Metal-resin composite, surface treatment method, and substrate of circuit board for high-frequency and high-speed signal transmission

Patent metadata

Field	Value
Publication number	US-2024342968-A1
Application number	US-202418632326-A
Country	US
Kind code	A1
Filing date	Apr 11, 2024
Priority date	Apr 12, 2023
Publication date	Oct 17, 2024
Grant date	—

Abstract

A metal-resin composite, a surface treatment method, and a substrate of a printed circuit board (PCB) for high-frequency and high-speed signal transmission comprise a surface-treated metal, and the surface-treated metal includes a nano-scale pore array that is used for filling of a resin and vertically extends from a surface to an interior of a metal, where nano-scale pillars are provided to extend from bottoms to openings of nano-scale pores of the nano-scale pore array. The pillar-in-pore structure makes a resin entering a nano-scale pore have an ultra-high anchoring effect on a resin body outside the nano-scale pore. Therefore, on the premise of not using an additive such as a T liquid or a coupling agent, the present disclosure greatly improves a tensile bonding strength at an interface between a resin body and a metal substrate, and also eliminates a decline in an interfacial bonding strength of a composite.

First claim

1 . A surface-treated metal for metal-resin bonding, wherein a nano-scale pore array for filling of a resin is provided to extend from a surface to an interior of a metal, and nano-scale pillars are provided to extend from bottoms to openings of some or all of nano-scale pores of the nano-scale pore array;
the nano-scale pores each have a depth of 20 nm to 10 μm and a pore size of 20 nm to 1 μm; the nano-scale pillars each have a length of 10 nm to 9.9 μm and a diameter of 20 nm to 950 nm; the surface of the metal has a porosity of 0.1 to 0.9; the nano-scale pillars have a same chemical composition as walls of the nano-scale pores; a material for the walls of the nano-scale pores is a metal oxide; an included angle between a central axis of each of the nano-scale pores and the surface of the metal is 60° to 90°; an included angle between each of the nano-scale pillars and a central axis of a corresponding nano-scale pore is 0° to 30°; the nano-scale pores provided with the nano-scale pillars account for 10% to 100% of all the nano-scale pores on the surface of the metal; and the metal is selected from a group consisting of aluminum, magnesium, copper, titanium, iron, zinc, and an alloy thereof; and the resin is selected from a group consisting of a thermoplastic resin and a thermosetting resin.

2 . The surface-treated metal for metal-resin bonding according to claim 1 , wherein a diameter ratio of the nano-scale pillars to the nano-scale pores is 0.1 to 0.9, and a ratio of the length of the nano-scale pillars to the depth of the nano-scale pores is 0.15 to 0.95.

3 . A manufacturing method of the surface-treated metal for metal-resin bonding according to claim 1 , wherein the metal is aluminum or an aluminum alloy, and the manufacturing method comprises the following steps:
S1: cleaning a surface of an original metal to obtain a first metal intermediate, and placing the first metal intermediate as a first anode in an electrolytic cell for polishing to obtain a second metal intermediate; S2: placing the second metal intermediate as a second anode in a first acidic solution, and conducting anodic oxidation at a voltage of 10 V to 100 V and a temperature of −10° C. to 30° C. for 3 min to 300 min to obtain a third metal intermediate, wherein the first acidic solution comprises 0.1 wt % to 25 wt % of one or more acids selected from a group consisting of sulfuric acid, phosphoric acid, oxalic acid, chromic acid, boric acid, benzoic acid, citric acid, and tartaric acid, and a solvent of the first acidic solution is pure water or a water-ethylene glycol mixed solvent comprising 0.1 wt % to 80 wt % of ethylene glycol; and a current density for the anodic oxidation is less than 1.5 mA/cm 2 ; S3: soaking the third metal intermediate in a second acidic solution 1 time to 20 times for 1 min to 90 min each time to allow pore expansion to obtain a fourth metal intermediate, wherein the second acidic solution comprises 0.1 wt % to 25 wt % of one or more acids selected from the group consisting of sulfuric acid, phosphoric acid, oxalic acid, chromic acid, boric acid, benzoic acid, citric acid, and tartaric acid, and has a strong acidity, but exhibits a weak dissolution-oxidation ability for a metal oxide; a temperature of the second acidic solution is maintained at 0° C. to 100° C.; and a metal product obtained after the soaking each time is washed with water and then blow-dried with cold air; and S4: rinsing and oven-drying the fourth metal intermediate.

