrate; and
coupling the receiver subsystem to the at least one light-emitter device, wherein the plurality of electrical components are configured to selectively connect the plurality of SPADs to the plurality of outputs so as to optically align at least a portion of the SPADs to the at least one light-emitter device.

2 . The method of claim 1 , further comprising selectively connecting the plurality of SPADs to the plurality of outputs so as to define a plurality of silicon photomultipliers (SiPMs) in the device such that each SiPM of the plurality of SiPMs comprises a respective set of one or more SPADs connected to a respective output of the plurality of outputs.

3 . The method of claim 2 , further comprising:
receiving, via a reference detector, information indicative of a light intensity, wherein selectively coupling the plurality of SPADs to the plurality of outputs is based on the received information.

4 . The method of claim 3 , wherein selectively coupling the plurality of SPADs to the plurality of outputs is performed so as to achieve a desired mapping of respective SPADs to respective optical channels.

5 . The method of claim 2 , wherein selectively connecting the plurality of SPADs to the plurality of outputs occurs only a single time.

6 . The method of claim 2 , wherein selectively connecting the plurality of SPADs to the plurality of outputs occurs in a dynamic fashion.

7 . The method of claim 1 , wherein the electrical components comprise transistors.

8 . The method of claim 1 , wherein the electrical components comprise severable connections.

9 . The method of claim 7 , wherein the severable connections comprise at least one of: a switch, a fuse, or a laser-trimmable trace.

10 . The method of claim 1 , wherein coupling the receiver subsystem to the at least one light-emitter device comprises an alignment-free assembly process.

11 . The method of claim 1 , further comprising pre-assembling a first portion of the LIDAR with the at least one light-emitter device prior to coupling the receiver subsystem to the at least one light-emitter device.

12 . The method of claim 1 , wherein the substrate comprises at least one of: silicon, gallium arsenide, silicon-on-insulator, or a printed circuit board.

13 . The method of claim 1 , wherein the light-detecting elements comprise at least one of:
silicon, germanium, GaAs, AlGaAs, InGaAs, InP, or InGaAsP.

14 . A method of manufacturing a LIDAR system, the method comprising:
providing a first LIDAR element, wherein the first LIDAR element corresponds to at least one LIDAR type; providing a SPAD detector array, wherein the SPAD detector array comprises:
a plurality of single photon avalanche diodes (SPADs) coupled to the substrate;
a plurality of outputs coupled to the substrate; and
a plurality of electrical components coupled to the substrate; and
coupling the SPAD detector array to the first LIDAR element, wherein the plurality of electrical components are configured to selectively connect the plurality of SPADs to the plurality of outputs so as to optically align at least a portion of the SPADs to the at least one first LIDAR element.

15 . The method of claim 14 , further comprising selectively connecting the plurality of SPADs to the plurality of outputs so as to define a plurality of silicon photomultipliers (SiPMs) in the device such that each SiPM of the plurality of SiPMs comprises a respective set of one or more SPADs connected to a respective output of the plurality of outputs.

16 . The method of claim 14 further comprising:
receiving, via a reference detector, information indicative of a light intensity, wherein selectively coupling the plurality of SPADs to the plurality of outputs is based on the received information.

17 . The method of claim 14 , further comprising selecting the first LIDAR element from among a plurality of different LIDAR elements.

18 . The method of claim 17 , wherein the plurality of different LIDAR elements comprises at least one of: a low spatial resolution LIDAR or a high spatial resolution LIDAR.

19 . The method of claim 17 , wherein the plurality of different LIDAR elements comprises at least one of: good low-light capability or poor low-light capability.

20 . The method of claim 14 , wherein the method reduces cost and complexity of the LIDAR system while improving serviceability and product life.

Assignees

• Waymo Llc

Inventors

• Verghese Simon
• Onal Caner
• Droz Pierre-Yves

Classifications

• G01S17/90

  using synthetic aperture techniques · CPC title

• G01T1/2018

  Scintillation-photodiode combinations · CPC title

• G01T1/208

  Circuits specially adapted for scintillation detectors, e.g. for the photo-multiplier section · CPC title

• G01T1/2985

  In depth localisation, e.g. using positron emitters; Tomographic imaging (longitudinal and transverse section imaging; apparatus for radiation diagnosis sequentially in different planes, steroscopic radiation diagnosis); (using external radiation sources A61B6/02) · CPC title

• G01S17/10

  using transmission of interrupted, pulse-modulated waves (determination of distance by phase measurements G01S17/32) · CPC title