Low cost ring device structures

Patent metadata

Field	Value
Publication number	US-2025025101-A1
Application number	US-202318354407-A
Country	US
Kind code	A1
Filing date	Jul 18, 2023
Priority date	Jul 18, 2023
Publication date	Jan 23, 2025
Grant date	—

Abstract

Methods, systems, and devices for forming a wearable ring device are described. A welding process may use ultrasonic welding to attach an outer lateral surface cover to the inner lateral surface cover, which may form an arcuate frame for the wearable ring device. The welding process may involve ultrasonic welding, which may melt one or more welding features (e.g., welding ribs) to attach the outer lateral surface cover to the inner lateral surface cover. In some examples, the welding features may be located on the outer lateral surface cover, the inner lateral surface cover, or both. To reduce negative effects on fragile components, such as a PCB of the wearable ring device, the fragile components may be disposed in a location away from the welding features. Further, in some cases, a material may be used to cover and shield the fragile components from ultrasonic waves during the welding procedure.

First claim

What is claimed is:

1 . A wearable ring device, comprising:
an arcuate frame configured to be worn on a finger of a user, the arcuate frame comprising an outer lateral surface cover and an inner lateral surface cover configured to be in contact with the finger of the user, wherein a first welding feature extends radially around a first portion of the outer lateral surface cover of the arcuate frame, wherein a second welding feature extends radially around a second portion of the outer lateral surface cover of the arcuate frame, and wherein the first welding feature and the second welding feature are welded to the inner lateral surface cover to form the arcuate frame based at least in part on a welding procedure; and a printed circuit board disposed in a first section within the arcuate frame between the outer lateral surface cover and the inner lateral surface cover to shield the printed circuit board from the welding procedure.

2 . The wearable ring device of claim 1 , wherein:
the arcuate frame comprises a shielding component between the outer lateral surface cover and the inner lateral surface cover, and the printed circuit board is disposed within the shielding component to shield the printed circuit board from the welding procedure, the welding procedure comprising an ultrasonic welding procedure, a laser welding procedure, a heat welding procedure, a friction welding procedure, a radio frequency welding procedure, or a combination thereof.

3 . The wearable ring device of claim 1 , wherein the first welding feature and the second welding feature are located in a second section different from the first section to shield the printed circuit board from the welding procedure.

4 . The wearable ring device of claim 3 , wherein the first section is adjacent to the second section in a first dimension and centered between the first portion of the outer lateral surface cover and the second portion of the outer lateral surface cover in a second dimension to shield the printed circuit board from the welding procedure.

5 . The wearable ring device of claim 1 , wherein:
a third welding feature extends radially around a first portion of the inner lateral surface cover; and a fourth welding feature extends radially around a second portion of the inner lateral surface cover, and wherein the third welding feature and the second welding feature are welded to the outer lateral surface cover to form the arcuate frame based at least in part on the welding procedure.

6 . The wearable ring device of claim 5 , wherein:
the third welding feature is configured to weld to the first welding feature based at least in part on the welding procedure, and the fourth welding feature is configured to weld to the second welding feature based at least in part on the welding procedure.

7 . The wearable ring device of claim 1 , wherein the inner lateral surface cover comprises a plurality of transparent lenses and the printed circuit board is configured to perform measurements of physiological data of the user based at least in part on one or more sensors via the plurality of transparent lenses.

8 . A wearable ring device, comprising:
an arcuate frame configured to be worn on a finger of a user, the arcuate frame comprising an outer lateral surface cover and an inner lateral surface cover configured to be in contact with the finger of the user, wherein a first welding feature extends radially around a first portion of the inner lateral surface cover of the arcuate frame, wherein a second welding feature extends radially around a second portion of the inner lateral surface cover of the arcuate frame, and wherein the first welding feature and the second welding feature are welded to the outer lateral surface cover to form the arcuate frame based at least in part on a welding procedure; and a printed circuit board disposed within the arcuate frame between the outer lateral surface cover and the inner lateral surface cover in a first section to shield the printed circuit board from the welding procedure.

9 . The wearable ring device of claim 8 , wherein:
the arcuate frame comprises a shielding component between the outer lateral surface cover and the inner lateral surface cover, and the printed circuit board is disposed within the shielding component to shield the printed circuit board from the welding procedure, the welding procedure comprising an ultrasonic welding procedure, a laser welding procedure, a heat welding procedure, a friction welding procedure, a radio frequency welding procedure, or a combination thereof.

10 . The wearable ring device of claim 8 , wherein the first welding feature and the second welding feature are located in a second section different from the first section to shield the printed circuit board from the welding procedure.

11 . The wearable ring device of claim 10 , wherein the first section is adjacent to the second section in a first dimension and centered between the first portion of the outer lateral surface cover and the second portion of the outer lateral surface cover in a second dimension to shield the printed circuit board from the welding procedure.

12 . The wearable ring device of claim 8 , wherein:
the inner lateral surface cover comprises a plurality of transparent lenses, and the printed circuit board is configured to perform measurements of physiological data of the user based at least in part on one or more sensors via the plurality of transparent lenses.

13 . A method of manufacturing a wearable ring device, comprising:
forming an outer lateral surface cover and an inner lateral surface cover based at least in part on an injection molding operation, wherein the outer lateral surface cover comprises a first welding feature and a second welding feature; aligning the first welding feature and the second welding feature of the outer lateral surface cover with the inner lateral surface cover; and activating an ultrasonic welding head configured for ultrasonic welding and simultaneously welding the first welding feature and the second welding feature with the inner lateral surface cover to form an arcuate frame configured to be worn on a finger of a user, wherein the arcuate frame comprises a circumferential seal based at least in part on the simultaneously welding of the first welding feature and the second welding feature with the inner lateral surface cover, and wherein a printed circuit board disposed at a first section within the arcuate frame between the outer lateral surface cover and the inner lateral surface cover is shielded from the ultrasonic welding.

14 . The method of claim 13 , wherein the ultrasonic welding head comprises a first circular component and a second circular component, the first circular component being in contact with a first portion of the outer lateral surface cover during the ultrasonic welding, and the second circular component being in contact with a second portion of the outer lateral surface cover during the ultrasonic welding.

15 . The method of claim 13 , wherein:
the outer lateral surface cover comprises a shielding component, and the printed circuit board is disposed within the shielding component to shield the printed circuit board from the ultrasonic welding.

16 . The method of claim 13 , wherein the first welding feature and the second welding feature are located in a second section different from the first section to shield the printed circuit board from the ultrasonic welding.

17 . The method of claim 13 , wherein the first welding feature extends radially around a first portion o

Assignees

• Oura Health Oy

Inventors

• Huttunen Heikki Juhani

Classifications

• B29L2031/7096

  Rings or ring-like articles · CPC title

• B29C65/088

  using several cooperating sonotrodes, i.e. interacting with each other, e.g. for realising the same joint · CPC title

• B29C65/08

  using ultrasonic vibrations {(non-plastics element to plastics elements B29C65/645)} · CPC title

• B29C66/24221

  being circular (B29C66/51 takes precedence) · CPC title

• B29C66/30223

  said melt initiators being rib-like · CPC title