Photosensitive resin composition, photosensitive element, and laminate production method

Patent metadata

Field	Value
Publication number	US-2025004369-A1
Application number	US-202218703643-A
Country	US
Kind code	A1
Filing date	Oct 24, 2022
Priority date	Oct 26, 2021
Publication date	Jan 2, 2025
Grant date	—

Abstract

A photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator, in which the component (B) includes a polyfunctional compound having three or more ethylenically unsaturated bonds, and in a case where development is performed after exposing a layer (thickness 25 μm) of the photosensitive resin composition at a wavelength of 405 nm using a 41-step tablet (concentration region 0.00 to 2.00, concentration step 0.05, tablet size 20 mm×187 mm, each step size 3 mm× 12 mm), an exposure dose providing 15 steps as the number of remaining steps is 30 mJ/cm2 or less.

First claim

1 . A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound; and (C) a photopolymerization initiator, wherein
the component (B) includes a polyfunctional compound having three or more ethylenically unsaturated bonds, and in a case where development is performed after exposing a layer (thickness 25 μm) of the photosensitive resin composition at a wavelength of 405 nm using a 41-step tablet (concentration region 0.00 to 2.00, concentration step 0.05, tablet size 20 mm×187 mm, each step size 3 mm×12 mm), an exposure dose providing 15 steps as the number of remaining steps is 30 mJ/cm 2 or less.

2 . The photosensitive resin composition according to claim 1 , wherein the component (B) includes a polyfunctional compound having three ethylenically unsaturated bonds.

3 . The photosensitive resin composition according to claim 1 , wherein the component (B) includes a polyfunctional compound having six ethylenically unsaturated bonds.

4 . The photosensitive resin composition according to claim 1 , wherein the component (B) includes a polyfunctional compound having three ethylenically unsaturated bonds and a polyfunctional compound having six ethylenically unsaturated bonds.

5 . The photosensitive resin composition according to claim 1 , wherein the component (C) includes an acridine compound.

6 . The photosensitive resin composition according to claim 1 , wherein the component (C) includes an acridine compound and a N-phenylglycine compound.

7 . The photosensitive resin composition according to claim 1 , wherein a content of the polyfunctional compound is 1 to 10% by mass on the basis of the total amount of the photosensitive resin composition.

8 . The photosensitive resin composition according to claim 1 , wherein a content of the polyfunctional compound is 3 to 30% by mass on the basis of the total amount of the component (B).

9 . The photosensitive resin composition according to claim 1 , wherein the component (B) further includes a bisphenol A-type (meth)acrylic acid compound.

10 . The photosensitive resin composition according to claim 1 , wherein a content of the component (B) is 30 to 60 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B).

11 . The photosensitive resin composition according to claim 1 , wherein the component (A) has a (meth)acrylic acid and a styrene compound as monomer units.

12 . The photosensitive resin composition according to claim 1 , wherein the component (A) has a styrene compound as a monomer unit, and
a content of the monomer unit of the styrene compound is 1 to 30% by mass on the basis of the total amount of monomer units constituting the component (A).

13 . The photosensitive resin composition according to claim 1 , wherein a weight average molecular weight of the component (A) is 3.0×10 4 to 5.0×10 4 .

14 . A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound; and (C) a photopolymerization initiator, wherein
the component (B) includes at least one selected from the group consisting of trimethylolpropane tri(meth)acrylate, alkylene oxide-modified trimethylolpropane tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and alkylene oxide-modified dipentaerythritol hexa(meth)acrylate, and 2,2-bis(4-((meth)acryloxypentaethoxy)phenyl)propane, and the component (C) includes an acridine compound.

15 . The photosensitive resin composition according to claim 14 , wherein the component (B) includes alkylene oxide-modified trimethylolpropane tri(meth)acrylate.

16 . The photosensitive resin composition according to claim 14 , further comprising tribromomethyl phenyl sulfone.

17 . The photosensitive resin composition according to claim 1 , which is in a film form.

18 . A photosensitive element comprising: a support; and a photosensitive resin layer disposed on the support, wherein
the photosensitive resin layer is a layer of the photosensitive resin composition according to claim 1 .

19 . A method for producing a laminate, the method comprising:
a step of disposing a layer of the photosensitive resin composition on a base material by using the photosensitive resin composition according to claim 1 ; a step of photo-curing a part of the layer of the photosensitive resin composition; and a step of removing at least a part of an uncured area of the layer of the photosensitive resin composition to form a cured product pattern.

20 . A method for producing a laminate, the method comprising:
a step of disposing a layer of the photosensitive resin composition on a base material by using the photosensitive element according to claim 18 ; a step of photo-curing a part of the layer of the photosensitive resin composition; and a step of removing at least a part of an uncured area of the layer of the photosensitive resin composition to form a cured product pattern.

21 . The photosensitive resin composition according to claim 14 , which is in a film form.

22 . A photosensitive element comprising: a support; and a photosensitive resin layer disposed on the support, wherein
the photosensitive resin layer is a layer of the photosensitive resin composition according to claim 14 .

23 . A method for producing a laminate, the method comprising:
a step of disposing a layer of the photosensitive resin composition on a base material by using the photosensitive resin composition according to claim 14 ; a step of photo-curing a part of the layer of the photosensitive resin composition; and a step of removing at least a part of an uncured area of the layer of the photosensitive resin composition to form a cured product pattern.

24 . A method for producing a laminate, the method comprising:
a step of disposing a layer of the photosensitive resin composition on a base material by using the photosensitive element according to claim 22 ; a step of photo-curing a part of the layer of the photosensitive resin composition; and a step of removing at least a part of an uncured area of the layer of the photosensitive resin composition to form a cured product pattern.

Assignees

• Resonac Corp

Inventors

• Tanaka Shiho
• Ono Keishi

Classifications

• G03F7/004 Primary

  Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title

• G03F7/027

  Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) · CPC title

• G03F7/033 Primary

  the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers · CPC title

• G03F7/031 Primary

  Organic compounds not covered by group G03F7/029 · CPC title

• G03F7/038

  Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title