Circuit module

Patent metadata

Field	Value
Publication number	US-2024389234-A1
Application number	US-202418790339-A
Country	US
Kind code	A1
Filing date	Jul 31, 2024
Priority date	Feb 16, 2022
Publication date	Nov 21, 2024
Grant date	—

Abstract

In a circuit module of the present disclosure, one or more solder balls have an ellipsoidal shape, are located in an inter-board region between an upper circuit board and a lower circuit board, and electrically connect the upper circuit board and the lower circuit board. The size of the second solder ball is larger than the size of the first solder ball. A first sealing resin is provided in the inter-board region so as to be in contact with a first lower main surface and a second upper main surface and to cover surfaces of the one or more second solder balls.

First claim

1 . A circuit module comprising:
an upper circuit board having a first upper main surface and a first lower main surface arranged in an up-down direction; a lower circuit board having a second upper main surface and a second lower main surface arranged in the up-down direction, the lower circuit board being located below the upper circuit board and overlapping the upper circuit board when viewed in the up-down direction; one or more first solder balls each having an ellipsoidal shape and provided on the second lower main surface; one or more second solder balls each having an ellipsoidal shape, located in an inter-board region between the upper circuit board and the lower circuit board, and electrically connecting the upper circuit board and the lower circuit board, the second solder balls having a maximum width in a direction orthogonal to the up-down direction larger than a maximum width of the first solder balls in the direction orthogonal to the up-down direction; and a first sealing resin provided in the inter-board region so as to be in contact with the first lower main surface and the second upper main surface and cover surfaces of the one or more second solder balls.

2 . The circuit module according to claim 1 , wherein the circuit module further includes a second sealing resin covering the first upper main surface.

3 . The circuit module according to claim 2 , wherein the circuit module further includes a shield conductor covering an upper surface of the second sealing resin, a side surface of the second sealing resin located in the direction orthogonal to the up-down direction, a side surface of the upper circuit board located in the direction orthogonal to the up-down direction, a side surface of the first sealing resin located in the direction orthogonal to the up-down direction, and a side surface of the lower circuit board located in the direction orthogonal to the up-down direction.

4 . The circuit module according to claim 3 , wherein at least one of the one or more second solder balls is in contact with the shield conductor.

5 . The circuit module according to claim 1 , wherein the circuit module further includes a third sealing resin covering the second lower main surface.

6 . The circuit module according to claim 5 ,
wherein the one or more first solder balls each have a bottom surface being a plane orthogonal to the up-down direction, and wherein the bottom surface of each of the one or more first solder balls is included in one plane together with a lower main surface of the third sealing resin.

7 . The circuit module according to claim 1 ,
wherein the circuit module includes: one or more first electronic components mounted on the first lower main surface; and one or more second electronic components mounted on the second upper main surface, wherein the one or more second electronic components do not overlap the one or more first electronic components when viewed in the up-down direction, and wherein the one or more second solder balls are in contact with a mounting electrode of the upper circuit board and a mounting electrode of the lower circuit board.

8 . The circuit module according to claim 1 ,
wherein the circuit module includes: one or more second electronic components mounted on the second upper main surface; and one or more via hole conductors having a frustum shape having a central axis extending in the up-down direction, located in the inter-board region between the upper circuit board and the lower circuit board, and electrically connecting the upper circuit board and the lower circuit board, wherein the one or more second solder balls are in contact with a mounting electrode of the lower circuit board, wherein the one or more via hole conductors are in contact with a mounting electrode of the upper circuit board, and wherein the one or more second solder balls and the one or more via hole conductors are arranged in the up-down direction and are in contact with each other.

9 . The circuit module according to claim 1 ,
wherein the circuit module includes: one or more first electronic components mounted on the first lower main surface; one or more second electronic components mounted on the second upper main surface; and one or more third solder balls each having an ellipsoidal shape, located in the inter-board region between the upper circuit board and the lower circuit board, and electrically connecting the upper circuit board and the lower circuit board, wherein at least one of the one or more first electronic components overlaps at least one of the one or more second electronic components when viewed in the up-down direction, wherein the one or more second solder balls are in contact with a mounting electrode of the lower circuit board, wherein the one or more third solder balls are in contact with a mounting electrode of the upper circuit board, and wherein the one or more second solder balls and the one or more third solder balls are arranged in the up-down direction and are in contact with each other.

10 . The circuit module according to claim 2 , wherein the circuit module further includes a third sealing resin covering the second lower main surface.

11 . The circuit module according to claim 3 , wherein the circuit module further includes a third sealing resin covering the second lower main surface.

12 . The circuit module according to claim 4 , wherein the circuit module further includes a third sealing resin covering the second lower main surface.

13 . The circuit module according to claim 2 ,
wherein the circuit module includes: one or more first electronic components mounted on the first lower main surface; and one or more second electronic components mounted on the second upper main surface, wherein the one or more second electronic components do not overlap the one or more first electronic components when viewed in the up-down direction, and wherein the one or more second solder balls are in contact with a mounting electrode of the upper circuit board and a mounting electrode of the lower circuit board.

14 . The circuit module according to claim 3 ,
wherein the circuit module includes: one or more first electronic components mounted on the first lower main surface; and one or more second electronic components mounted on the second upper main surface, wherein the one or more second electronic components do not overlap the one or more first electronic components when viewed in the up-down direction, and wherein the one or more second solder balls are in contact with a mounting electrode of the upper circuit board and a mounting electrode of the lower circuit board.

15 . The circuit module according to claim 4 ,
wherein the circuit module includes: one or more first electronic components mounted on the first lower main surface; and one or more second electronic components mounted on the second upper main surface, wherein the one or more second electronic components do not overlap the one or more first electronic components when viewed in the up-down direction, and wherein the one or more second solder balls are in contact with a mounting electrode of the upper circuit board and a mounting electrode of the lower circuit board.

16 . The circuit module according to claim 5 ,
wherein the circuit module includes: one or more first electronic components mounted on the first lower main surface; and one or more second electronic components mounted on the second upper main surface, wherein the one or more second electronic components do not overlap the one or more first electronic

Assignees

• Murata Manufacturing Co

Inventors

• Otsubo Yoshihito
• Takakura Tsuyoshi
• Yoshimori Hiroki
• Nakagoshi Hideo

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H05K3/284

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title

• H05K2201/0364

  Conductor shape · CPC title