Vent port diffuser

Patent metadata

Field	Value
Publication number	US-2024387200-A1
Application number	US-202418785032-A
Country	US
Kind code	A1
Filing date	Jul 26, 2024
Priority date	Aug 30, 2021
Publication date	Nov 21, 2024
Grant date	—

Abstract

A chamber of a semiconductor fabrication facility may include a vent port diffuser. The vent port diffuser may include a first tube member configured to couple the vent port diffuser to a vent port of the chamber. The vent port diffuser may include a second tube member coupled to the first tube member. The second tube member may comprise a plurality of openings spaced along a length of the second tube member, with the plurality of openings configured to receive a fluid from the chamber. Based on the semiconductor fabrication facility including the vent port diffuser, the chamber may be configured to provide an improved flow field of a fluid within the chamber. In this way, the vent port diffuser may reduce defects of semiconductor devices transported through the chamber that might otherwise be caused by contaminants.

First claim

What is claimed is:

1 . A chamber, comprising:
a transport tool in an interior of the chamber; a vent port on a surface of the interior of the chamber; and a vent port diffuser comprising a first tube member and a second tube member,
wherein the first tube member comprises a plurality of openings spaced along a length of the first tube member, the plurality of openings configured to receive a fluid from the chamber,
wherein the second tube member is coupled to the vent port at a first end of the second tube member,
wherein the second tube member is coupled to the first tube member at a second end of the second tube member, and
wherein the second tube member is configured to receive the fluid from the first tube member at the second end and to provide the fluid to the vent port at the first end.

2 . The chamber of claim 1 , wherein the fluid comprises a gas configured to displace contaminants from a region above the transport tool in the interior of the chamber.

3 . The chamber of claim 1 , wherein the plurality of openings are positioned within the second tube member along a plane that is substantially parallel to the surface of the transport tool that is configured to support a wafer or a die.

4 . The chamber of claim 1 , wherein the plurality of openings are positioned within the second tube member along a plane that is substantially parallel to an upper surface or a lower surface of the interior of the chamber.

5 . The chamber of claim 1 , wherein sizes of the plurality of openings are based on distances of the plurality of openings from a longitudinal axis of the first tube member.

6 . The chamber of claim 1 , wherein the vent port is positioned on a lower surface of the interior of the chamber,
wherein the vent port is positioned on a side surface of the interior of the chamber, or wherein the vent port is positioned on an upper surface of the interior of the chamber.

7 . A vent port diffuser, comprising:
a first tube member comprising a first end and a second end,
wherein the first end is configured to couple to a vent port; and
a second tube member configured to couple to the second end and comprising:
a plurality of openings configured to receive fluid from a chamber,
wherein the plurality of openings are positioned substantially parallel to a longitudinal axis of the second tube member.

8 . The vent port diffuser of claim 7 , wherein the second tube member is arranged substantially perpendicular to the first tube member.

9 . The vent port diffuser of claim 7 , wherein cross-section areas of the plurality of openings are smaller than a cross-section area of the first end.

10 . The vent port diffuser of claim 7 , wherein the second tube member further comprises:
a first opening at a first end of the second tube member; and a second opening at a second end of the second tube member,
wherein cross-section areas of the first opening and the second opening are larger than cross-section areas of the plurality of openings.

11 . The vent port diffuser of claim 7 , wherein the second tube member further comprises:
a first opening at a first end of the second tube member; and a second opening at a second end of the second tube member,
wherein at least one of the first opening or the second opening is elliptical-shaped.

12 . The vent port diffuser of claim 7 , wherein the plurality of openings are elliptical-shaped openings.

13 . The vent port diffuser of claim 7 , wherein the plurality of openings are rectangular-shaped openings.

14 . The vent port diffuser of claim 7 , wherein the plurality of openings are triangular-shaped openings.

15 . The vent port diffuser of claim 7 , wherein the second tube member further comprises:
a first opening at a first end of the second tube member; and a second opening at a second end of the second tube member,
wherein at least one of the first opening or the second opening is polygonal-shaped.

16 . The vent port diffuser of claim 7 , wherein the plurality of openings have non-uniform sizing.

17 . The vent port diffuser of claim 7 , wherein sizes of the plurality of openings are based on distances of the plurality of openings from a center plane of the second tube member.

18 . The vent port diffuser of claim 17 , wherein a size of a first opening, of the plurality of openings, is smaller than a size of a second opening, of the plurality of openings, that is closer to the center plane than the first opening.

19 . A chamber, comprising:
a vent port; and a vent port diffuser comprising a first tube member and a second tube member,
wherein the first tube member comprises a plurality of openings configured to receive a fluid from the chamber,
wherein the second tube member is coupled to the vent port and the first tube member, and
wherein the second tube member is configured to:
receive the fluid from the first tube member, and
provide the fluid to the vent port.

20 . The chamber of claim 19 , further comprising:
a transport tool configured to support a wafer or a die.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Liu Yung-Tsun
• Wan Chao-Hung
• Cheng Kuang-Wei
• Lee Chih-Tsung
• Ni Chyi-Tsong

Classifications

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/0464

  characterised by the construction of the transfer chamber · CPC title

• B08B5/00

  Cleaning by methods involving the use of air flow or gas flow (cleaning hollow articles by methods or apparatus specially adapted thereto B08B9/00) · CPC title

• H01L21/67017 Primary

  Electricity · mapped topic