Electronic apparatus

Patent metadata

Field	Value
Publication number	US-2024297168-A1
Application number	US-202418663100-A
Country	US
Kind code	A1
Filing date	May 14, 2024
Priority date	Jul 29, 2019
Publication date	Sep 5, 2024
Grant date	—

Abstract

The disclosure provides an electronic apparatus. The electronic apparatus includes an insulator, a driving unit, an electronic unit, and a circuit unit. The driving unit is overlapped with the insulator. The electronic unit is overlapped with the insulator. The circuit unit is electrically connected to the driving unit. The driving unit receives a signal from the circuit unit and drives the electronic unit.

First claim

What is claimed is:

1 . An electronic apparatus, comprising:
an insulator; a driving unit, overlapped with the insulator; an electronic unit, overlapped with the insulator; and a circuit unit, electrically connected to the driving unit, wherein the driving unit receives a signal from the circuit unit and drives the electronic unit.

2 . The electronic apparatus of claim 1 , wherein the electronic unit is an integrated circuit.

3 . The electronic apparatus of claim 1 , wherein the electronic unit is a diode.

4 . The electronic apparatus of claim 3 , wherein the electronic unit is a light emitting diode.

5 . The electronic apparatus of claim 1 , wherein the electronic unit is a PN junction assembly.

6 . The electronic apparatus of claim 5 , wherein the PN junction assembly comprises a variable capacitor.

7 . The electronic apparatus of claim 1 , wherein the driving unit comprises a glass substrate and at least one transistor, wherein the at least one transistor is disposed on the glass substrate.

8 . The electronic apparatus of claim 1 , wherein the driving unit and the electronic unit are disposed on a same surface of the insulator.

9 . The electronic apparatus of claim 1 , wherein the driving unit is disposed on a first surface of the insulator, the electronic unit is disposed on a second surface of the insulator, and the first surface is different from the second surface.

10 . The electronic apparatus of claim 9 , wherein the first surface is opposite to the second surface.

11 . The electronic apparatus of claim 9 , wherein the driving unit is electrically connected to the electronic unit via a conductor disposed in the insulator.

12 . The electronic apparatus of claim 1 , wherein the circuit unit is a chip.

Assignees

• Innolux Corp

Inventors

• Hung Tang Chin
• Ting Chin-Lung
• Wei Chung-Kuang
• Kao Ker-Yih
• Wang Tong-Jung
• Hsieh Chih-Yung
• Huang Hao Jung
• Li I-Yin
• Ho Chia-Chi
• Lin Yi Hung
• Chou Cheng-Hsu
• Tseng Chia-Ping

Classifications

• H10W70/614

  the multiple chips being integrally enclosed · CPC title

• H10W90/10

  Configurations of laterally-adjacent chips · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W70/611 Primary

  for connecting multiple chips together · CPC title

• H10W20/496

  Capacitor integral with wiring layers · CPC title