4 . The manufacturing method of the surface-treated metal for metal-resin bonding according to claim 3 , wherein after the S1 and before the S2, the manufacturing method further comprises the following steps sequentially:
S2-0: placing the second metal intermediate as a third anode in a third acidic solution, and conducting anodic pre-oxidation at a voltage of 30 V to 80 V and a temperature of 0° C. to 50° C. for 10 min to 60 min to obtain a fifth metal intermediate, wherein the third acidic solution comprises 0.1 wt % to 25 wt % of one or more acids selected from the group consisting of sulfuric acid, phosphoric acid, oxalic acid, chromic acid, boric acid, benzoic acid, citric acid, and tartaric acid, and a solvent of the third acidic solution is pure water or a water-ethylene glycol mixed solvent comprising 0.1 wt % to 80 wt % of ethylene glycol; and S2-1: soaking the fifth metal intermediate in a mixed acid solution 1 to 20 times for 1 min to 3 min each time to partially or completely remove a porous alumina layer formed after the anodic pre-oxidation, wherein the mixed acid solution comprises 1 wt % to 10 wt % of chromic acid and 5 wt % to 60 wt % of phosphoric acid; a temperature of the mixed acid solution is maintained at 10° C. to 100° C.; and a metal product obtained after the soaking each time is washed with water and then blow-dried with cold air.

5 . A metal-resin composite, comprising the surface-treated metal for metal-resin bonding according to claim 1 and a resin located on the surface and filled in the nano-scale pores in the nano-scale pore array of the metal,
wherein the resin is a single resin or a resin composition; and
the resin comprises a host resin, and comprises or does not comprise a reinforcing material.

6 . A manufacturing method of the metal-resin composite according to claim 5 , comprising the following steps:
S1: pretreating a surface of a metal to form a nano-scale pore structure for injection molding on the surface of the metal to obtain the surface-treated metal; S2: placing the surface-treated metal in a mold, setting a temperature of the mold to be higher than a glass transition temperature of the resin and lower than a melting temperature of the resin, and injecting the resin into the mold such that the resin is bonded with the surface-treated metal to produce an initial metal-resin composite, wherein a pressure-holding time is 5 s to 20 s; and S3: allowing the initial metal-resin composite in the mold to be cooled at a cooling rate of higher than 100° C./s from an original temperature to a final temperature 20° C. lower than the glass transition temperature of the resin, and demolding.

7 . A substrate of a printed circuit board for high-frequency and high-speed signal transmission, comprising the metal-resin composite according to claim 5 .

8 . A metal-resin composite, comprising the surface-treated metal for metal-resin bonding according to claim 2 and a resin located on the surface and filled in the nano-scale pores in the nano-scale pore array of the metal,
wherein the resin is a single resin or a resin composition; and
the resin comprises a host resin, and comprises or does not comprise a reinforcing material.

Assignees

• Nanjing University
• Jiangsu Hhck Advanced Mat Co Ltd

Inventors

• Chen Wei
• Xue Qi
• Zhuang Huijie
• Li Linling
• Han Jianglong
• Zhou Dongshan
• Wang Xiaoliang

Classifications

• C25D11/246

  for sealing layers · CPC title

• C25D11/10

  containing organic acids · CPC title

• C25D11/04

  of aluminium or alloys based thereon · CPC title

• C25D11/34

  of metals or alloys not provided for in groups C25D11/04 - C25D11/32 · CPC title

• C25D11/18

  After-treatment, e.g. pore-sealing · CPC title