Space-saving high-density modular data systems and energy-efficient cooling systems

Patent metadata

Field	Value
Publication number	US-2025024648-A1
Application number	US-202418779868-A
Country	US
Kind code	A1
Filing date	Jul 22, 2024
Priority date	Jun 23, 2010
Publication date	Jan 16, 2025
Grant date	—

Abstract

A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

First claim

What is claimed is:

1 . A modular data pod, comprising:
an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member; a plurality of computer racks arranged within the enclosure to form a first volume between the inner surface of the wall members and first sides of the computer racks and a second volume formed of second sides of the computer racks; a computer rack covering member configured to enclose the second volume, the computer rack covering member and the data pod covering member forming a third volume coupling the first volume to the second volume; and an air circulator configured to continuously circulate air through the first, second, and third volumes.

Assignees

• Inertech Ip Llc

Inventors

• Keisling Earl
• Costakis John
• Mcdonnell Gerald

Classifications

• H05K7/20818

  within cabinets for removing heat from server blades · CPC title

• H05K7/20754

  Air circulating in closed loop within cabinets · CPC title

• G06F1/20

  Cooling means · CPC title

• H05K7/20781

  within cabinets for removing heat from server blades · CPC title

• F25D17/00

  Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces · CPC title