Method of improved power integrity for mmwave phased array antennas using microvias

Patent metadata

Field	Value
Publication number	US-2024405427-A1
Application number	US-202218694811-A
Country	US
Kind code	A1
Filing date	Sep 16, 2022
Priority date	Sep 22, 2021
Publication date	Dec 5, 2024
Grant date	—

Abstract

A mmWave antenna that has particular application to be used in a 5G radio. The antenna includes a thick copper power layer, a first prepreg layer formed on one side of the thick power layer, a signal layer formed on a side of the first prepreg layer opposite to the thick power layer, a second prepreg layer formed on a side of the signal layer opposite to the first prepreg layer and a thin copper power layer formed on a side of second prepreg layer opposite to the signal layer. Microvias extend through the first prepreg layer that electrically couple the thick copper layer to the signal layer and microvias extend through the second prepreg layer that electrically couple the thin copper layer to the signal layer, where the number of microvias extending through the first prepreg layer is less than the number of microvias extending through the second prepreg layer.

First claim

What is claimed is:

1 . An antenna comprising:
a printed circuit board (PCB) structure including a plurality of layers, said plurality of layers including a thick conductive power layer, a first prepreg layer formed on one side of the thick power layer, a signal layer formed on a side of the first prepreg layer opposite to the thick power layer, a second prepreg layer formed on a side of the signal layer opposite to the first prepreg layer and a thin conductive power layer formed on a side of second prepreg layer opposite to the signal layer; and a plurality of microvias extending through the first prepreg layer that electrically couple the thick conductive layer to the signal layer and a plurality of microvias extending through the second prepreg layer that electrically couple the thin conductive layer to the signal layer.

2 . The antenna according to claim 1 wherein the number of microvias extending through the first prepreg layer is less than the number of microvias extending through the second prepreg layer.

3 . The antenna according to claim 1 further comprising a beamforming integrated circuit (IC) formed on the thick conductive layer.

4 . The antenna according to claim 3 further comprising an antenna radiating element formed on a dielectric layer at an opposite side of the PCB structure from the beamforming IC.

5 . The antenna according to claim 4 wherein the antenna radiating element is a patch antenna radiating element.

6 . The antenna according to claim 1 wherein the thick and thin conducting layers are copper layers.

7 . The antenna according to claim 1 wherein the antenna is a phased array antenna.

8 . The antenna according to claim 7 wherein the antenna is part of a 5G radio.

9 . A phased array antenna comprising:
a printed circuit board (PCB) structure including a plurality of layers, said plurality of layers including a thick copper power layer, a first prepreg layer formed on one side of the thick power layer, a signal layer formed on a side of the first prepreg layer opposite to the thick power layer, a second prepreg layer formed on a side of the signal layer opposite to the first prepreg layer and a thin copper power layer formed on a side of second prepreg layer opposite to the signal layer; and a plurality of microvias extending through the first prepreg layer that electrically couple the thick copper layer to the signal layer and a plurality of microvias extending through the second prepreg layer that electrically couple the thin copper layer to the signal layer, wherein the number of microvias extending through the first prepreg layer is less than the number of microvias extending through the second prepreg layer.

10 . The antenna according to claim 9 further comprising a beamforming integrated circuit (IC) formed on the thick copper layer.

11 . The antenna according to claim 10 further comprising an antenna radiating element formed on a dielectric layer at an opposite side of the PCB structure from the beamforming IC.

12 . The antenna according to claim 11 wherein the antenna radiating element is a patch antenna radiating element.

13 . The antenna according to claim 9 wherein the antenna is part of a 5G radio.

14 . A phased array antenna comprising:
a printed circuit board (PCB) structure including a plurality of layers, said plurality of layers including a thick copper power layer, a first prepreg layer formed on one side of the thick power layer, a signal layer formed on a side of the first prepreg layer opposite to the thick power layer, a second prepreg layer formed on a side of the signal layer opposite to the first prepreg layer and a thin copper power layer formed on a side of second prepreg layer opposite to the signal layer; a plurality of microvias extending through the first prepreg layer that electrically couple the thick copper layer to the signal layer and a plurality of microvias extending through the second prepreg layer that electrically couple the thin copper layer to the signal layer, wherein the number of microvias extending through the first prepreg layer is less than the number of microvias extending through the second prepreg layer; a beamforming integrated circuit (IC) formed on the thick copper layer; and a patch antenna radiating element formed on a dielectric layer at an opposite side of the PCB structure from the beamforming IC.

15 . The antenna according to claim 14 wherein the antenna is part of a 5G radio.

Assignees

• Jabil Inc

Inventors

• Timmins Ian Jeffery
• Rafie Babak Zarrin
• Faltone Youssef
• Finnell John

Classifications

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K1/0366

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q21/0006

  Particular feeding systems · CPC title