Display device and fabricating method thereof

Patent metadata

Field	Value
Publication number	US-2024421272-A1
Application number	US-202418734962-A
Country	US
Kind code	A1
Filing date	Jun 5, 2024
Priority date	Jun 13, 2023
Publication date	Dec 19, 2024
Grant date	—

Abstract

The present disclosure is applicable to a display device related technical field and relates to a display device using a composite optical film and a light emitting element for example. The present disclosure may include a wiring substrate, an electrode pad partitioned on the wiring substrate, a multitude of light emitting elements forming a unit pixel by being connected to the electrode pad, an optical film layer forming a film on a multitude of the light emitting elements and including a filler, and an encapsulation layer positioned on the optical film layer.

First claim

What is claimed is:

1 . A display device, comprising:
a wiring substrate; an electrode pad partitioned on the wiring substrate; a multitude of light emitting elements forming a unit pixel by being connected to the electrode pad; an optical film layer forming a film on a multitude of the light emitting elements and including a filler; and an encapsulation layer positioned on the optical film layer.

2 . The display device of claim 1 , wherein a thickness of the optical film layer on each of top and side surfaces of each of a multitude of the light emitting elements is smaller than a distance between the light emitting elements.

3 . The display device of claim 1 , wherein the optical film layer has a same thickness on top and side surfaces of each of a multitude of the light emitting elements within an error range of 30%.

4 . The display device of claim 1 , wherein a thickness on a side surface of each of a multitude of the light emitting elements is smaller than a distance between the light emitting elements.

5 . The display device of claim 1 , wherein the filler comprises at least one of Zr, Si, Ti, Zn, BaS, or oxide thereof.

6 . The display device of claim 1 , wherein the encapsulation layer comprises a black dye.

7 . The display device of claim 6 , wherein the encapsulation layer comprising the black dye is positioned between a multitude of the light emitting elements.

8 . The display device of claim 1 , wherein the encapsulation layer planarizes unevenness formed by a shape of the light emitting element.

9 . A method of fabricating a display device, the method comprising:
forming a first optical film layer including a filler along a first column of a multitude of light emitting elements disposed on a wiring substrate; and forming a second optical film layer including the filler along a second column of a multitude of the light emitting elements disposed on a wiring substrate, wherein a thickness of each of the first and second optical film layers on each of top and side surfaces of each of a multitude of the light emitting elements is smaller than a distance between the light emitting elements.

10 . The method of claim 9 , wherein the first and second optical film layers have a same thickness on the top and side surfaces of each of a multitude of the light emitting elements within an error range of 30%.

11 . The method of claim 9 , wherein the filler comprises at least one of Zr, Si, Ti, Zn, BaS, or oxide thereof.

12 . The method of claim 9 , further comprising forming an encapsulation layer on the first and second optical film layers.

13 . The method of claim 12 , wherein the encapsulation layer comprises a black dye.

14 . The method of claim 12 , wherein the encapsulation layer planarizes unevenness formed by a shape of the light emitting element.

15 . The method of claim 9 , wherein the first and second optical film layers are formed to be distinguished from each other.

16 . A display device, comprising:
a wiring substrate; first light emitting elements disposed along a first column on the wiring substrate; a first optical film layer positioned on the first light emitting elements and including a filler; second light emitting elements disposed along a second column on the wiring substrate; and a second optical film layer positioned on the second light emitting elements and including the filler, wherein a thickness of each of the first and second optical film layers on each of top and side surfaces of each of the first and second light emitting elements is smaller than a distance between the light emitting elements.

17 . The display device of claim 16 , wherein the first and second optical films have a same thickness on the top and side surfaces of each of the first and second light emitting elements within an error range of 30%.

18 . The display device of claim 16 , wherein the filler comprises at least one of Zr, Si, Ti, Zn, BaS, or oxide thereof.

19 . The display device of claim 16 , further comprising an encapsulation layer positioned on the first and second optical film layers.

20 . The display device of claim 19 , wherein the encapsulation layer planarizes unevenness formed by a shape of each of a multitude of the light emitting elements.

Assignees

• Lg Electronics Inc

Inventors

• Park Hongkey
• Kim Naree
• Kim Hyunjong
• Lee Dongkyu
• Choi Jeongsik

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/0364

  of interconnections · CPC title

• H10H20/0362

  of encapsulations · CPC title

• H10H20/034

  of coatings · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title