Resin comprising poly(lactic acid-b-3-hydroxypropionic acid) block copolymer, and resin composition and resin molded product comprising same

Patent metadata

Field	Value
Publication number	US-2024343862-A1
Application number	US-202318681562-A
Country	US
Kind code	A1
Filing date	Jan 30, 2023
Priority date	Jan 28, 2022
Publication date	Oct 17, 2024
Grant date	—

Abstract

The present specification relates to a resin including a poly (lactic acid-b-3-hydroxypropionic acid) block co-polymer, a resin composition including the same, and a resin molded article.

First claim

1 . A resin comprising a poly(lactic acid-b-3-hydroxypropionic acid) block co-polymer,
wherein the resin includes a crystalline part, wherein the crystalline part includes a crystalline layer, and wherein the crystalline layer has a thickness of 1.0 nm to 14.0 nm.

2 . The resin of claim 1 , wherein the resin has a molecular weight of 50,000 g/mol to 500,000 g/mol.

3 . The resin of claim 1 , wherein the resin has Young's modulus of 0.1 GPa to 5.0 GPa.

4 . The resin of claim 1 , comprising:
10% by weight to 30% by weight of poly(3-hydroxypropionic acid) and 90% by weight to 70% by weight of polylactic acid.

5 . A resin composition comprising the resin of claim 1 .

6 . The resin composition of claim 5 , wherein the resin composition is for a soft packaging material, and wherein the resin has a crystalline layer thickness of 1.0 nm to 5.0 nm.

7 . The resin composition of claim 5 , wherein the resin composition is for a hard packaging material, and wherein the resin has a crystalline layer thickness of 5.0 nm to 14.0 nm.

8 . The resin composition of claim 5 , further comprising an additive.

9 . The resin composition of claim 8 , wherein the additive is biodegradable.

10 . A resin molded article comprising the resin composition of claim 5 .

11 . The resin molded article of claim 10 , wherein the resin molded article is for a soft packaging material, and wherein the resin has a crystalline layer thickness of 1.0 nm to 5.0 nm.

12 . The resin molded article of claim 10 , wherein the resin molded article is for a hard packaging material, and wherein the resin has a crystalline layer thickness of 5.0 nm to 14.0 nm.

13 . The resin molded article of claim 10 , wherein the resin molded article is selected from the group consisting of injection molded articles, extrusion molded articles, blow molded articles, films, fibers and sheets.

14 . A soft packaging material comprising the resin composition of claim 5 .

15 . The soft packaging material of claim 14 , wherein the soft packaging material is selected from the group consisting of films for protecting displays, films for attaching windows, films for window envelopes, films for food packaging, bags, industrial packaging films and agricultural films.

16 . A hard packaging material comprising the resin composition of claim 5 .

17 . The hard packaging material of claim 16 , wherein the hard packaging is selected from the group consisting of disposable cups, food packaging containers, easy peel packaging and egg packs.

Assignees

• Lg Chemical Ltd

Inventors

• Kim Yeonsoo
• Lee Chaegyu
• Lee Myunghan
• Kim Chul Woong
• Lee Jeongyong
• Choi Jung Yun
• Cho Suhyun
• Jeong So Dam

Classifications

• C08G2250/00

  Compositions for preparing crystalline polymers · CPC title

• C08G2230/00

  Compositions for preparing biodegradable polymers · CPC title

• C08G63/912 Primary

  derived from hydroxycarboxylic acids · CPC title

• Y02W90/10

  Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics · CPC title

• C08G63/08 Primary

  Lactones or lactides · CPC title