Manufacturing method of molded-forming power inductor
US-2024412920-A1 · Dec 12, 2024 · US
US2024331911A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024331911-A1 |
| Application number | US-202418404288-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 4, 2024 |
| Priority date | Mar 30, 2023 |
| Publication date | Oct 3, 2024 |
| Grant date | — |
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A multilayer coil component includes an element body, a coil disposed in the element body, terminal electrodes disposed in the element body, and a first connection conductor and a second connection conductor that connect the coil and the terminal electrodes. A plurality of first pores are provided in the coil, a plurality of second pores are provided in the first connection conductor and the second connection conductor, and an area of the second pore per unit area in the first connection conductor and the second connection conductor is larger than an area of the first pore per unit area in the coil.
Opening claim text (preview).
What is claimed is: 1 . A coil component comprising: an element body; a coil disposed in the element body; a terminal electrode disposed in the element body; and a connection conductor connecting the coil and the terminal electrode, wherein a plurality of first holes are provided in the coil, a plurality of second holes are provided in the connection conductor, and an area of the second hole per unit area in the connection conductor is larger than an area of the first hole per unit area in the coil. 2 . The coil component according to claim 1 , wherein an average size of the second holes per unit area in the connection conductor is larger than an average size of the first holes per unit area in the coil. 3 . The coil component according to claim 1 , wherein resin is disposed in at least a part of the second holes. 4 . The coil component according to claim 1 , wherein, in the connection conductor, the second holes are disposed in a central region inside a surface of the connection conductor.
Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields · CPC title
Coils; Windings; Conductive connections · CPC title
Terminals; Tapping arrangements {for signal inductances} · CPC title
with encapsulating core, e.g. made of resin and magnetic powder · CPC title
Surface mounted devices · CPC title
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