Copper alloy wire, covered wire, covered wire with terminal, and method for manufacturing copper alloy wire

Patent metadata

Field	Value
Publication number	US-2025022628-A1
Application number	US-202218684460-A
Country	US
Kind code	A1
Filing date	Jun 7, 2022
Priority date	Aug 31, 2021
Publication date	Jan 16, 2025
Grant date	—

Abstract

Disclosed herein is a copper alloy wire being a wire rod formed of a copper alloy and having a tensile strength of 400 MPa or more, an elongation at break of 5% or more, a conductivity of 60% IACS or more, and a wire diameter of 0.5 mm or less, wherein the copper alloy has a composition containing 0.05% by mass or more and 1.6% by mass or less of iron, 0.01% by mass or more and 0.7% by mass or less of phosphorus, and 0.05% by mass or more and 0.7% by mass or less of tin with the balance being copper and unavoidable impurities, the copper alloy has a structure containing crystals, and a crystal grain size difference determined as a difference between a maximum crystal grain size and a minimum crystal grain size in a cross-section is 1.0 μm or less.

First claim

1 . A copper alloy wire being a wire rod formed of a copper alloy and having a tensile strength of 400 MPa or more,
an elongation at break of 5% or more, a conductivity of 60% IACS or more, and a wire diameter of 0.5 mm or less, wherein the copper alloy has a composition containing 0.05% by mass or more and 1.6% by mass or less of iron, 0.01% by mass or more and 0.7% by mass or less of phosphorus, and 0.05% by mass or more and 0.7% by mass or less of tin with the balance being copper and unavoidable impurities, the copper alloy has a structure containing crystals, and a crystal grain size difference determined as a difference between a maximum crystal grain size and a minimum crystal grain size in a cross-section is 1.0 μm or less.

2 . The copper alloy wire according to claim 1 , wherein the composition of the copper alloy contains less than 0.001% by mass of carbon.

3 . The copper alloy wire according to claim 1 , wherein a content ratio by mass of iron to phosphorus is 1.0 or more and 30 or less.

4 . The copper alloy wire according to claim 1 ,
wherein the copper alloy wire has a work hardening coefficient of 0.1 or more.

5 . A covered wire comprising a conductor and an insulating layer covering a periphery of the conductor, wherein
the conductor comprises a copper alloy stranded wire, and the copper alloy stranded wire comprises the copper alloy wire according to claim 1 .

6 . A covered wire with terminal, comprising the covered wire according to claim 5 and a terminal attached to at least one of ends of the covered wire.

7 . A method for manufacturing a copper alloy wire, comprising:
a first step of manufacturing a casting material formed of a copper alloy by continuous casting; a second step of subjecting the casting material to conform extrusion to manufacture a linear extruded material; a third step of subjecting the extruded material to wire drawing to manufacture a drawn wire material; and a fourth step of subjecting the drawn wire material to heat treatment to manufacture a heat-treated material, wherein the copper alloy has a composition containing 0.05% by mass or more and 1.6% by mass or less of iron, 0.01% by mass or more and 0.7% by mass or less of phosphorus, and 0.05% by mass or more and 0.7% by mass or less of tin with the balance being copper and unavoidable impurities, a reduction of area by the conform extrusion is 50% or more, a temperature of the extruded material just after conform extrusion is 350° C. or more, and a temperature of the heat treatment is 350° C. or more.

Assignees

• Sumitomo Electric Industries
• Autonetworks Technologies Ltd
• Sumitomo Wiring Systems

Inventors

• EHARA Kazuki
• Otsuka Yasuyuki
• Imasato Fumitoshi
• Oshima Yusuke
• Tsuneda Hiroki
• Kubo Noriaki
• Fujita Hiroshi
• SHIMIZU Sae
• Kuwabara Tetsuya
• Sakamoto Kei

Classifications

• H01B13/0016

  for heat treatment · CPC title

• H01B7/0009

  Details relating to the conductive cores · CPC title

• C22C9/00

  Alloys based on copper · CPC title

• H01B1/026 Primary

  Alloys based on copper · CPC title

• H01B13/00

  Apparatus or processes specially adapted for manufacturing conductors or cables · CPC title