Electrically isolating thermal interface module for low voltage electrical devices

Patent metadata

Field	Value
Publication number	US-2025016963-A1
Application number	US-202318279750-A
Country	US
Kind code	A1
Filing date	Mar 8, 2023
Priority date	Mar 8, 2022
Publication date	Jan 9, 2025
Grant date	—

Abstract

Apparatuses, systems, and methods are provided for an electrically isolating thermal interface device. The system may include a power source, a thermal dissipation element, and a thermal interface module coupleable between the power source and the thermal dissipation element, the thermal interface module including a first interface coupleable to the power source, a second interface coupleable to the thermal dissipation element, a housing coupleable between the first interface and the second interface, an interface module configured to provide a thermal path from the first interface to the second interface, a first film coupleable between the first interface and the interface module, and a second film coupleable between the second interface and the interface module.

First claim

We claim:

1 . A thermal interface module device coupleable to a heat sink element, the thermal interface module comprising:
a first interface; a second interface; a housing coupleable between the first interface and the second interface; an interface module configured to provide a thermal path to the heat sink element; a first film coupleable between the first interface and the interface module; and a second film coupleable between the second interface and the interface module.

2 . The thermal interface module device of claim 1 , wherein the first interface is an energized interface plate.

3 . The thermal interface module device of claim 1 , wherein the second interface is a grounded interface plate.

4 . The thermal interface module device of claim 1 , wherein the interface module is a ceramic material.

5 . The thermal interface module device of claim 1 , wherein the interface module is an aluminum oxide material.

6 . The thermal interface module device of claim 5 , wherein the aluminum oxide material is alumina.

7 . The thermal interface module device of claim 1 , wherein the first film and the second film are configured to provide isolation layers.

8 . A system for providing an electrically isolating thermal interface, comprising:
a power source; a thermal dissipation element; and a thermal interface module device coupleable between the power source and the thermal dissipation element, the thermal interface module device including:
a first interface coupleable to the power source;
a second interface coupleable to the thermal dissipation element;
a housing coupleable between the first interface and the second interface;
an interface module configured to provide a thermal path from the first interface to the second interface;
a first film coupleable between the first interface and the interface module; and
a second film coupleable between the second interface and the interface module.

9 . The system of claim 8 , wherein the first interface is an energized interface plate.

10 . The system of claim 8 , wherein the second interface is a grounded interface plate.

11 . The system of claim 8 , wherein the interface module is a ceramic material.

12 . The system of claim 8 , wherein the interface module is an aluminum oxide material.

13 . The system of claim 12 , wherein the aluminum oxide material is alumina.

14 . The system of claim 8 , wherein the first film and the second film are configured to provide isolation layers.

15 . The system of claim 8 , wherein the thermal dissipation element is configured to dissipate heat shared between phases of a plurality of power sources.

16 . A method for providing a thermal interface module device between a power source and a thermal dissipation element, comprising:
providing a first interface in contact with the power source; providing a second interface in contact with the thermal dissipation element; providing a housing between the first interface and the second interface; providing an interface module implementing a thermal path from the first interface and the second interface; providing a first film in contact with the first interface and the interface module; and providing a second film in contact with the second interface and the interface module.

Assignees

• Schneider Electric Usa Inc

Inventors

• Faber Timothy R
• Woodson Jr Cameron Lee
• Carne Clinton Neal
• Blake Randy Wiliiam
• Hollinger Daniel Gene

Classifications

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W40/10

  Arrangements for heating · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• H02G5/10 Primary

  Cooling · CPC title