Electrostatic chuck assembly for cryogenic applications
US-2022270864-A1 · Aug 25, 2022 · US
US2024356465A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024356465-A1 |
| Application number | US-202418635344-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 15, 2024 |
| Priority date | Apr 24, 2023 |
| Publication date | Oct 24, 2024 |
| Grant date | — |
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Official abstract text for this publication.
An electrostatic chuck 10 includes: a dielectric substrate 100 ; a base plate 200 formed of a metal material; and a joining layer 300 which is provided between the dielectric substrate 100 and the base plate 200 . When a thickness of the joining layer 300 is T (μm) and a Young's modulus of the joining layer 300 at −100° C. is E (MPa), a condition expressed as E≤0.04×T−0.04 is satisfied.
Opening claim text (preview).
What is claimed is: 1 . An electrostatic chuck, comprising: a dielectric substrate; a base plate formed of a metal material; and a joining layer which is provided between the dielectric substrate and the base plate, wherein when a thickness of the joining layer is T (μm) and a Young's modulus of the joining layer at −100° C. is E (MPa), a condition expressed as E ≤ 0.04 × T - 0.04 is satisfied. 2 . The electrostatic chuck according to claim 1 , wherein a through hole is formed in the dielectric substrate. 3 . The electrostatic chuck according to claim 2 , wherein a diameter at an end of the through hole on an opposite side to the joining layer is equal to or smaller than 0.2 mm. 4 . The electrostatic chuck according to claim 1 , wherein the thickness of the joining layer is equal to or smaller than 100 μm. 5 . The electrostatic chuck according to claim 1 , wherein the joining layer is a layer generated by curing a silicone adhesive.
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