High-performance stress buffer die-coat and devices and processes implementing the same

Patent metadata

Field	Value
Publication number	US-2024321663-A1
Application number	US-202318187924-A
Country	US
Kind code	A1
Filing date	Mar 22, 2023
Priority date	Mar 22, 2023
Publication date	Sep 26, 2024
Grant date	—

Abstract

A device may include device parts, a composite coating material arranged on one or more of the device parts, and a molding compound arranged on and/or around one or more of the device parts. Moreover, the device may include where the composite coating material may include a polymer matrix including and/or incorporating ceramic particles.

First claim

1 . A device comprising:
device parts; a composite coating material arranged on one or more of the device parts; and a molding compound arranged on and/or around one or more of the device parts, wherein the composite coating material comprises a polymer matrix including and/or incorporating ceramic particles.

2 . The device according to claim 1 wherein the molding compound is further arranged on one or more of the device parts implemented without the composite coating material coated thereon.

3 . The device according to claim 1 wherein the device parts comprise one or more of a first lead, a second lead, at least one device component, a mount, at least one interconnect, a component attach, and/or at least one connection.

4 . The device according to claim 1 wherein the device parts comprise at least one lead frame.

5 . The device according to claim 1 wherein the composite coating material is arranged on all exposed surfaces of one or more of the device parts.

6 . The device according to claim 1 wherein the composite coating material is arranged on surfaces of one or more of the device parts that contact the molding compound.

7 . The device according to claim 1 wherein the composite coating material is formulated and/or configured to reduce failures of the device parts associated with interfacial stress exhibited during high temperature operation of the device.

8 . The device according to claim 1 wherein the polymer matrix comprises a polyimide, a silicon, a fluoropolymer, and/or copolymers of a polyimide-silicon.

9 . The device according to claim 1 wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the hexagonal boron-nitride (h-BN) particles comprise 5 nm to 5 μm sized h-BN particles.

10 . The device according to claim 1 wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the hexagonal boron-nitride (h-BN) particles comprise a filler within the composite coating material.

11 . The device according to claim 1 wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the hexagonal boron-nitride (h-BN) particles comprise h-BN in forms of h-BN nano-particles, h-BN microparticles, h-BN nanotubes (NT), and/or h-BN pallets.

12 . The device according to claim 1 wherein the composite coating material comprises a dispensed coating on one or more of the device parts.

13 . The device according to claim 1 wherein the composite coating material comprises an inkjet coating on one or more of the device parts.

14 . The device according to claim 1 wherein the composite coating material comprises a spray coating on one or more of the device parts.

15 . The device according to claim 1 wherein the composite coating material comprises a screen printed coating on one or more of the device parts.

16 . The device according to claim 1 wherein the composite coating material comprises a cured coating on one or more of the device parts.

17 . The device according to claim 1 wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the composite coating material comprises a mixture of at least the hexagonal boron-nitride (h-BN) particles and the polymer matrix.

18 . The device according to claim 1 wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the composite coating material comprises a mixture of at least the hexagonal boron-nitride (h-BN) particles and the polymer matrix together with other fillers.

19 . The device according to claim 1 wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the hexagonal boron-nitride (h-BN) particles comprise a surface functionalization.

20 . The device according to claim 1 wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the hexagonal boron-nitride (h-BN) particles are grafted to the polymer matrix.

21 . The device according to claim 1 wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the hexagonal boron-nitride (h-BN) particles comprise surface functionalization and the hexagonal boron-nitride (h-BN) particles are grafted to the polymer matrix.

22 . The device according to claim 3 wherein the at least one device component comprises one or more MOSFETs and/or diodes.

23 . The device according to claim 3 wherein the at least one device component comprises one or more active devices, passive devices, dies, chips, and/or transistors.

24 . The device according to claim 3 wherein the at least one interconnect comprises one or more wires, wire bonds, and/or leads.

25 . The device according to claim 1 wherein the device comprises a package, a power device package, and/or a power module.

26 . A process of manufacturing a device comprising:
providing device parts; arranging a composite coating material on one or more of the device parts; and arranging a molding compound on and/or around one or more of the device parts, wherein the composite coating material comprises a polymer matrix including and/or incorporating ceramic particles.

27 .- 36 . (canceled)

37 . The process of manufacturing a device according to claim 26 further comprising dispensing the composite coating material on one or more of the device parts to form a dispensed coating on one or more of the device parts.

38 . The process of manufacturing a device according to claim 26 further comprising ink jetting the composite coating material on one or more of the device parts to form an inkjet coating on one or more of the device parts.

39 . The process of manufacturing a device according to claim 26 further comprising spray coating the composite coating material on one or more of the device parts to form a spray coating on one or more of the device parts.

40 . The process of manufacturing a device according to claim 26 further comprising screen printing the composite coating material on one or more of the device parts to form a screen printed coating on one or more of the device parts.

41 . The process of manufacturing a device according to claim 26 further comprising curing the composite coating material on one or more of the device parts to form a cured coating on one or more of the device parts.

42 .- 43 . (canceled)

44 . The process of manufacturing a device according to claim 26 wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and the process further comprising processing the hexagonal boron-nitride (h-BN) particles to form a surface functionalization.

45 . The process of manufacturing a device according to claim 26 wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and the process further comprising grafting the hexagonal boron-nitride (h-BN) particles to the polymer matrix.

46 . The process of manufacturing a device according to claim 26 wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and the process further comprising:
processing the hexagonal boron-nitride (h-BN) particles to form a surface functionalization; and
grafting the hexagonal

Assignees

• Wolfspeed Inc

Inventors

• Dadvand Afshin
• Balaraman Dev

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/476

  Organic materials comprising silicon · CPC title

• H10W74/43

  comprising oxides, nitrides or carbides, e.g. ceramics or glasses · CPC title

• H10W74/016

  using moulds · CPC title