Immersion-type liquid cooling heat dissipation structure

Patent metadata

Field	Value
Publication number	US-2024295371-A1
Application number	US-202418646715-A
Country	US
Kind code	A1
Filing date	Apr 25, 2024
Priority date	May 8, 2022
Publication date	Sep 5, 2024
Grant date	—

Abstract

An immersion-type liquid cooling heat dissipation structure is provided. The immersion-type liquid cooling heat dissipation structure includes a metal heat dissipation substrate layer and a metal film layer. The metal film layer is formed on a surface of the metal heat dissipation substrate layer, and is configured to be immersed in an immersion-type coolant. An effective thickness of the metal film layer is less than 500 μm. A surface of the metal film layer has a plurality of micropores that facilitate generation of vapor bubbles. An effective width of each of the plurality of micropores is between 1 μm and 200 μm, and a depth of each of the plurality of micropores is between 100 nm and 50 μm.

First claim

What is claimed is:

1 . An immersion-type liquid cooling heat dissipation structure, comprising:
a metal heat dissipation substrate layer; and a metal film layer; wherein the metal film layer is formed on a surface of the metal heat dissipation substrate layer, and is configured to be immersed in an immersion-type coolant; wherein an effective thickness of the metal film layer is less than 500 μm; wherein at least a surface of the metal film layer has a plurality of micropores, an effective width of each of the plurality of micropores is between 1 μm and 200 μm, and a depth of each of the plurality of micropores is between 100 nm and 50 μm; wherein the plurality of micropores are recessed from the surface of the metal film layer into the surface of the metal heat dissipation substrate layer, and at least some of the plurality micropores are in air communication with one another through the metal heat dissipation substrate layer, so as to increase an amount of bubbles that are generated through the plurality of micropores.

2 . The immersion-type liquid cooling heat dissipation structure according to claim 1 , wherein the at least some of the plurality of micropores are in air communication with one another through at least one channel that is formed by at least some of a plurality of inner holes of the metal heat dissipation substrate layer.

3 . The immersion-type liquid cooling heat dissipation structure according to claim 2 , wherein each of the plurality of inner holes is formed as a primary structure in the metal heat dissipation substrate when the metal heat dissipation substrate is formed.

4 . The immersion-type liquid cooling heat dissipation structure according to claim 2 , wherein each of the plurality of inner holes is formed as a secondary structure in the metal heat dissipation substrate by a secondary process after the metal heat dissipation substrate is formed.

5 . The immersion-type liquid cooling heat dissipation structure according to claim 2 , wherein a diameter of each of the plurality of inner holes formed in the metal heat dissipation substrate layer is between 5 μm and 50 μm.

6 . The immersion-type liquid cooling heat dissipation structure according to claim 1 , wherein the metal heat dissipation substrate layer is made of copper, aluminum, copper alloy, or aluminum alloy.

7 . The immersion-type liquid cooling heat dissipation structure according to claim 6 , wherein the metal heat dissipation substrate layer is formed by forging, casting, or joining of multiple metal members.

8 . The immersion-type liquid cooling heat dissipation structure according to claim 1 , wherein the metal film layer is made of nickel, copper, silver, zinc, titanium, iron, or alloys thereof.

9 . The immersion-type liquid cooling heat dissipation structure according to claim 8 , wherein the metal film layer is formed on the surface of the metal heat dissipation substrate layer by a wet process or a dry process.

10 . The immersion-type liquid cooling heat dissipation structure according to claim 9 , wherein each of the plurality of micropores is formed as a primary structure on the surface of the metal film layer when the metal film layer is formed.

11 . The immersion-type liquid cooling heat dissipation structure according to claim 9 , wherein each of the plurality of micropores is formed as a secondary structure on the surface of the metal film layer by a secondary process after the metal film layer is formed.

12 . The immersion-type liquid cooling heat dissipation structure according to claim 9 , wherein each of the plurality of micropores formed on the surface of the metal film layer has a primary structure micropore formed by a primary process and being randomly distributed, and a secondary structure micropore formed by a secondary process and not being randomly distributed.

Assignees

• Amulaire Thermal Tech Inc

Inventors

• Lee Kuo-Wei
• Yang Ching-Ming
• Chen Chi-An
• Yeh Tze-Yang

Classifications

• H05K7/203

  by immersion · CPC title

• F28D2021/0029

  Heat sinks · CPC title

• F28D1/02

  with heat-exchange conduits immersed in the body of fluid · CPC title

• F28F13/187 Primary

  especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites · CPC title

• H05K7/20236

  by immersion · CPC title