Electronic device

US2024312375A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2024312375-A1
Application numberUS-202418671953-A
CountryUS
Kind codeA1
Filing dateMay 22, 2024
Priority dateApr 19, 2018
Publication dateSep 19, 2024
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present disclosure provides an electronic device including a substrate, a plurality of bumps, a plurality of diodes, and a shielding layer. The substrate has a plurality of first through holes. The bumps are disposed on the substrate. The diodes are disposed on the substrate. The shielding layer is disposed on the substrate. One of the bumps is located between two adjacent ones of the diodes in a cross-sectional view, and the shielding layer overlaps at least a portion of the bumps and at least a portion of the first through holes.

First claim

Opening claim text (preview).

What is claimed is: 1 . An electronic device, comprising: a substrate having a plurality of first through holes; a plurality of bumps disposed on the substrate; a plurality of diodes disposed on the substrate; and a shielding layer disposed on the substrate; wherein one of the plurality of bumps is located between two adjacent ones of the plurality of diodes in a cross-sectional view, and the shielding layer overlaps at least a portion of the plurality of bumps and at least a portion of the plurality of first through holes. 2 . The electronic device as claimed in claim 1 , wherein the shielding layer covers the at least a portion of the plurality of bumps and the at least a portion of the plurality of first through holes. 3 . The electronic device as claimed in claim 1 , wherein in a top view, a portion of the shielding layer is located between the two adjacent ones of the plurality of diodes. 4 . The electronic device as claimed in claim 1 , wherein in the cross-sectional view, the shielding layer comprises a first part and a second part located at two opposite sides of one of the plurality of diodes, and a spacing between the first part and the second part of the shielding layer is different from a spacing between the two adjacent ones of the plurality of first through holes. 5 . The electronic device as claimed in claim 1 , wherein the substrate comprises a second through hole, and a width of one of the plurality of first through holes is different from a width of the second through hole. 6 . The electronic device as claimed in claim 1 , further comprising a circuit layer, wherein the circuit layer comprises a first part disposed on a first surface of the substrate, and a second part disposed on a second surface of the substrate, and the second surface is opposite to the first surface. 7 . The electronic device as claimed in claim 6 , further comprising a driving unit disposed on the second part of the circuit layer. 8 . The electronic device as claimed in claim 6 , wherein the shielding layer is disposed on the first part of the circuit layer.

Assignees

Inventors

Classifications

  • Package configurations · CPC title

  • Active-matrix LED displays · CPC title

  • Package substrates, e.g. submounts · CPC title

  • Interconnections (of active-matrix LED displays H10H29/49) · CPC title

  • H05K1/028Primary

    Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

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Frequently asked questions

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What does patent US2024312375A1 cover?
The present disclosure provides an electronic device including a substrate, a plurality of bumps, a plurality of diodes, and a shielding layer. The substrate has a plurality of first through holes. The bumps are disposed on the substrate. The diodes are disposed on the substrate. The shielding layer is disposed on the substrate. One of the bumps is located between two adjacent ones of the diode…
Who is the assignee on this patent?
Innolux Corp
What technology area does this patent fall under?
Primary CPC classification H05K1/028. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Sep 19 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).