Cover for heat generating electronic component

Patent metadata

Field	Value
Publication number	US-2024422944-A1
Application number	US-202218702417-A
Country	US
Kind code	A1
Filing date	Oct 26, 2022
Priority date	Nov 10, 2021
Publication date	Dec 19, 2024
Grant date	—

Abstract

A cover for a heat generating electronic component including a hollow structure having one or more openings for inserting an electronic circuit component, wherein an inner wall surface of the hollow structure has one or more protrusion portions. Thereby, a cover for a heat generating electronic component that can prevent detachment of the electronic component is provided.

First claim

1 - 7 . (canceled)

8 . A cover for a heat generating electronic component, comprising a hollow structure having one or more openings for inserting an electronic circuit component, wherein an inner wall surface of the hollow structure has one or more protrusion portions.

9 . The cover for a heat generating electronic component according to claim 8 , wherein the protrusion portion has a height in a range of 0.1 to 1 mm.

10 . The cover for a heat generating electronic component according to claim 8 , comprising a cured product of a silicone rubber composition containing silicone rubber and a thermally conductive filler.

11 . The cover for a heat generating electronic component according to claim 9 , comprising a cured product of a silicone rubber composition containing silicone rubber and a thermally conductive filler.

12 . The cover for a heat generating electronic component according to claim 10 , wherein the cured product of the silicone rubber composition has a thermal conductivity of equal to or more than 0.5 W/m·K.

13 . The cover for a heat generating electronic component according to claim 11 , wherein the cured product of the silicone rubber composition has a thermal conductivity of equal to or more than 0.5 W/m·K.

14 . The cover for a heat generating electronic component according to claim 10 , wherein the cured product of the silicone rubber composition with a thickness of 0.45 mm has dielectric breakdown voltage in air of equal to or more than 4.5 kV.

15 . The cover for a heat generating electronic component according to claim 11 , wherein the cured product of the silicone rubber composition with a thickness of 0.45 mm has dielectric breakdown voltage in air of equal to or more than 4.5 kV.

16 . The cover for a heat generating electronic component according to claim 12 , wherein the cured product of the silicone rubber composition with a thickness of 0.45 mm has dielectric breakdown voltage in air of equal to or more than 4.5 kV.

17 . The cover for a heat generating electronic component according to claim 13 , wherein the cured product of the silicone rubber composition with a thickness of 0.45 mm has dielectric breakdown voltage in air of equal to or more than 4.5 kV.

18 . The cover for a heat generating electronic component according to claim 10 , wherein the silicone rubber composition is a thermally conductive silicone rubber composition comprising following components (A) to (D):
(A) 100 parts by mass of an organopolysiloxane having an average polymerization degree of 3,000 to 10,000; (B) 10 to 100 parts by mass of an organopolysiloxane having an average polymerization degree of 2 to 2,000, and having an alkenyl group only at both molecular chain terminals; (C) 500 to 2,700 parts by mass of a thermally conductive filler; and (D) an effective amount of a curing agent.

19 . The cover for a heat generating electronic component according to claim 12 , wherein the silicone rubber composition is a thermally conductive silicone rubber composition comprising following components (A) to (D):
(A) 100 parts by mass of an organopolysiloxane having an average polymerization degree of 3,000 to 10,000; (B) 10 to 100 parts by mass of an organopolysiloxane having an average polymerization degree of 2 to 2,000, and having an alkenyl group only at both molecular chain terminals; (C) 500 to 2,700 parts by mass of a thermally conductive filler; and (D) an effective amount of a curing agent.

20 . The cover for a heat generating electronic component according to claim 14 , wherein the silicone rubber composition is a thermally conductive silicone rubber composition comprising following components (A) to (D):
(A) 100 parts by mass of an organopolysiloxane having an average polymerization degree of 3,000 to 10,000; (B) 10 to 100 parts by mass of an organopolysiloxane having an average polymerization degree of 2 to 2,000, and having an alkenyl group only at both molecular chain terminals; (C) 500 to 2,700 parts by mass of a thermally conductive filler; and (D) an effective amount of a curing agent.

21 . The cover for a heat generating electronic component according to claim 15 , wherein the silicone rubber composition is a thermally conductive silicone rubber composition comprising following components (A) to (D):
(A) 100 parts by mass of an organopolysiloxane having an average polymerization degree of 3,000 to 10,000; (B) 10 to 100 parts by mass of an organopolysiloxane having an average polymerization degree of 2 to 2,000, and having an alkenyl group only at both molecular chain terminals; (C) 500 to 2,700 parts by mass of a thermally conductive filler; and (D) an effective amount of a curing agent.

22 . The cover for a heat generating electronic component according to claim 16 , wherein the silicone rubber composition is a thermally conductive silicone rubber composition comprising following components (A) to (D):
(A) 100 parts by mass of an organopolysiloxane having an average polymerization degree of 3,000 to 10,000; (B) 10 to 100 parts by mass of an organopolysiloxane having an average polymerization degree of 2 to 2,000, and having an alkenyl group only at both molecular chain terminals; (C) 500 to 2,700 parts by mass of a thermally conductive filler; and (D) an effective amount of a curing agent.

23 . The cover for a heat generating electronic component according to claim 17 , wherein the silicone rubber composition is a thermally conductive silicone rubber composition comprising following components (A) to (D):
(A) 100 parts by mass of an organopolysiloxane having an average polymerization degree of 3,000 to 10,000; (B) 10 to 100 parts by mass of an organopolysiloxane having an average polymerization degree of 2 to 2,000, and having an alkenyl group only at both molecular chain terminals; (C) 500 to 2,700 parts by mass of a thermally conductive filler; and (D) an effective amount of a curing agent.

24 . The cover for a heat generating electronic component according to claim 18 , wherein the component (A) in the silicone rubber composition contains a diorganocyclopolysiloxane having 3 to 10 silicon atoms in a total amount of 500 ppm or less based on a total amount of the component (A).

Assignees

• Shinetsu Chemical Co

Inventors

• Sakurai Yuuki
• Tsukada Junichi
• Endo Akihiro
• Sumiyoshi Ryoichi

Classifications

• H10W40/251

  Organics · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H05K7/209

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• C08K5/54

  Silicon-containing compounds {(C08K5/0091 takes precedence)} · CPC title

• C08K2201/014

  Additives containing two or more different additives of the same subgroup in C08K · CPC title