Dielectric Thermal Management Fluids and Methods for Using Them
US-2024191119-A1 · Jun 13, 2024 · US
US2024301315A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024301315-A1 |
| Application number | US-202218546460-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 21, 2022 |
| Priority date | Apr 26, 2021 |
| Publication date | Sep 12, 2024 |
| Grant date | — |
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Heat transfer fluids corresponding to mixtures of at least one hydrogen bond donor and at least one hydrogen bond acceptor are provided. The heat transfer fluids can have an unexpectedly high heat capacity relative to the expected heat capacity based on the heat capacities of the at least one hydrogen bond donor and the at least one hydrogen bond acceptor. In some aspects, the heat transfer fluids can also have a sufficiently high electrical resistivity to be suitable for use in environments such as heat management systems in electric vehicles.
Opening claim text (preview).
1 . A heat transfer fluid, comprising: 10 wt % to 90 wt %, relative to a weight of the heat transfer fluid, of at least one hydrogen bond donor having a molecular weight of 60 g/mol or more and a first heat capacity, the at least one hydrogen bond donor comprising 1.0 wt % or more of hydrogen bond donor functional groups relative to the molecular weight of the at least one hydrogen bond donor; 10 wt % to 90 wt %, relative to a weight of the heat transfer fluid, of at least one hydrogen bond acceptor having a molecular weight of 60 g/mol or more and a second heat capacity, the at least one hydrogen bond acceptor comprising 1.0 wt % or more of hydrogen bond acceptor functional groups relative to the molecular weight of the at least one hydrogen bond acceptor; and an electrical conductivity of the heat transfer fluid being 2.0 μS/cm or less, wherein, a) the hydrogen bond donor does not contain hydrogen bond acceptor functional groups, or b) the hydrogen bond donor comprises one or more hydrogen bond acceptor functional groups, and 10 wt % or more of the hydrogen bond acceptor functional groups in the hydrogen bond acceptor, relative to the molecular weight of the hydrogen bond acceptor, are different from the hydrogen bond acceptor functional groups in the hydrogen bond donor. 2 . The heat transfer fluid of any of the above claims , wherein a combined weight of the at least one hydrogen bond donor and the at least one hydrogen bond acceptor comprises 40 wt % or more of a weight of the heat transfer fluid. 3 . The heat transfer fluid of any of the above claims , wherein a weight of hydrogen bond donor functional groups of the at least one hydrogen bond donor comprises 5 wt % or more (or 10 wt % or more) of the molecular weight of the at least one hydrogen bond donor, and wherein a weight of hydrogen bond acceptor functional groups of the at least one hydrogen bond acceptor comprises 5 wt % or more (or 10 wt % or more) of the molecular weight of the at least one hydrogen bond acceptor. 4 . The heat transfer fluid of any of the above claims , wherein 70 wt % or more of a combined weight of the at least one hydrogen bond donor and the at least one hydrogen bond acceptor comprises C 5+ compounds, relative to the combined weight of the at least one hydrogen bond donor and the at least one hydrogen bond acceptor. 5 . The heat transfer fluid of any of the above claims , wherein the at least one hydrogen bond donor comprises a melting point of −50° C. or lower, or wherein the at least one hydrogen bond acceptor comprises a melting point of −50° C. or lower, or a combination thereof. 6 . The heat transfer fluid of any of the above claims , wherein the heat transfer fluid is substantially free of water. 7 . The heat transfer fluid of any of the above claims , i) wherein the at least one hydrogen bond donor comprises an alcohol; ii) wherein the at least one hydrogen bond acceptor comprises an ether, an ester, a ketone, an aldehyde, a phosphite ester, a phosphate ester, or a combination thereof; or iii) a combination of i) and ii). 8 . The heat transfer fluid of any of the above claims , wherein the at least one hydrogen bond donor comprises a boiling point of 120° C. or more, or wherein the at least one hydrogen bond acceptor comprises a boiling point of 120° C. or more, or a combination thereof. 9 . The heat transfer fluid of any of the above claims , wherein the at least one hydrogen bond donor comprises a boiling point between 300° C. to 565° C., or wherein the at least one hydrogen bond acceptor comprises a boiling point between 300° C. to 565° C., or a combination thereof. 10 . The heat transfer fluid of any of the above claims , wherein the hydrogen bond donor comprises a molecular weight of 87 g/mol or more, or wherein the heat transfer fluid comprises a kinematic viscosity at 100° C. of 0.5 cSt to 25.0 cSt, or a combination thereof. 11 . The heat transfer fluid of any of the above claims , wherein a heat capacity of the heat transfer fluid at a temperature between 0° C. and 150° C. is greater than the first heat capacity at the temperature between 0° C. to 150° C. by 5.0% or more relative to the first heat capacity, and the heat capacity of the heat transfer fluid at the temperature between 0° C. and 150° C. is greater than the second heat capacity at the temperature between 0° C. to 150° C. by 5% or more relative to the second heat capacity. 12 . A method for using a heat transfer fluid comprising: circulating a heat transfer fluid according to any of claims 1-11 in a heat transfer system. 13 . The method of claim 12 , wherein the heat transfer system comprises a system for circulating a lubricant. 14 . The method of claim 12 or 13 , wherein the heat transfer fluid is circulated in the heat transfer system at a temperature between −40° C. and 150° C., or wherein the heat transfer fluid is circulated in the heat transfer system at a temperature between 0° C. and 100° C.
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