Semiconductor device packaging warpage control

Patent metadata

Field	Value
Publication number	US-2025006511-A1
Application number	US-202418887074-A
Country	US
Kind code	A1
Filing date	Sep 17, 2024
Priority date	Jun 3, 2021
Publication date	Jan 2, 2025
Grant date	—

Abstract

A method of manufacturing a packaged semiconductor device is provided. The method includes placing a plurality of semiconductor die on a carrier substrate. The plurality of semiconductor die and an exposed portion of the carrier substrate are encapsulated with an encapsulant. A cooling fixture includes a plurality of nozzles and is placed over the encapsulant. The encapsulant is cooled by way of air exiting the plurality of nozzles. A property of air exiting a first nozzle of the plurality of nozzles is different from that of a second nozzle of the plurality of nozzles.

First claim

What is claimed is:

1 - 16 . (canceled)

17 . An apparatus for manufacturing a packaged semiconductor device, the apparatus comprising:
a cooling fixture comprising a plurality of nozzles, the cooling fixture configured to:
cool a first region of an encapsulant by way of a fluid exiting a first nozzle of the plurality of nozzles, the encapsulant encapsulating a plurality of semiconductor die placed on a carrier substrate; and
cool a second region of the encapsulant by way of the fluid exiting a second nozzle of the plurality of nozzles, wherein a property of the fluid exiting the first nozzle is different from that of the second nozzle.

18 . The apparatus of claim 17 , further comprising a controller unit coupled to the cooling fixture, the controller unit configured to control the property of the fluid exiting the first nozzle and the second nozzle.

19 . The apparatus of claim 18 , wherein the controller unit is further configured to adjust the property of the fluid exiting the first nozzle or the second nozzle based on an output signal of a sensor integrated with the carrier substrate.

20 . The apparatus of claim 17 , wherein the fluid is characterized as air and wherein the property is characterized as air flow rate, air temperature, or duration of the air exiting the first nozzle and the second nozzle.

21 . The apparatus of claim 17 , wherein the cooling fixture is further configured to cool the first region of the encapsulant by way of the fluid exiting the first nozzle of the plurality of nozzles during a first step of a predetermined sequence.

22 . The apparatus of claim 21 , wherein a duration of the first step of the predetermined sequence is based on a temperature of at least a portion of the encapsulant.

23 . The apparatus of claim 21 , wherein the cooling fixture is further configured to cool the second region of the encapsulant by way of the fluid exiting the second nozzle of the plurality of nozzles during a second step of the predetermined sequence, the second step different from the first step.

24 . The apparatus of claim 21 , wherein the cooling fixture is clamped onto the encapsulant such that the encapsulant is substantially flattened during the predetermined sequence.

25 . The apparatus of claim 17 , further comprising a planar-sensitive layer formed over an active side of the plurality of semiconductor die.

26 . The apparatus of claim 17 , wherein the carrier substrate includes a sensor coupled to an external monitor unit, the monitor unit configured to provide an output signal.

27 . The apparatus of claim 26 , wherein the sensor coupled to the external monitor unit is characterized as a strain gauge sensor or a temperature sensor.

28 . An apparatus for manufacturing a packaged semiconductor device, the apparatus comprising:
a cooling fixture including two or more groups of nozzles, wherein each nozzle of the two or more groups of nozzles is fixed, and wherein each group of nozzles of the two or more groups of nozzles is associated with a respective region of an encapsulant encapsulating a plurality of semiconductor die placed on a carrier substrate, the cooling fixture configured to:
directly cool the encapsulant by way of air exiting the two or more groups of nozzles, an air flow rate, air temperature, or duration of air exiting a first group of nozzles of the two or more groups of nozzles different from that of a second group of nozzles of the two or more groups of nozzles, wherein:
the air exiting the first group of nozzles occurs during a first step of a predetermined sequence, and
a duration of the first step is based on a temperature of at least a portion of the encapsulant.

29 . The apparatus of claim 28 , wherein the first group of nozzles of the two or more groups of nozzles is configured for cooling a first region of the encapsulant and the second group of nozzles of the two or more groups of nozzles is configured for cooling a second region of the encapsulant different from the first region.

30 . The apparatus of claim 28 , wherein the air exiting the second group of nozzles of the two or more groups of nozzles occurs during a second step of the predetermined sequence, the second step different from the first step.

31 . The apparatus of claim 28 , further comprising a controller unit coupled to the cooling fixture, the controller unit configured to control the air flow rate, air temperature, or duration of the air exiting the first and the second groups of nozzles of the two or more groups of nozzles.

32 . The apparatus of claim 28 , wherein the cooling fixture is clamped onto the encapsulant such that the encapsulant is substantially flattened during the predetermined sequence.

33 . The apparatus of claim 28 , wherein the carrier substrate includes a sensor coupled to an external monitor unit, the monitor unit configured to provide an output signal.

34 . The apparatus of claim 33 , wherein the sensor coupled to the external monitor unit is characterized as a strain gauge sensor or a temperature sensor.

35 . The apparatus of claim 33 , wherein the cooling fixture is further configured to adjust the air flow rate, air temperature, or duration of air exiting the first group or the second group of nozzles of the two or more groups of nozzles based on the output signal.

36 . The apparatus of claim 28 , further comprising a planar-sensitive layer formed over an active side of the plurality of semiconductor die the predetermined sequence.

Assignees

• Nxp Usa Inc

Inventors

• Gong Zhiwei
• Hayes Scott M
• Vincent Michael B
• Gupta Vivek
• Gan Richard Te

Classifications

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10W74/019 Primary

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W74/131

  the semiconductor body being only partially enclosed · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title