Epoxy resin composition, cured product, encapsulant and adhesive

Patent metadata

Field	Value
Publication number	US-2025034319-A1
Application number	US-202218713564-A
Country	US
Kind code	A1
Filing date	Dec 26, 2022
Priority date	Dec 28, 2021
Publication date	Jan 30, 2025
Grant date	—

Abstract

Provided is an epoxy resin composition containing (A) epoxy resin, and (B) a heteroatom-containing curing agent, wherein molecular weight α of the heteroatom-containing curing agent (B) is 200≤α≤1200, and ratio α/β of the molecular weight α to number β of heteroatoms in a structure of the heteroatom-containing curing agent (B) is 30≤α/β≤95.

First claim

1 . An epoxy resin composition comprising
(A) epoxy resin, and (B) a heteroatom-containing curing agent, wherein molecular weight α of the heteroatom-containing curing agent (B) is 200≤α≤1200, and ratio α/β of the molecular weight α to number β of heteroatoms in a structure of the heteroatom-containing curing agent (B) is 30≤α/β≤95.

2 . The epoxy resin composition according to claim 1 , wherein the heteroatom-containing curing agent (B) comprises an aminimide compound represented by the following formula (1), (2) or (3):

wherein each R 1 independently represents a hydrogen atom, or a monovalent or n-valent organic group having 1 to 15 carbon atoms and optionally having a hydroxy group, a carbonyl group, an ester bond, or an ether bond; R 2 and R 3 each independently represent an unsubstituted or substituted alkyl group having 1 to 12 carbon atoms, aryl group, aralkyl group, or heterocyclic ring having 7 or less carbon atoms in which R 2 and R 3 are linked to each other; each R 4 independently represents a hydrogen atom, or a monovalent or n-valent organic group having 1 to 30 carbon atoms and optionally containing an oxygen atom; and n represents an integer of 1 to 3.

3 . The epoxy resin composition according to claim 2 , wherein the n in the formula (2) or (3) is 2 or 3.

4 . The epoxy resin composition according to claim 1 , further comprising (C) an inorganic filler.

5 . The epoxy resin composition according to claim 4 , wherein a content of the inorganic filler (C) is more than 5% by mass and 98% by mass or less based on the whole epoxy resin composition.

6 . The epoxy resin composition according to claim 1 , further comprising (D) a stabilizer.

7 . The epoxy resin composition according to claim 6 , wherein the stabilizer (D) comprises a compound represented by the following formula (A) or (B):

wherein R 5 and R 6 each independently represent a hydrogen atom, or a monovalent or n-valent organic group having 1 to 15 carbon atoms and optionally having a hydroxy group, a carbonyl group, an ester bond, or an ether bond; and n represents an integer of 2 to 3,

wherein R 7 represents a monovalent or n-valent organic group having 1 to 15 carbon atoms and optionally having a hydroxy group, a carbonyl group, an ester bond, or an ether bond; and n represents an integer of 2 to 3.

8 . The epoxy resin composition according to claim 6 , wherein a content of the stabilizer (D) is 1 part by mass or more and 30 parts by mass or less based on 100 parts by mass of the epoxy resin (A).

9 . A cured product of the epoxy resin composition according to claim 1 .

10 . An encapsulant comprising the cured product according to claim 9 .

11 . The encapsulant according to claim 10 , wherein the encapsulant is an encapsulant for a semiconductor.

12 . An adhesive comprising the epoxy resin composition according to claim 1 .

Assignees

• Asahi Chemical Ind

Inventors

• Okamoto Ryosuke
• Kamimura Naoya
• Onizuka Kenzo

Classifications

• H10W74/473

  containing a filler · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/40

  characterised by their materials · CPC title

• C08K3/36

  Silica · CPC title