Wiring substrate, electronic device, and method of manufacturing the wiring substrate

Patent metadata

Field	Value
Publication number	US-2024413041-A1
Application number	US-202418735353-A
Country	US
Kind code	A1
Filing date	Jun 6, 2024
Priority date	Jun 12, 2023
Publication date	Dec 12, 2024
Grant date	—

Abstract

A wiring substrate includes a metallic plate, a first through-hole, an insulating layer, a second through-hole, a wiring layer, and feedthrough wiring. The first through-hole is formed in the metallic plate. The insulating layer covers both surfaces of the metallic plate and an inner wall surface of the first through-hole. The second through-hole is formed on an inner side of the insulating layer in the first through-hole. The wiring layer is laminated on the insulating layer on both surface sides of the metallic plate. The feedthrough wiring is formed in the second through-hole, and connects the wiring layer disposed on both surface sides of the metallic plate. The metallic plate includes a bent portion that is bent in a bottomed box shape and that forms a space on one of the surface sides of the metallic plate.

First claim

What is claimed is:

1 . A wiring substrate comprising:
a metallic plate; a first through-hole that is formed in the metallic plate; an insulating layer that covers both surfaces of the metallic plate and an inner wall surface of the first through-hole; a second through-hole that is formed on an inner side of the insulating layer in the first through-hole; a wiring layer that is laminated on the insulating layer on both surface sides of the metallic plate; and feedthrough wiring that is formed in the second through-hole, and that connects the wiring layer disposed on both surface sides of the metallic plate, wherein the metallic plate incudes a bent portion that is bent in a bottomed box shape and that forms a space on one of the surface sides of the metallic plate.

2 . The wiring substrate according to claim 1 , wherein the metallic plate includes a flange portion that is formed at an outer periphery of the bent portion, and that protrudes in a direction away from the space.

3 . The wiring substrate according to claim 2 , wherein
the first through-hole is formed in the bent portion and the flange portion, and the wiring layer disposed on another of the surface sides of the metallic plate includes
a first pad that is formed at a position corresponding to a position of the first through-hole provided in the bent portion,
a second pad that is formed at a position corresponding to a position of the first through-hole provided in the flange portion, and
wiring that connects the first pad and the second pad.

4 . The wiring substrate according to claim 2 , wherein the flange portion is divided by way of a slit.

5 . The wiring substrate according to claim 1 , further comprising
another insulating layer that is provided on the wiring layer disposed on another of the surface sides of the metallic plate; another wiring layer that is provided on the other insulating layer; and via wiring that is provided in the other insulating layer, wherein the other wiring layer is connected to the wiring layer by way of the via wiring.

6 . The wiring substrate according to claim 1 , further comprising an electronic component that is accommodated in the space, and that is electrically connected to the wiring layer disposed on the one of the surface sides of the metallic plate.

7 . An electronic device comprising:
a first wiring substrate; an electronic component that is fixed on the first wiring substrate; a second wiring substrate that is mounted on the electronic component and the first wiring substrate; and another electronic component that is mounted on the second wiring substrate, wherein the second wiring substrate includes
a metallic plate,
a first through-hole that is formed in the metallic plate,
an insulating layer that covers both surfaces of the metallic plate and an inner wall surface of the first through-hole,
a second through-hole that is formed on an inner side of the insulating layer in the first through-hole,
a wiring layer that is laminated on the insulating layer on both surface sides of the metallic plate, and
feedthrough wiring that is formed in the second through-hole, and that connects the wiring layer disposed on both surface sides of the metallic plate,
the metallic plate includes a bent portion that is bent in a bottomed box shape and that forms a space capable of accommodating the electronic component on one of the surface sides of the metallic plate, the electronic component is accommodated in the space, and is electrically connected to the wiring layer disposed on the one of the surface sides of the metallic plate, and the other electronic component is electrically connected to the wiring layer disposed on another of the surface sides of the metallic plate.

Assignees

• Shinko Electric Ind Co

Inventors

• Mori Kenichi

Classifications

• H10W90/722

  between stacked chips · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/65 Primary

  Shapes or dispositions of interconnections · CPC title

• H10W90/22

  the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL · CPC title

• H10W40/22 Primary

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title