Optical component, optical module, and communication device

Patent metadata

Field	Value
Publication number	US-2024361528-A1
Application number	US-202418766557-A
Country	US
Kind code	A1
Filing date	Jul 8, 2024
Priority date	Feb 18, 2022
Publication date	Oct 31, 2024
Grant date	—

Abstract

An optical component, an optical module, and a communication device are provided. The optical component includes a chip ( 11 ), a fiber array unit ( 12 ), and at least one fastener ( 13 ). The fiber array unit ( 12 ) is located on a side of the chip ( 11 ), the fiber array unit ( 12 ) includes at least one optical fiber ( 121 ), at least one waveguide ( 141 ) is disposed on a surface of the chip ( 11 ), and matching glue is filled between an end face of the waveguide ( 141 ) and an end face of the optical fiber ( 121 ). One end of the fastener ( 13 ) is bonded to the chip ( 11 ) by using fastening glue, and the other end is bonded to the fiber array unit ( 12 ) by using the fastening glue. Bonding strength of the fastening glue is greater than bonding strength of the matching glue.

First claim

What is claimed is:

1 . An optical component, comprising a chip, a fiber array unit, and at least one fastener, wherein
the fiber array unit is located on a side of the chip and comprises at least one optical fiber; at least one waveguide is disposed on a surface of the chip, and matching glue is filled between an end face of the waveguide and an end face of the optical fiber; a first end of the fastener is bonded to the chip by using first fastening glue, and a second end of the fastener is bonded to the fiber array unit by using second fastening glue; and bonding strength of each of the first fastening glue and the second fastening glue is greater than bonding strength of the matching glue.

2 . The optical component according to claim 1 , wherein the second fastening glue and the matching glue are located on different surfaces of the fiber array unit; and the first fastening glue and the matching glue are located on different surfaces of the chip.

3 . The optical component according to claim 2 , wherein the fastener is located on a same side of the chip and the fiber array unit; and
the first end of the fastener is bonded to the surface of the chip, the second end of the fastener is bonded to a first surface of the fiber array unit, and the first surface of the fiber array unit is parallel to the surface of the chip.

4 . The optical component according to claim 3 , wherein a part of the fiber array unit extends from the surface of the chip; and
a first thickness of the fastener is greater than a second thickness, wherein the first thickness is a thickness of the first end of the fastener in a first direction, the second thickness is a thickness of the second end of the fastener in the first direction, and the first direction is a direction perpendicular to the surface of the chip.

5 . The optical component according to claim 2 , wherein the fastener is located on different sides of the chip and the fiber array unit; and
the first end of the fastener is bonded to the surface of the chip, the second end of the fastener is bonded to a second surface of the fiber array unit, and the second surface of the fiber array unit is not parallel to the surface of the chip.

6 . The optical component according to claim 5 , wherein a first width of the fastener is greater than a second width, wherein the first width is a width of the second end of the fastener in a second direction, the second width is a width of the first end of the fastener in the second direction, and the second direction is a direction perpendicular to an extension direction of the fiber array unit and parallel to the surface of the chip.

7 . The optical component according to claim 1 , wherein the fastener is at a position corresponding to the fiber array unit on the surface of the chip; and
a part of an end face that is of the fiber array unit and that faces the chip is bonded to the fastener, and another part of the end face is bonded to a side face of the chip by using the first fastening glue.

8 . The optical component according to claim 1 , wherein the fiber array unit comprises a first protection board and a second protection board, and each optical fiber in the fiber array unit is located between the first protection board and the second protection board;
the optical fiber in the fiber array unit is flush with the waveguide on the surface of the chip; the first protection board is located on a side that is of the optical fiber and that is away from the chip, and the second protection board is located on a side that is of the optical fiber and that is close to the chip; and the second end of the fastener is bonded to a side face of the first protection board by using the second fastening glue.

9 . The optical component according to claim 1 , wherein a material of the fastener comprises glass.

10 . The optical component according to claim 1 , wherein the matching glue comprises silicone, and each of the first fastening glue and the second fastening glue comprises epoxy glue.

11 . An optical module, comprising an optical component and a housing that wraps the optical component; wherein
the optical component comprises a chip, a fiber array unit, and a fastener, wherein the fiber array unit is located on a side of the chip, and the fiber array unit comprises at least one optical fiber; at least one waveguide is disposed on a surface of the chip, and matching glue is filled between an end face of the waveguide and an end face of the optical fiber; a first end of the fastener is bonded to the chip by using first fastening glue, and second end of the fastener is bonded to the fiber array unit by using second fastening glue; and bonding strength of each of the first fastening glue and the second fastening glue is greater than bonding strength of the matching glue.

12 . A communication device, wherein the communication device comprises an optical module and a power module, the power module is configured to supply power to the optical module, and the optical module comprises an optical component and a housing that wraps the optical component; wherein
the optical component comprises a chip, a fiber array unit, and at least one fastener, wherein
the fiber array unit is located on a side of the chip, and the fiber array unit comprises at least one optical fiber;
at least one waveguide is disposed on a surface of the chip, and matching glue is filled between an end face of the waveguide and an end face of the optical fiber;
a first end of the fastener is bonded to the chip by using first fastening glue, and a second end of the fastener is bonded to the fiber array unit by using second fastening glue; and
bonding strength of each of the first fastening glue and the second fastening glue is greater than bonding strength of the matching glue.

Assignees

• Huawei Tech Co Ltd

Inventors

• Qiu Zhicheng
• Tang Xiaofeng
• Xiao Pengcheng

Classifications

• G02B6/4249

  comprising arrays of active devices and fibres · CPC title

• G02B6/4239 Primary

  Adhesive bonding; Encapsulation with polymer material · CPC title

• G02B6/30 Primary

  for use between fibre and thin-film device · CPC title

• G02B6/12009 Primary

  comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides · CPC title