Substrate and Electronic Apparatus

Patent metadata

Field	Value
Publication number	US-2024407087-A1
Application number	US-202218699718-A
Country	US
Kind code	A1
Filing date	Aug 19, 2022
Priority date	Aug 19, 2022
Publication date	Dec 5, 2024
Grant date	—

Abstract

A substrate includes a device region and at least one bonding region close to any edge of the substrate relative to the device region. The substrate includes a base, device groups arranged in a first direction and a second direction, signal line groups and bridging portions. A device group includes at least one electronic element. A signal line group includes signal lines extending in the second direction and arranged at intervals in the first direction. At least one bridging portion includes a conductive portion. At least two signal lines in at least one signal line group and electrically connected by a conductive portion, and/or at least one signal line in at least one signal line group includes at least two sub-portions spaced apart in the second direction, and two adjacent sub-portions in the same signal line are electrically connected by a conductive portion.

First claim

1 . A substrate having a plurality of edges; the substrate comprising a device region and at least one bonding region, and the bonding region being disposed proximate to any edge of the substrate relative to the device region; the substrate comprising:
a base; a plurality of device groups located on a side of the base and located in the device region, wherein the plurality of device groups are arranged in a first direction and a second direction, the first direction intersects the second direction, and the first direction and the second direction are parallel to the base; a device group includes at least one electronic element; a plurality of signal line groups located on a same side of the base as the plurality of device groups, wherein a signal line group includes a plurality of signal lines, the plurality of signal lines all extend in the second direction, and the plurality of signal lines are disposed at intervals in the first direction; any signal line extends from the bonding region to the device region, and any signal line is electrically connected to a column of device groups arranged in the second direction; and a plurality of bridging portions located on the same side of the base as the plurality of device groups, wherein at least one bridging portion is located in the device region, and the at least one bridging portion includes a conductive portion; wherein the at least one bridging portion satisfies at least one of: at least two signal lines in at least one signal line group are electrically connected by a conductive portion; and at least one signal line in at least one signal line group includes at least two sub-portions disposed at intervals in the second direction, and two adjacent sub-portions in a same signal line are electrically connected by a conductive portion; and at least part of a side of any bridging portion away from the base is capable of reflecting light.

2 . The substrate according to claim 1 , wherein at least part of a surface of the conductive portion included in the at least one bridging portion away from the base is capable of reflecting light.

3 . The substrate according to claim 2 , wherein the at bridging portion further includes a first encapsulation portion, and the first encapsulation portion covers the conductive portion; and a material of the first encapsulation portion includes at least one of a transparent material and a reflective material.

4 . The substrate according to claim 1 , wherein the at least one bridging portion further includes a first encapsulation portion, and the first encapsulation portion covers the conductive portion; and at least part of a surface of the first encapsulation portion away from the base is capable of reflecting light.

5 . The substrate according to claim 1 , wherein the conductive portion includes:
a main body portion; and two connection portions, the two connection portions being connected to both ends of the main body portion; a maximum distance between a surface of the main body portion facing the base and the base being greater than a maximum distance between a surface of any connection portion facing the base and the base.

6 . The substrate according to claim 5 , wherein an orthographic projection of the main body portion on the base is in a shape of a first rectangle, and a length of the first rectangle is in a range of 0.5 mm to 25 mm, inclusive, and a width of the first rectangle is in a range of 0.2 mm to 3 mm, inclusive; and/or
an orthographic projection of any connection portion on the base is in a shape of a second rectangle, a length of the second rectangle is in a range of 0.2 mm to 3 mm, inclusive, and a width of the second rectangle is in a range of 0.2 mm to 3 mm, inclusive.

7 . The substrate according to claim 6 , wherein a maximum distance between the surface of the main body portion facing the base and a surface of the connection portion facing the base is a first distance, and the first distance is in a range of 0.1 mm to 0.8 mm, inclusive; and/or
a maximum distance between a surface of the main body portion away from the base and the surface of the connection portion facing the base is a second distance, and the second distance is in a range of 0.2 mm to 1 mm, inclusive.

8 . The substrate according to claim 1 , further comprising:
a first reflective layer located on a side of the plurality of device groups, the plurality of signal line groups and the plurality of bridging portions away from the base; wherein the first reflective layer has a plurality of first functional regions, and an orthographic projection of at least one bridging portion on the base is located within an orthographic projection of a first functional region on the base; and the first reflective layer is provided with a plurality of first linear slits therein, any first linear slit penetrates the first reflective layer in a direction perpendicular to the base; and the first functional region is composed of multiple first linear slits spaced apart from each other by surrounding.

9 . The substrate according to claim 8 , wherein a ratio of an area of an orthographic projection of any bridging portion on the base to an area of a first functional region where an orthographic projection of the bridging portion on the base is located is in a range of 0.5 to 2, inclusive.

10 . The substrate according to claim 8 , wherein a length of the first linear slit is in a range of 1 mm to 5 mm, inclusive; and a width of the first linear slit is in a range of 50 μm to 300 μm, inclusive.

11 . The substrate according to claim 8 , wherein the first reflective layer is provided with a plurality of second linear slits therein, any second linear slit penetrates the first reflective layer in the direction perpendicular to the base, and any second linear slit is located in the first functional region; and
an orthographic projection of an edge of the second linear slit on the base is at least partially overlapped with an orthographic projection of the bridging portion on the base.

12 . The substrate according to claim 11 , wherein a ratio of a length of the second linear slit to a length of a longest side of the bridging portion is in a range of 0.9 to 1.5, inclusive.

13 . The substrate according to claim 11 , wherein the length of the second linear slit is in a range of 1 mm to 35 mm, inclusive; and a width of the second linear slit is in a range of 50 μm to 300 μm, inclusive.

14 . The substrate according to claim 1 , wherein the electronic element includes an optical element; the substrate further comprises a second encapsulation portion, the second encapsulation portion covers the optical element, and a material of the second encapsulation portion is a transparent material; and
the first reflective layer is provided with a first through hole therein, and an orthographic projection of the optical element on the base is located within a region surrounded by an orthographic projection of an edge of the first through hole on the base.

15 . The substrate according to claim 1 , wherein the electronic element includes a non-optical element; the substrate further comprises:
a third encapsulation portion, the third encapsulation portion covering the non-optical element, and the first reflective layer covering the third encapsulation portion.

16 . The substrate according to claim 15 , wherein the first reflective layer has a second functional region, and at least part of an orthographic projection of the non-optical element on the base is located within the second functional region;
the first reflective layer is provided with a plurality

Assignees

• Hefei Boe Ruisheng Tech Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Tang Hai
• Gao Liang
• Wang Chengguo
• Wu Zhongbao
• Sun Yiding
• Zhai Ming
• Huang Linjie
• Kong Chengcheng

Classifications

• H05K1/181

  associated with surface mounted components · CPC title

• H05K2201/10022

  Non-printed resistor · CPC title

• H05K2201/10136

  Liquid Crystal display [LCD] · CPC title

• H05K1/0296 Primary

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• G09G3/32

  semiconductive, e.g. using light-emitting diodes [LED] · CPC title